A review of data mining applications in semiconductor manufacturing

The authors acknowledge Fundacao para a Ciencia e a Tecnologia (FCT-MCTES) for its financial support via the project UIDB/00667/2020 (UNIDEMI).For decades, industrial companies have been collecting and storing high amounts of data with the aim of better controlling and managing their processes. However, this vast amount of information and hidden knowledge implicit in all of this data could be utilized more efficiently. With the help of data mining techniques unknown relationships can be systematically discovered. The production of semiconductors is a highly complex process, which entails several subprocesses that employ a diverse array of equipment. The size of the semiconductors signifies a high number of units can be produced, which require huge amounts of data in order to be able to control and improve the semiconductor manufacturing process. Therefore, in this paper a structured review is made through a sample of 137 papers of the published articles in the scientific community regarding data mining applications in semiconductor manufacturing. A detailed bibliometric analysis is also made. All data mining applications are classified in function of the application area. The results are then analyzed and conclusions are drawn.publishersversionpublishe

Data mining in manufacturing: a review based on the kind of knowledge

In modern manufacturing environments, vast amounts of data are collected in database management systems and data warehouses from all involved areas, including product and process design, assembly, materials planning, quality control, scheduling, maintenance, fault detection etc. Data mining has emerged as an important tool for knowledge acquisition from the manufacturing databases. This paper reviews the literature dealing with knowledge discovery and data mining applications in the broad domain of manufacturing with a special emphasis on the type of functions to be performed on the data. The major data mining functions to be performed include characterization and description, association, classification, prediction, clustering and evolution analysis. The papers reviewed have therefore been categorized in these five categories. It has been shown that there is a rapid growth in the application of data mining in the context of manufacturing processes and enterprises in the last 3 years. This review reveals the progressive applications and existing gaps identified in the context of data mining in manufacturing. A novel text mining approach has also been used on the abstracts and keywords of 150 papers to identify the research gaps and find the linkages between knowledge area, knowledge type and the applied data mining tools and techniques

Artificial Neural Networks in Production Scheduling and Yield Prediction of Semiconductor Wafer Fabrication System

With the development of artificial intelligence, the artificial neural networks (ANN) are widely used in the control, decision‐making and prediction of complex discrete event manufacturing systems. Wafer fabrication is one of the most complicated and high competence manufacturing phases. The production scheduling and yield prediction are two critical issues in the operation of semiconductor wafer fabrication system (SWFS). This chapter proposed two fuzzy neural networks for the production rescheduling strategy decision and the die yield prediction. Firstly, a fuzzy neural network (FNN)‐based rescheduling decision model is implemented, which can rapidly choose an optimized rescheduling strategy to schedule the semiconductor wafer fabrication lines according to the current system disturbances. The experimental results demonstrate the effectiveness of proposed FNN‐based rescheduling decision mechanism approach over the alternatives (back‐propagation neural network and Multivariate regression). Secondly, a novel fuzzy neural network‐based yield prediction model is proposed to improve prediction accuracy of die yield in which the impact factors of yield and critical electrical test parameters are considered simultaneously and are taken as independent variables. The comparison experiment verifies the proposed yield prediction method improves on three traditional yield prediction methods with respect to prediction accuracy

A Novel Fuzzy-Neural Slack-Diversifying Rule Based on Soft Computing Applications for Job Dispatching in a Wafer Fabrication Factory

This study proposes a slack-diversifying fuzzy-neural rule to improve job dispatching in a wafer fabrication factory. Several soft computing techniques, including fuzzy classification and artificial neural network prediction, have been applied in the proposed methodology. A highly effective fuzzy-neural approach is applied to estimate the remaining cycle time of a job. This research presents empirical evidence of the relationship between the estimation accuracy and the scheduling performance. Because dynamic maximization of the standard deviation of schedule slack has been shown to improve performance, this work applies such maximization to a slack-diversifying fuzzy-neural rule derived from a two-factor tailored nonlinear fluctuation smoothing rule for mean cycle time (2f-TNFSMCT). The effectiveness of the proposed rule was checked with a simulated case, which provided evidence of the rule’s effectiveness. The findings in this research point to several directions that can be exploited in the future

Agent-based Three Layer Framework of Assembly-Oriented Planning and Scheduling for Discrete Manufacturing Enterprises

To solve the cost burden caused by delivery tardiness for small and medium sized packaging machinery enterprises, the assembly-oriented planning and scheduling is studied based on the multi-agent technology. Taking into account the due date, the planning and scheduling are optimized iteratively with the rule-based algorithms complying with the machining and assembling process constraints. To make the realistic large-scale production planning scheme tailored to fit the optimization algorithms, a multi-agent system is utilized to conceptually construct a three-layer framework corresponding to three planning horizons of different task level. These planning horizons are quarter/month of product/subassembly level, week of part level, and day of operation level. With the strategy of combining top-down task decomposition and bottom-up plan update (where the quarterly orders are decomposed into the monthly, weekly, and daily tasks according to the product processing structure while the resulting plans of every layer are updated iteratively based on the bottom layer optimization), the proposed framework not only addresses the planning but also the periodic and event-driven scheduling of the processes. In this paper, a gravure printing machine is considered as a test case for evaluating the proposed framework. The simulation results with the historical data of the orders for this machine demonstrate the effectiveness of the proposed scheme on the control of the distribution of idle-time. It can also provide a resolution to tardiness penalty for small and medium sized enterprises

Statistical Methods for Semiconductor Manufacturing

In this thesis techniques for non-parametric modeling, machine learning, filtering and prediction and run-to-run control for semiconductor manufacturing are described. In particular, algorithms have been developed for two major applications area: - Virtual Metrology (VM) systems; - Predictive Maintenance (PdM) systems. Both technologies have proliferated in the past recent years in the semiconductor industries, called fabs, in order to increment productivity and decrease costs. VM systems aim of predicting quantities on the wafer, the main and basic product of the semiconductor industry, that may be physically measurable or not. These quantities are usually ’costly’ to be measured in economic or temporal terms: the prediction is based on process variables and/or logistic information on the production that, instead, are always available and that can be used for modeling without further costs. PdM systems, on the other hand, aim at predicting when a maintenance action has to be performed. This approach to maintenance management, based like VM on statistical methods and on the availability of process/logistic data, is in contrast with other classical approaches: - Run-to-Failure (R2F), where there are no interventions performed on the machine/process until a new breaking or specification violation happens in the production; - Preventive Maintenance (PvM), where the maintenances are scheduled in advance based on temporal intervals or on production iterations. Both aforementioned approaches are not optimal, because they do not assure that breakings and wasting of wafers will not happen and, in the case of PvM, they may lead to unnecessary maintenances without completely exploiting the lifetime of the machine or of the process. The main goal of this thesis is to prove through several applications and feasibility studies that the use of statistical modeling algorithms and control systems can improve the efficiency, yield and profits of a manufacturing environment like the semiconductor one, where lots of data are recorded and can be employed to build mathematical models. We present several original contributions, both in the form of applications and methods. The introduction of this thesis will be an overview on the semiconductor fabrication process: the most common practices on Advanced Process Control (APC) systems and the major issues for engineers and statisticians working in this area will be presented. Furthermore we will illustrate the methods and mathematical models used in the applications. We will then discuss in details the following applications: - A VM system for the estimation of the thickness deposited on the wafer by the Chemical Vapor Deposition (CVD) process, that exploits Fault Detection and Classification (FDC) data is presented. In this tool a new clustering algorithm based on Information Theory (IT) elements have been proposed. In addition, the Least Angle Regression (LARS) algorithm has been applied for the first time to VM problems. - A new VM module for multi-step (CVD, Etching and Litography) line is proposed, where Multi-Task Learning techniques have been employed. - A new Machine Learning algorithm based on Kernel Methods for the estimation of scalar outputs from time series inputs is illustrated. - Run-to-Run control algorithms that employ both the presence of physical measures and statistical ones (coming from a VM system) is shown; this tool is based on IT elements. - A PdM module based on filtering and prediction techniques (Kalman Filter, Monte Carlo methods) is developed for the prediction of maintenance interventions in the Epitaxy process. - A PdM system based on Elastic Nets for the maintenance predictions in Ion Implantation tool is described. Several of the aforementioned works have been developed in collaborations with major European semiconductor companies in the framework of the European project UE FP7 IMPROVE (Implementing Manufacturing science solutions to increase equiPment pROductiVity and fab pErformance); such collaborations will be specified during the thesis, underlying the practical aspects of the implementation of the proposed technologies in a real industrial environment

Advanced Process Monitoring for Industry 4.0

This book reports recent advances on Process Monitoring (PM) to cope with the many challenges raised by the new production systems, sensors and “extreme data” conditions that emerged with Industry 4.0. Concepts such as digital-twins and deep learning are brought to the PM arena, pushing forward the capabilities of existing methodologies to handle more complex scenarios. The evolution of classical paradigms such as Latent Variable modeling, Six Sigma and FMEA are also covered. Applications span a wide range of domains such as microelectronics, semiconductors, chemicals, materials, agriculture, as well as the monitoring of rotating equipment, combustion systems and membrane separation processes

Modeling, design and scheduling of computer integrated manufacturing and demanufacturing systems

This doctoral dissertation work aims to provide a discrete-event system-based methodology for design, implementation, and operation of flexible and agile manufacturing and demanufacturing systems. After a review of the current academic and industrial activities in these fields, a Virtual Production Lines (VPLs) design methodology is proposed to facilitate a Manufacturing Execution System integrated with a shop floor system. A case study on a back-end semiconductor line is performed to demonstrate that the proposed methodology is effective to increase system throughput and decrease tardiness. An adaptive algorithm is proposed to deal with the machine failure and maintenance. To minimize the environmental impacts caused by end-of-life or faulty products, this research addresses the fundamental design and implementation issues of an integrated flexible demanufacturing system (IFDS). In virtue of the success of the VPL design and differences between disassembly and assembly, a systematic approach is developed for disassembly line design. This thesis presents a novel disassembly planning and demanufacturing scheduling method for such a system. Case studies on the disassembly of personal computers are performed illustrating how the proposed approaches work

A Review of the Teaching and Learning on Power Electronics Course

—In this review, we describe various kinds of problem and solution related teaching and learning on power electronics course all around the world. The method was used the study of literature on journal articles and proceedings published by reputable international organizations. Thirtynine papers were obtained using Boolean operators, according to the specified criteria. The results of the problems generally established that student learning motivation was low, teaching approaches that are still teacher-centered, the scope of the curriculum extends, and the physical limitations of laboratory equipment. The solutions offered are very diverse ranging from models, strategies, methods and learning techniques supported by information and communication technology