Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

A Micro Power Hardware Fabric for Embedded Computing

Field Programmable Gate Arrays (FPGAs) mitigate many of the problemsencountered with the development of ASICs by offering flexibility, faster time-to-market, and amortized NRE costs, among other benefits. While FPGAs are increasingly being used for complex computational applications such as signal and image processing, networking, and cryptology, they are far from ideal for these tasks due to relatively high power consumption and silicon usage overheads compared to direct ASIC implementation. A reconfigurable device that exhibits ASIC-like power characteristics and FPGA-like costs and tool support is desirable to fill this void. In this research, a parameterized, reconfigurable fabric model named as domain specific fabric (DSF) is developed that exhibits ASIC-like power characteristics for Digital Signal Processing (DSP) style applications. Using this model, the impact of varying different design parameters on power and performance has been studied. Different optimization techniques like local search and simulated annealing are used to determine the appropriate interconnect for a specific set of applications. A design space exploration tool has been developed to automate and generate a tailored architectural instance of the fabric.The fabric has been synthesized on 160 nm cell-based ASIC fabrication process from OKI and 130 nm from IBM. A detailed power-performance analysis has been completed using signal and image processing benchmarks from the MediaBench benchmark suite and elsewhere with comparisons to other hardware and software implementations. The optimized fabric implemented using the 130 nm process yields energy within 3X of a direct ASIC implementation, 330X better than a Virtex-II Pro FPGA and 2016X better than an Intel XScale processor

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

Memory Subsystem Optimization Techniques for Modern High-Performance General-Purpose Processors

abstract: General-purpose processors propel the advances and innovations that are the subject of humanity’s many endeavors. Catering to this demand, chip-multiprocessors (CMPs) and general-purpose graphics processing units (GPGPUs) have seen many high-performance innovations in their architectures. With these advances, the memory subsystem has become the performance- and energy-limiting aspect of CMPs and GPGPUs alike. This dissertation identifies and mitigates the key performance and energy-efficiency bottlenecks in the memory subsystem of general-purpose processors via novel, practical, microarchitecture and system-architecture solutions. Addressing the important Last Level Cache (LLC) management problem in CMPs, I observe that LLC management decisions made in isolation, as in prior proposals, often lead to sub-optimal system performance. I demonstrate that in order to maximize system performance, it is essential to manage the LLCs while being cognizant of its interaction with the system main memory. I propose ReMAP, which reduces the net memory access cost by evicting cache lines that either have no reuse, or have low memory access cost. ReMAP improves the performance of the CMP system by as much as 13%, and by an average of 6.5%. Rather than the LLC, the L1 data cache has a pronounced impact on GPGPU performance by acting as the bandwidth filter for the rest of the memory subsystem. Prior work has shown that the severely constrained data cache capacity in GPGPUs leads to sub-optimal performance. In this thesis, I propose two novel techniques that address the GPGPU data cache capacity problem. I propose ID-Cache that performs effective cache bypassing and cache line size selection to improve cache capacity utilization. Next, I propose LATTE-CC that considers the GPU’s latency tolerance feature and adaptively compresses the data stored in the data cache, thereby increasing its effective capacity. ID-Cache and LATTE-CC are shown to achieve 71% and 19.2% speedup, respectively, over a wide variety of GPGPU applications. Complementing the aforementioned microarchitecture techniques, I identify the need for system architecture innovations to sustain performance scalability of GPG- PUs in the face of slowing Moore’s Law. I propose a novel GPU architecture called the Multi-Chip-Module GPU (MCM-GPU) that integrates multiple GPU modules to form a single logical GPU. With intelligent memory subsystem optimizations tailored for MCM-GPUs, it can achieve within 7% of the performance of a similar but hypothetical monolithic die GPU. Taking a step further, I present an in-depth study of the energy-efficiency characteristics of future MCM-GPUs. I demonstrate that the inherent non-uniform memory access side-effects form the key energy-efficiency bottleneck in the future. In summary, this thesis offers key insights into the performance and energy-efficiency bottlenecks in CMPs and GPGPUs, which can guide future architects towards developing high-performance and energy-efficient general-purpose processors.Dissertation/ThesisDoctoral Dissertation Computer Science 201

Implementing video compression algorithms on reconfigurable devices

The increasing density offered by Field Programmable Gate Arrays(FPGA), coupled with their short design cycle, has made them a popular choice for implementing a wide range of algorithms and complete systems. In this thesis the implementation of video compression algorithms on FPGAs is studied. Two areas are specifically focused on; the integration of a video encoder into a complete system and the power consumption of FPGA based video encoders. Two FPGA based video compression systems are described, one which targets surveillance applications and one which targets video conferencing applications. The FPGA video surveillance system makes use of a novel memory format to improve the efficiency with which input video sequences can be loaded over the system bus. The power consumption of a FPGA video encoder is analyzed. The results indicating that the motion estimation encoder stage requires the most power consumption. An algorithm, which reuses the intra prediction results generated during the encoding process, is then proposed to reduce the power consumed on an FPGA video encoder’s external memory bus. Finally, the power reduction algorithm is implemented within an FPGA video encoder. Results are given showing that, in addition to reducing power on the external memory bus, the algorithm also reduces power in the motion estimation stage of a FPGA based video encoder

Contribution au domaine de la conception des Systèmes Embarqués et Pervasifs Faible Consommation

La première partie est consacré à l’Estimation de la Consommation des Architectures Logicel. Ce travail est en continuité de mes travaux de thèse et ont démarré avec le projet SPICES piloté par le Dr Eric Senn. Ce projet avait pour but, pour notre partie, de modéliser et d’estimer la consommation des services d’un système d’exploitation à haut niveau. Ces travaux ont fait l’objet de la thèse de Saadia Dhouib (2006-2009) co dirigée par Eric Senn et Jean Philippe Diguet.La seconde aborde le problème du placement des données en mémoire pour les architectures logiciel. L’idée de ces travaux était de permettre un placement optimum des structures de données d’une application dans une hiérarchie mémoire fixée. Ce travail a été le début de la collaboration avec Marc Sevaux et André Rossi sur ces aspects et ont été poursuivis dans la thèse réalisée par Maria Soto (2008-2011).La troisième présente les travaux autour de l’estimation et l’optimisation de la consommation des interconnexions dans les systèmes sur puce (SoC). Dans un système sur puce la consommation d’énergie générée par les interconnexions peut devenir non négligeable ; il devient donc indispensable de pouvoir optimiser cette consommation. Afin de pouvoir juger des optimisations proposées, un modèle d’estimation est nécessaire car le temps de conception et de simulation (au niveau électrique) est prohibitif. Ces travaux ont fait l’objet de la thèse d’Antoine Courtay (2005-2008) co dirigée par Olivier Sentieys et Nathalie Julien.Enfin la dernière aborde mes derniers travaux de recherche sur la conception de systèmes pervasifs pour le domaine maritime. Ces travaux aborde plusieurs sous thèmes comme: -la mesure de la performance pour la course au large ; travaux de thèse de Ronan Douguet (2010-2014)-l’utilisation de la réalité augmentée pour l’aide à la navigation ; travaux de thèse de Jean Christophe Morgère (2011-2015)-l’optimisation temps réel d’énergies renouvelables pour voilier du futur ; travaux de thèse de Mathilde Tréhin (2013- ?)-les algorithmes et plateforme faible consommation pour la conception d’un pilote automatique haute performance pour le nautisme ; travaux de thèse d’Hugo Kerhascoet (2014-2017

Scalability of broadcast performance in wireless network-on-chip

Networks-on-Chip (NoCs) are currently the paradigm of choice to interconnect the cores of a chip multiprocessor. However, conventional NoCs may not suffice to fulfill the on-chip communication requirements of processors with hundreds or thousands of cores. The main reason is that the performance of such networks drops as the number of cores grows, especially in the presence of multicast and broadcast traffic. This not only limits the scalability of current multiprocessor architectures, but also sets a performance wall that prevents the development of architectures that generate moderate-to-high levels of multicast. In this paper, a Wireless Network-on-Chip (WNoC) where all cores share a single broadband channel is presented. Such design is conceived to provide low latency and ordered delivery for multicast/broadcast traffic, in an attempt to complement a wireline NoC that will transport the rest of communication flows. To assess the feasibility of this approach, the network performance of WNoC is analyzed as a function of the system size and the channel capacity, and then compared to that of wireline NoCs with embedded multicast support. Based on this evaluation, preliminary results on the potential performance of the proposed hybrid scheme are provided, together with guidelines for the design of MAC protocols for WNoC.Peer ReviewedPostprint (published version

Principles of Neuromorphic Photonics

In an age overrun with information, the ability to process reams of data has become crucial. The demand for data will continue to grow as smart gadgets multiply and become increasingly integrated into our daily lives. Next-generation industries in artificial intelligence services and high-performance computing are so far supported by microelectronic platforms. These data-intensive enterprises rely on continual improvements in hardware. Their prospects are running up against a stark reality: conventional one-size-fits-all solutions offered by digital electronics can no longer satisfy this need, as Moore's law (exponential hardware scaling), interconnection density, and the von Neumann architecture reach their limits. With its superior speed and reconfigurability, analog photonics can provide some relief to these problems; however, complex applications of analog photonics have remained largely unexplored due to the absence of a robust photonic integration industry. Recently, the landscape for commercially-manufacturable photonic chips has been changing rapidly and now promises to achieve economies of scale previously enjoyed solely by microelectronics. The scientific community has set out to build bridges between the domains of photonic device physics and neural networks, giving rise to the field of \emph{neuromorphic photonics}. This article reviews the recent progress in integrated neuromorphic photonics. We provide an overview of neuromorphic computing, discuss the associated technology (microelectronic and photonic) platforms and compare their metric performance. We discuss photonic neural network approaches and challenges for integrated neuromorphic photonic processors while providing an in-depth description of photonic neurons and a candidate interconnection architecture. We conclude with a future outlook of neuro-inspired photonic processing.Comment: 28 pages, 19 figure