Flexible and stretchable circuit technologies for space applications

Flexible and stretchable circuit technologies offer reduced volume and weight, increased electrical performance, larger design freedom and improved interconnect reliability. All of these advantages are appealing for space applications. In this paper, two example technologies, the ultra-thin chip package (UTCP) and stretchable moulded interconnect (SMI), are described. The UTCP technology results in a 60 µm thick chip package, including the embedding of a 20 µm thick chip, laser or protolithic via definition to the chip contacts and application of fan out metallization. Imec’s stretchable interconnect technology is inspired by conventional rigid and flexible printed circuit board (PCB) technology. Stretchable interconnects are realized by copper meanders supported by a flexible material e.g. polyimide. Elastic materials, predominantly silicone rubbers, are used to embed the conductors and the components, thus serving as circuit carrier. The possible advantages of these technologies with respect to space applications are discussed

Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system

A comfortable, wearable wireless ECG monitoring system is proposed. The device is realized using the combination of two proprietary advanced technologies for electronic packaging and interconnection : the UTCP (Ultra-Thin Chip Package) technology and the SMI (Stretchable Mould Interconnect) technology for elastic and stretchable circuits. Introduction of these technologies results in small fully functional devices, exhibiting a significant increase in user comfort compared to devices fabricated with more conventional packaging and interconnection technologies

Flexible and stretchable electronics for wearable healthcare

Measuring the quality of human health and well-being is one of the key growth areas in our society. Preferably, these measurements are done as unobtrusive as possible. These sensoric devices are then to be integrated directly on the human body as a patch or integrated into garments. This requires the devices to be very thin, flexible and sometimes even stretchable. An overview will be given of recent technology developments in this domain and concrete application examples will be shown

Thermo-mechanical analysis of flexible and stretchable systems

This paper presents a summary of the modeling and technology developed for flexible and stretchable electronics. The integration of ultra thin dies at package level, with thickness in the range of 20 to 30 μ m, into flexible and/or stretchable materials are demonstrated as well as the design and reliability test of stretchable metal interconnections at board level are analyzed by both experiments and finite element modeling. These technologies can achieve mechanically bendable and stretchable subsystems. The base substrate used for the fabrication of flexible circuits is a uniform polyimide layer, while silicones materials are preferred for the stretchable circuits. The method developed for chip embedding and interconnections is named Ultra Thin Chip Package (UTCP). Extensions of this technology can be achieved by stacking and embedding thin dies in polyimide, providing large benefits in electrical performance and still allowing some mechanical flexibility. These flexible circuits can be converted into stretchable circuits by replacing the relatively rigid polyimide by a soft and elastic silicone material. We have shown through finite element modeling and experimental validation that an appropriate thermo mechanical design is necessary to achieve mechanically reliable circuits and thermally optimized packages

Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections

A technology is presented for the production of soft and rigid circuits with an arbitrary 2.5D fixed shape. The base of this technology is our proprietary technology for elastic circuits with a random shape, in which the elastic thermoset (mostly PDMS) polymer is now replaced by soft or rigid thermoplastic variants. An additional thermoforming step is required to transform the circuit from its initial flat to its final fixed 2.5D shape, but for rigid fixed shape circuits only one-time stretchability of the extensible interconnects is required, relieving the reliability requirements

Mechanical analysis of encapsulated metal interconnects under transversal load

Novel insights regarding the ability of encapsulated metal interconnections to deform due to bending are presented. Encapsulated metal interconnections are used as electric conductor or measurement system within a wide range of applications fields, e.g. biomedical, wearable, textile applications. Nevertheless the mechanical analysis remains limited to reliability investigation of these configurations. Different papers and research groups claim that meander-shaped metal interconnections are predisposed for these applications fields due to their deformability while, to the author’s knowledge, no reports are found about this ability. An analysis based on the work needed to bend interconnections to a certain curvature will be used to compare different interconnection configurations with each other. The experimental as well as the simulation setup is based on PDMS encapsulated PI-enhanced Cu tracks. The results and conclusions are specific for this type of interconnections, but can be extended to a global conclusion about stretchable interconnections. From the obtained insights it is proven that periodically meander-shaped interconnections need significant less work, up to more than 10 times less, to bend the interconnection to the same curvature compared to straight interconnection lines. Furthermore it shows out, for the meander-shaped interconnection, that per increase of 250µm encapsulation thickness the work raises with a factor 2. For straight interconnection lines the work in function of the encapsulation thickness is limited to 20%/250µm. The bendability of the straight interconnection lines is determined by the shape of the interconnection, where for meandered tracks the encapsulation will determine this factor, for an encapsulation thickness of maximum 1mm. For encapsulations > 1mm, the encapsulation thickness will become the predominant factor which determines the deformability for both interconnection shapes

Deformable microsystem for in situ cure degree monitoring of GFRP(Glass Fibre Reinforced Plastic)

Fibre Reinforced Polymer (FRP) is becoming a valid alternative to many traditional heavy metal industries because of its high specific stiffness over the more classical construction metals. Recent trend of more complex geometry of composites is causing increasing difficulty in composite manufacturing. A method to optimize the manufacturing process is thus imposed to ensure and improve the quality of manufactured parts. Because of the irregular 3D shapes of the composites, traditional flat sensor system is becoming unfavorable and nonpractical for monitoring purpose. In this work, the current development status of a deformable microsystem for in situ cure degree monitoring of a glass fibre reinforced plastic is presented. To accommodate the non-flat shape of the composites, the proposal is to interconnect non-deformable functional island, which contains the capacitive sensor for cure degree monitoring, with meander-shaped deformable interconnections. The developed sensor system is able to withstand the manufacturing process where change of pressure and internal strain, thus force exerted on the sensor system, is involved

Monitoring of the central blood pressure waveform via a conformal ultrasonic device.

Continuous monitoring of the central-blood-pressure waveform from deeply embedded vessels, such as the carotid artery and jugular vein, has clinical value for the prediction of all-cause cardiovascular mortality. However, existing non-invasive approaches, including photoplethysmography and tonometry, only enable access to the superficial peripheral vasculature. Although current ultrasonic technologies allow non-invasive deep-tissue observation, unstable coupling with the tissue surface resulting from the bulkiness and rigidity of conventional ultrasound probes introduces usability constraints. Here, we describe the design and operation of an ultrasonic device that is conformal to the skin and capable of capturing blood-pressure waveforms at deeply embedded arterial and venous sites. The wearable device is ultrathin (240 μm) and stretchable (with strains up to 60%), and enables the non-invasive, continuous and accurate monitoring of cardiovascular events from multiple body locations, which should facilitate its use in a variety of clinical environments