Novel TCAD oriented definition of the off-state breakdown voltage in Schottky-gate FETs: a 4H SiC MESFET case study

Physics-based breakdown voltage optimization in Schottky-barrier power RF and microwave field-effect transistors as well as in high-speed power-switching diodes is today an important topic in technology computer-aided design (TCAD). OFF-state breakdown threshold criteria based on the magnitude of the Schottky-barrier leakage current can be directly applied to TCAD; however, the results obtained are not accurate due to the large uncertainty in the Schottky-barrier parameters and models arising above all in advanced wide-gap semiconductors and to the need of performing high-temperature simulations to improve the numerical convergence of the model. In this paper, we suggest a novel OFF-state breakdown criterion, based on monitoring the magnitude (at the drain edge of the gate) of the electric field component parallel to the current density. The new condition is shown to be consistent with more conventional definitions and to exhibit a significantly reduced sensitivity with respect to physical parameter variation

Modeling of gallium nitride transistors for high power and high temperature applications

Wide bandgap (WBG) semiconductors such as GaN and SiC are emerging as promising alternatives to Si for new generation of high efficiency power devices. GaN has attracted a lot of attention recently because of its superior material properties leading to potential realization of power transistors for high power, high frequency, and high temperature applications. In order to utilize the full potential of GaN-based power transistors, proper device modeling is essential to verify its operation and improve the design efficiency. In this view, this research work presents modeling and characterization of GaN transistors for high power and high temperature applications. The objective of this research work includes three key areas of GaN device modeling such as physics-based analytical modeling, device simulation with numerical simulator and electrothermal SPICE model for circuit simulation. The analytical model presented in this dissertation enables understanding of the fundamental physics of this newly emerged GaN device technology to improve the operation of existing device structures and to optimize the device configuration in the future. The numerical device simulation allows to verify the analytical model and study the impact of different device parameters. An empirical SPICE model for standard circuit simulator has been developed and presented in the dissertation which allows simulation of power electronic circuits employing GaN power devices. The empirical model provides a good approximation of the device behavior and creates a link between the physics-based analytical model and the actual device testing data. Furthermore, it includes an electrothermal model which can predict the device behavior at elevated temperatures as required for high temperature applications.Includes bibliographical reference

Developement of simulation tools for the analysis of variability in advanced semiconductor electron devices

The progressive down-scaling has been the driving force behind the integrated circuit (IC) industry for several decades, continuously delivering higher component densities and greater chip functionality, while reducing the cost per function from one CMOS technology generation to the next. Moore’s law boosts IC industry profits by constantly releasing high-quality and inexpensive electronic applications into the market using new technologies. From the 1 m gate lengths of the eighties to the 35 nm gate lengths of contemporary 22 nm technology, the industry successfully achieved its scaling goals, not only miniaturizing devices but also improving device performance

TCAD Simulations and Small Signal Modeling of DMG AlGaN/GaN HFET

This article presents extraction of small signal model parameters and TCAD simulation of novel asymmetric field plated dual material gate AlGaN/GaN HFET first time. Small signal model is essential for design of LNA and microwave electronic circuit by using the proposed superior performance HFET structure. Superior performances of device are due to its dual material gate structure and field plate that can provide better electric field uniformity, suppression of short channel effects and improvement in carrier transport efficiency. In this article we used direct parameter extraction methodology in which S-parameters of device were measured using pinchoff cold FET biasing. The measured S-parameters are then transformed into Y-parameters to extract capacitive elements and then in to Z-parameters to extract series parasitic elements. Intrinsic parameters are extracted from Y-parameters after de-embedding all parasitic elements of devce. Microwave figure of merits and dc performance are also studied for proposed HFET. The important figure of merits of device reported in the paper include transconductance, drain conductance, current gain, transducer power gain, available power gain, maximum stable gain, maximum frequency of oscillation, cut-off frequency, stability factor and time delay. Reported results are validated with experimental and simulation results for consistency and accuracy

DC and RF characteristics of 20 nm gate length InAlAs/InGaAs/InP HEMTs for high frequency application

lnAlAs/lnGaAs/InP high electron mobility transistor (HEMT) offers excellent high frequency operation.In this work,the DC and RF performance of a 20 nm gate length enhancement mode InAlAs/InGaAs/InP high electron mobility transistor (HEMT) on InP substrate are presented.The SILVACO-TCAD simulations performed at room temperature using the appropriate model sshowed that the studied device exhibit excellent pinch-off characteristics, with a maximum transconductance of 1100ms/mm, a threshold voltage of 0,62V, and an Ion/Ioff ratio of 2.106. The cut-off frequency and maximum frequency of oscillation are 980 GHz and 1.3THz respectively. These promising results allow us to affirm that this device is intended to be used in high frequency applications

Bridging the Gap between Physical and Circuit Analysis for Variability-Aware Microwave Design: Power Amplifier Design

Process Induced Variability (PIV) stemming from fabrication tolerance can impact the performance of integrated circuits. This issue is particularly significant at high frequencies, since Monolithic Microwave Integrated Circuits (MMICs) rely on advanced semiconductor technologies exploiting device sizes at the nanoscale in conjunction with complex passive structures, featuring both distributed elements (transmission lines) and lumped components. Black-box (behavioral) models extracted from accurate physical simulations can be profitably exploited to incorporate PIV into circuit-level MMIC analysis. In this paper, these models are applied to the statistical analysis of a single and of a combined MMIC power amplifier designed in GaAs technology for X-band applications. The relative impact of the active device variability towards the passive matching networks one is evaluated, demonstrating the relevance of PIV. The significant spread found, with only two variable parameters, confirms the importance of a PIV-aware PA design approach, with suitable margins and careful network optimization

Miniaturized Transistors, Volume II

In this book, we aim to address the ever-advancing progress in microelectronic device scaling. Complementary Metal-Oxide-Semiconductor (CMOS) devices continue to endure miniaturization, irrespective of the seeming physical limitations, helped by advancing fabrication techniques. We observe that miniaturization does not always refer to the latest technology node for digital transistors. Rather, by applying novel materials and device geometries, a significant reduction in the size of microelectronic devices for a broad set of applications can be achieved. The achievements made in the scaling of devices for applications beyond digital logic (e.g., high power, optoelectronics, and sensors) are taking the forefront in microelectronic miniaturization. Furthermore, all these achievements are assisted by improvements in the simulation and modeling of the involved materials and device structures. In particular, process and device technology computer-aided design (TCAD) has become indispensable in the design cycle of novel devices and technologies. It is our sincere hope that the results provided in this Special Issue prove useful to scientists and engineers who find themselves at the forefront of this rapidly evolving and broadening field. Now, more than ever, it is essential to look for solutions to find the next disrupting technologies which will allow for transistor miniaturization well beyond silicon’s physical limits and the current state-of-the-art. This requires a broad attack, including studies of novel and innovative designs as well as emerging materials which are becoming more application-specific than ever before

Semiconductor Device Modeling and Simulation for Electronic Circuit Design

This chapter covers different methods of semiconductor device modeling for electronic circuit simulation. It presents a discussion on physics-based analytical modeling approach to predict device operation at specific conditions such as applied bias (e.g., voltages and currents); environment (e.g., temperature, noise); and physical characteristics (e.g., geometry, doping levels). However, formulation of device model involves trade-off between accuracy and computational speed and for most practical operation such as for SPICE-based circuit simulator, empirical modeling approach is often preferred. Thus, this chapter also covers empirical modeling approaches to predict device operation by implementing mathematically fitted equations. In addition, it includes numerical device modeling approaches, which involve numerical device simulation using different types of commercial computer-based tools. Numerical models are used as virtual environment for device optimization under different conditions and the results can be used to validate the simulation models for other operating conditions