Te-based chalcogenide materials for selector applications

The implementation of dense, one-selector one-resistor (1S1R), resistive switching memory arrays, can be achieved with an appropriate selector for correct information storage and retrieval. Ovonic threshold switches (OTS) based on chalcogenide materials are a strong candidate, but their low thermal stability is one of the key factors that prevents rapid adoption by emerging resistive switching memory technologies. A previously developed map for phase change materials is expanded and improved for OTS materials. Selected materials from different areas of the map, belonging to binary Ge-Te and Si-Te systems, are explored. Several routes, including Si doping and reduction of Te amount, are used to increase the crystallization temperature. Selector devices, with areas as small as 55 x 55 nm(2), were electrically assessed. Sub-threshold conduction models, based on Poole-Frenkel conduction mechanism, are applied to fresh samples in order to extract as-processed material parameters, such as trap height and density of defects, tailoring of which could be an important element for designing a suitable OTS material. Finally, a glass transition temperature estimation model is applied to Te-based materials in order to predict materials that might have the required thermal stability. A lower average number of p-electrons is correlated with a good thermal stability

Reconfigurable writing architecture for reliable RRAM operation in wide temperature ranges

Resistive switching memories [resistive RAM (RRAM)] are an attractive alternative to nonvolatile storage and nonconventional computing systems, but their behavior strongly depends on the cell features, driver circuit, and working conditions. In particular, the circuit temperature and writing voltage schemes become critical issues, determining resistive switching memories performance. These dependencies usually force a design time tradeoff among reliability, device endurance, and power consumption, thereby imposing nonflexible functioning schemes and limiting the system performance. In this paper, we present a writing architecture that ensures the correct operation no matter the working temperature and allows the dynamic load of application-oriented writing profiles. Thus, taking advantage of more efficient configurations, the system can be dynamically adapted to overcome RRAM intrinsic challenges. Several profiles are analyzed regarding power consumption, temperature-variations protection, and operation speed, showing speedups near 700x compared with other published drivers

Fabrication, Characterization and Integration of Resistive Random Access Memories

The functionalities and performances of today's computing systems are increasingly dependent on the memory block. This phenomenon, also referred as the Von Neumann bottleneck, is the main motivation for the research on memory technologies. Despite CMOS technology has been improved in the last 50 years by continually increasing the device density, today's mainstream memories, such as SRAM, DRAM and Flash, are facing fundamental limitations to continue this trend. These memory technologies, based on charge storage mechanisms, are suffering from the easy loss of the stored state for devices scaled below 10 nm. This results in a degradation of the performance, reliability and noise margin. The main motivation for the development of emerging non volatile memories is the study of a different mechanism to store the digital state in order to overcome this challenge. Among these emerging technologies, one of the strongest candidate is Resistive Random Access Memory (ReRAM), which relies on the formation or rupture of a conductive filament inside a dielectric layer. This thesis focuses on the fabrication, characterization and integration of ReRAM devices. The main subject is the qualitative and quantitative description of the main factors that influence the resistive memory electrical behavior. Such factors can be related either to the memory fabrication or to the test environment. The first category includes variations in the fabrication process steps, in the device geometry or composition. We discuss the effect of each variation, and we use the obtained database to gather insights on the ReRAM working mechanism and the adopted methodology by using statistical methods. The second category describes how differences in the electrical stimuli sent to the device change the memory performances. We show how these factors can influence the memory resistance states, and we propose an empirical model to describe such changes. We also discuss how it is possible to control the resistance states by modulating the number of input pulses applied to the device. In the second part of this work, we present the integration of the fabricated devices in a CMOS technology environment. We discuss a Verilog-A model used to simulate the device characteristics, and we show two solutions to limit the sneak-path currents for ReRAM crossbars: a dedicated read circuit and the development of selector devices. We describe the selector fabrication, as well as the electrical characterization and the combination with our ReRAMs in a 1S1R configuration. Finally, we show two methods to integrate ReRAM devices in the BEoL of CMOS chips

Vertical III-V Nanowires For In-Memory Computing

In recent times, deep neural networks (DNNs) have demonstrated great potential in various machine learning applications,such as image classification and object detection for autonomous driving. However, increasing the accuracy of DNNsrequires scaled, faster, and more energy-efficient hardware, which is limited by the von Neumann architecture whereseparate memory and computing units lead to a bottleneck in performance. A promising solution to address the vonNeumann bottleneck is in-memory computing, which can be achieved by integrating non-volatile memory cells such asRRAMs into dense crossbar arrays. On the hardware side, the 1-transistor-1-resistor (1T1R) configuration has been centralto numerous demonstrations of reservoir, in-memory and neuromorphic computing.In this thesis, to achieve a 1T1R cell with a minimal footprint of 4F2, a technology platform has been developed to integrate avertical nanowire GAA MOSFET as a selector device for the RRAM. Firstly, the effect of the geometry (planar to vertical) ofthe ITO/HfO2/TiN RRAM cell was studied where low energy switching (0.49 pJ) and high endurance (106) were achievedin the vertical configuration. Furthermore, InAs was incorporated as the GAA MOSFET selector channel material toleverage the beneficial transport properties of III-V materials desirable for supply voltage scaling. Finally, an approach wasdeveloped wherein InAs is used as the selector channel as well as the RRAM electrode by carefully tuning the InAs nativeoxides. This thesis also presents low-frequency noise characterization of the RRAM cell as well as the MOSFET to furtherunderstand the semiconductor/oxide interface. The vertical 1T1R cell developed in this thesis enables the implementationof Boolean logic operations using a single vertical nanowire while reducing the footprint by 51x when compared to itstraditional CMOS counterpart

Applications of memristors in conventional analogue electronics

This dissertation presents the steps employed to activate and utilise analogue memristive devices in conventional analogue circuits and beyond. TiO2 memristors are mainly utilised in this study, and their large variability in operation in between similar devices is identified. A specialised memristor characterisation instrument is designed and built to mitigate this issue and to allow access to large numbers of devices at a time. Its performance is quantified against linear resistors, crossbars of linear resistors, stand-alone memristive elements and crossbars of memristors. This platform allows for a wide range of different pulsing algorithms to be applied on individual devices, or on crossbars of memristive elements, and is used throughout this dissertation. Different ways of achieving analogue resistive switching from any device state are presented. Results of these are used to devise a state-of-art biasing parameter finder which automatically extracts pulsing parameters that induce repeatable analogue resistive switching. IV measurements taken during analogue resistive switching are then utilised to model the internal atomic structure of two devices, via fittings by the Simmons tunnelling barrier model. These reveal that voltage pulses modulate a nano-tunnelling gap along a conical shape. Further retention measurements are performed which reveal that under certain conditions, TiO2 memristors become volatile at short time scales. This volatile behaviour is then implemented into a novel SPICE volatile memristor model. These characterisation methods of solid-state devices allowed for inclusion of TiO2 memristors in practical electronic circuits. Firstly, in the context of large analogue resistive crossbars, a crosspoint reading method is analysed and improved via a 3-step technique. Its scaling performance is then quantified via SPICE simulations. Next, the observed volatile dynamics of memristors are exploited in two separate sequence detectors, with applications in neuromorphic engineering. Finally, the memristor as a programmable resistive weight is exploited to synthesise a memristive programmable gain amplifier and a practical memristive automatic gain control circuit.Open Acces

Resistive Switching in Transition Metal Oxides for Integrated Non-volatile Memory

Transition metal oxides (TMOs) exhibit characteristic resistance changes when subjected to high electric fields due to the creation, drift and diffusion of defects, and this resistive-switching response is of interest for future non-volatile memory applications. Indeed, resistive random access memories (ReRAM) are considered promising alternatives to conventional charge storage-based devices because of their low production cost, simple fabrication, and excellent scalability. However, the realization of reliable ReRAM devices and their integration in large-scale arrays requires further understanding of the switching mechanisms and the development of new strategies for improving integrated device functionality. The aim of this work is to understand the role of the material structure on device reliability and to investigate the integration of passive selector elements with memory devices for use in memory cross-bar arrays. The thesis begins by investigating the properties of relevant oxide films (ALD HfO2 and plasma deposited NbOx) and then addresses three technologically relevant problems. Specifically these include: 1) understanding how the roughness of metal/dielectric interfaces affects dielectric breakdown and switching behaviour; 2) exploring methods for reducing the operating current of selector and memory/selector devices and 3) investigating the effect of operating conditions on the switching response of devices. The first of these studies is based on Pt/Ti/HfO2/Pt devices and combines experimental methods and finite element modelling to understand the effect of the Pt/HfO2 interface roughness on the electroforming and switching response. Atomic force microscopy (AFM) showed that the roughness of Pt electrodes deposited by electron-beam evaporation increased with film thickness due to facetted grain growth. Results show that roughness leads to a reduction in the electroforming voltage of HfO2, an increase in the failure rate of devices, and a corresponding reduction in resistive switching reliability. Conventional wisdom suggests that these effects result from local electric field enhancement in the vicinity of electrode asperities. However, the effect on electroforming voltage is much less than estimated from simple geometric considerations. Comparison with finite-element modelled showed high-aspect-ratio asperities can produce field enhancements of more than an order of magnitude but that the generation and redistribution of defects moderates this effect prior to dielectric breakdown. As a consequence, the effect of field enhancement is less than anticipated from the initial electric-field distribution alone. It is argued that the increase in the device failure rate with increasing electrode roughness derives partly from an increase in the film defect density and effective device area and that these effects contribute to the reduction in breakdown voltage. The second study showed that the leakage current in NbO2-x selector (1S) elements is shown to be reduced by the properties of an adjacent memory (1M) element when integrated into a hybrid selector-memory device structure. This is shown to result from current confinement in conductive filaments formed in the memory layer. Finite element modelling of the selector-memory structures is used to confirm the observations and to explore material dependencies. The thermal and electrical conductivities of the memory layer are shown to influence the threshold current, but the dominant effect is due to current confinement. The final study explores the effect of device operating conditions on its operation and identifies an alternative approach for reducing the forming and RESET current in integrated memory/selector devices. This study is based on Pt/Nb/HfO2/Pt devices which require a very "soft" electroforming process. Such devices are shown to undergo configurable switching controlled by the SET compliance current. When operated at a low compliance-current (~100 µA), devices show uniform bipolar resistive switching behaviour. As the compliance current is increased (~500 µA), the switching mode changes to integrated threshold-resistive (1S1M) switching, and at still higher currents (~1 mA), it changes to symmetric threshold switching (1S) characteristic of threshold switching in NbO2-. These switching transitions are shown to be consistent with the development of an NbO2- interlayer at the Nb/HfO2 interface that is limited by the set compliance current due to its effect on oxygen transport and local Joule heating. The proposed mechanism is supported by finite element modelling of the 1S1M response assuming the presence of such an interlayer. These findings help to understand role of interface reactions in controlling device performance and provide a means for the self-assembly of integrated 1S1M resistive random access memory structures

Optimization of niobium oxide-based threshold switches for oscillator-based applications

In niobium oxide-based capacitors non-linear switching characteristics can be observed if the oxide properties are adjusted accordingly. Such non-linear threshold switching characteristics can be utilized in various non-linear circuit applications, which have the potential to pave the way for the application of new computing paradigms. Furthermore, the non-linearity also makes them an interesting candidate for the application as selector devices e.g. for non-volatile memory devices. To satisfy the requirements for those two areas of application, the threshold switching characteristics need to be adjusted to either obtain a maximized voltage extension of the negative differential resistance region in the quasi-static I-V characteristics, which enhances the non-linearity of the devices and results in improved robustness to device-to-device variability or to adapt the threshold voltage to a specific non-volatile memory cell. Those adaptations of the threshold switching characteristics were successfully achieved by deliberate modifications of the niobium oxide stack. Furthermore, the impact of the material stack on the dynamic behavior of the threshold switches in non-linear circuits as well as the impact of the electroforming routine on the threshold switching characteristics were analyzed. The optimized device stack was transferred from the micrometer-sized test structures to submicrometer-sized devices, which were packaged to enable easy integration in complex circuits. Based on those packaged threshold switching devices the behavior of single as well as of coupled relaxation oscillators was analyzed. Subsequently, the obtained results in combination with the measurement results for the statistic device-to-device variability were used as a basis to simulate the pattern formation in coupled relaxation oscillator networks as well as their performance in solving graph coloring problems. Furthermore, strategies to adapt the threshold voltage to the switching characteristics of a tantalum oxide-based non-volatile resistive switch and a non-volatile phase change cell, to enable their application as selector devices for the respective cells, were discussed.:Abstract I Zusammenfassung II List of Abbrevations VI List of Symbols VII 1 Motivation 1 2 Basics 5 2.1 Negative differential resistance and local activity in memristor devices 5 2.2 Threshold switches as selector devices 8 2.3 Switching effects observed in NbOx 13 2.3.1 Threshold switching caused by metal-insulator transition 13 2.3.2 Threshold switching caused by Frenkel-Poole conduction 18 2.3.3 Non-volatile resistive switching 32 3 Sample preparation 35 3.1 Deposition techniques 35 3.1.1 Evaporation 35 3.1.2 Sputtering 36 3.2 Micrometer-sized devices 36 3.3 Submicrometer-sized devices 37 3.3.1 Process flow 37 3.3.2 Reduction of the electrode resistance 39 3.3.3 Transfer from structuring via electron beam lithography to structuring via laser lithography 48 3.3.4 Packaging procedure 50 4 Investigation and optimization of the electrical device characteristic 51 4.1 Introduction 51 4.2 Measurement setup 52 4.3 Electroforming 53 4.3.1 Optimization of the electroforming process 53 4.3.2 Characterization of the formed filament 62 4.4 Dynamic device characteristics 67 4.4.1 Emergence and measurement of dynamic behavior 67 4.4.2 Impact of the dynamic device characteristics on quasi-static I-V characteristics 70 5 Optimization of the material stack 81 5.1 Introduction 81 5.2 Adjustment of the oxygen content in the bottom layer 82 5.3 Influence of the thickness of the oxygen-rich niobium oxide layer 92 5.4 Multilayer stacks 96 5.5 Device-to-device and Sample-to-sample variability 110 6 Applications of NbOx-based threshold switching devices 117 6.1 Introduction 117 6.2 Non-linear circuits 117 6.2.1 Coupled relaxation oscillators 117 6.2.2 Memristor Cellular Neural Network 121 6.2.3 Graph Coloring 127 6.3 Selector devices 132 7 Summary and Outlook 138 8 References 141 9 List of publications 154 10 Appendix 155 10.1 Parameter used for the LT Spice simulation of I-V curves for threshold switches with varying oxide thicknesses 155 10.2 Dependence of the oscillation frequency of the relaxation oscillator circuit on the capacitance and the applied source voltage 156 10.3 Calculation of the oscillation frequency of the relaxation oscillator circuit 157 10.4 Characteristics of the memristors and the cells utilized in the simulation of the memristor cellular neural network 164 10.5 Calculation of the impedance of the cell in the memristor cellular network 166 10.6 Example graphs from the 2nd DIMACS series 179 11 List of Figures 182 12 List of Tables 19

Brain-Inspired Computing: Neuromorphic System Designs and Applications

In nowadays big data environment, the conventional computing platform based on von Neumann architecture encounters the bottleneck of the increasing requirement of computation capability and efficiency. The “brain-inspired computing” Neuromorphic Computing has demonstrated great potential to revolutionize the technology world. It is considered as one of the most promising solutions by achieving tremendous computing and power efficiency on a single chip. The neuromorphic computing systems represent great promise for many scientific and intelligent applications. Many designs have been proposed and realized with traditional CMOS technology, however, the progress is slow. Recently, the rebirth of neuromorphic computing is inspired by the development of novel nanotechnology. In this thesis, I propose neuromorphic computing systems with the ReRAM (Memristor) crossbar array. It includes the work in three major parts: 1) Memristor devices modeling and related circuits design in resistive memory (ReRAM) technology by investigating their physical mechanism, statistical analysis, and intrinsic challenges. A weighted sensing scheme which assigns different weights to the cells on different bit lines was proposed. The area/power overhead of peripheral circuitry was effectively reduced while minimizing the amplitude of sneak paths. 2) Neuromorphic computing system designs by leveraging memristor devices and algorithm scaling in neural network and machine learning algorithms based on the similarity between memristive effect and biological synaptic behavior. First, a spiking neural network (SNN) with a rate coding model was developed in algorithm level and then mapped to hardware design for supervised learning. In addition, to further speed and accuracy improvement, another neuromorphic system adopting analog input signals with different voltage amplitude and a current sensing scheme was built. Moreover, the use of a single memristor crossbar for each neural net- work layer was explored. 3) The application-specific optimization for further reliability improvement of the developed neuromorphic systems. In this thesis, the impact of device failure on the memristor-based neuromorphic computing systems for cognitive applications was evaluated. Then, a retraining and a remapping design in algorithm level and hardware level were developed to rescue the large accuracy loss

Simulation and programming strategies to mitigate device non-idealities in memristor based neuromorphic systems

Since its inception, resistive random access memory (RRAM) has widely been regarded as a promising technology, not only for its potential to revolutionize non-volatile data storage by bridging the speed gap between traditional solid state drives (SSD) and dynamic random access memory (DRAM), but also for the promise it brings to in-memory and neuromorphic computing. Despite the potential, the design process of RRAM neuromorphic arrays still finds itself in its infancy, as reliability (retention, endurance, programming linearity) and variability (read-to-read, cycle-to-cycle and device-to-device) issues remain major hurdles for the mainstream implementation of these systems. One of the fundamental stages of neuromorphic design is the simulation stage. In this thesis, a simulation framework for evaluating the impact of RRAM non-idealities on NNs, that emphasizes flexibility and experimentation in NN topology and RRAM programming conditions is coded in MATLAB, making full use of its various toolboxes. Using these tools as the groundwork, various RRAM non-idealities are comprehensively measured and their impact on both inference and training accuracy of a pattern recognition system based on the MNIST handwritten digits dataset are simulated. In the inference front, variability originated from different sources (read-to-read and programming-to-programming) are statistically evaluated and modelled for two different device types: filamentary and non-filamentary. Based on these results, the impact of various variability sources on inference are simulated and compared, showing much more pronounced variability in the filamentary device compared to its non-filamentary counterpart. The staged programming scheme is introduced as a method to improve linearity and reduce programming variability, leading to negligible accuracy loss in non-filamentary devices. Random telegraph noise (RTN) remains the major source of read variability in both devices. These results can be explained by the difference in switching mechanisms of both devices. In training, non-idealities such as conductance stepping and cycle-to-cycle variability are characterized and their impact on the training of NNs based on backpropagation are independently evaluated. Analysing the change of weight distributions during training reveals the different impacts on the SET and RESET processes. Based on these findings, a new selective programming strategy is introduced for the suppression of non-idealities impact on accuracy. Furthermore, the impact of these methods are analysed between different NN topologies, including traditional multi-layer perceptron (MLP) and convolutional neural network (CNN) configurations. Finally, the new dynamic weight range rescaling methodology is introduced as a way of not only alleviating the constraints imposed in hardware due to the limited conductance range of RRAM in training, but also as way of increasing the flexibility of RRAM based deep synaptic layers to different sets of data

Circuit Design, Architecture and CAD for RRAM-based FPGAs

Field Programmable Gate Arrays (FPGAs) have been indispensable components of embedded systems and datacenter infrastructures. However, energy efficiency of FPGAs has become a hard barrier preventing their expansion to more application contexts, due to two physical limitations: (1) The massive usage of routing multiplexers causes delay and power overheads as compared to ASICs. To reduce their power consumption, FPGAs have to operate at low supply voltage but sacrifice performance because the transistors drive degrade when working voltage decreases. (2) Using volatile memory technology forces FPGAs to lose configurations when powered off and to be reconfigured at each power on. Resistive Random Access Memories (RRAMs) have strong potentials in overcoming the physical limitations of conventional FPGAs. First of all, RRAMs grant FPGAs non-volatility, enabling FPGAs to be "Normally powered off, Instantly powered on". Second, by combining functionality of memory and pass-gate logic in one unique device, RRAMs can greatly reduce area and delay of routing elements. Third, when RRAMs are embedded into datpaths, the performance of circuits can be independent from their working voltage, beyond the limitations of CMOS circuits. However, researches and development of RRAM-based FPGAs are in their infancy. Most of area and performance predictions were achieved without solid circuit-level simulations and sophisticated Computer Aided Design (CAD) tools, causing the predicted improvements to be less convincing. In this thesis,we present high-performance and low-power RRAM-based FPGAs fromtransistorlevel circuit designs to architecture-level optimizations and CAD tools, using theoretical analysis, industrial electrical simulators and novel CAD tools. We believe that this is the first systematic study in the field, covering: From a circuit design perspective, we propose efficient RRAM-based programming circuits and routing multiplexers through both theoretical analysis and electrical simulations. The proposed 4T(ransitor)1R(RAM) programming structure demonstrates significant improvements in programming current, when compared to most popular 2T1R programming structure. 4T1R-based routingmultiplexer designs are proposed by considering various physical design parasitics, such as intrinsic capacitance of RRAMs and wells doping organization. The proposed 4T1R-based multiplexers outperformbest CMOS implementations significantly in area, delay and power at both nominal and near-Vt regime. From a CAD perspective, we develop a generic FPGA architecture exploration tool, FPGASPICE, modeling a full FPGA fabric with SPICE and Verilog netlists. FPGA-SPICE provides different levels of testbenches and techniques to split large SPICE netlists, in order to obtain better trade-off between simulation time and accuracy. FPGA-SPICE can capture area and power characteristics of SRAM-based and RRAM-based FPGAs more accurately than the currently best analyticalmodels. From an architecture perspective, we propose architecture-level optimizations for RRAMbased FPGAs and quantify their minimumrequirements for RRAM devices. Compared to the best SRAM-based FPGAs, an optimized RRAM-based FPGA architecture brings significant reduction in area, delay and power respectively. In particular, RRAM-based FPGAs operating in the near-Vt regime demonstrate a 5x power improvement without delay overhead as compared to optimized SRAM-based FPGA operating at nominal working voltage