Voltage island-driven floorplanning.

Ma, Qiang.Thesis (M.Phil.)--Chinese University of Hong Kong, 2008.Includes bibliographical references (leaves 78-80).Abstracts in English and Chinese.Abstract --- p.iAcknowledgement --- p.ivChapter 1 --- Introduction --- p.1Chapter 1.1 --- Background --- p.1Chapter 1.2 --- Floorplanning --- p.2Chapter 1.3 --- Motivations --- p.4Chapter 1.4 --- Design Implementation of Voltage Islands --- p.5Chapter 1.5 --- Problem Formulation --- p.8Chapter 1.6 --- Progress on the Problem --- p.10Chapter 1.7 --- Contributions --- p.12Chapter 1.8 --- Thesis Organization --- p.14Chapter 2 --- Literature Review on MSV --- p.15Chapter 2.1 --- Introduction --- p.15Chapter 2.2 --- MSV at Post-floorplan/Post Placement Stage --- p.16Chapter 2.2.1 --- """Post-Placement Voltage Island Generation under Performance Requirement""" --- p.16Chapter 2.2.2 --- """Post-Placement Voltage Island Generation""" --- p.18Chapter 2.2.3 --- """Timing-Constrained and Voltage-Island-Aware Voltage Assignment""" --- p.19Chapter 2.2.4 --- """Voltage Island Generation under Performance Requirement for SoC Designs""" --- p.20Chapter 2.2.5 --- """An ILP Algorithm for Post-Floorplanning Voltage-Island Generation Considering Power-Network Planning""" --- p.21Chapter 2.3 --- MSV at Floorplan/Placement Stage --- p.22Chapter 2.3.1 --- """Architecting Voltage Islands in Core-based System-on-a- Chip Designs""" --- p.22Chapter 2.3.2 --- """Voltage Island Aware Floorplanning for Power and Timing Optimization""" --- p.23Chapter 2.4 --- Summary --- p.27Chapter 3 --- MSV Driven Floorplanning --- p.29Chapter 3.1 --- Introduction --- p.29Chapter 3.2 --- Problem Formulation --- p.32Chapter 3.3 --- Algorithm Overview --- p.33Chapter 3.4 --- Optimal Island Partitioning and Voltage Assignment --- p.33Chapter 3.4.1 --- Voltage Islands in Non-subtrees --- p.35Chapter 3.4.2 --- Proof of Optimality --- p.36Chapter 3.4.3 --- Handling Island with Power Down Mode --- p.37Chapter 3.4.4 --- Speedup in Implementation and Complexity --- p.38Chapter 3.4.5 --- Varying Background Chip-level Voltage --- p.39Chapter 3.5 --- Simulated Annealing --- p.39Chapter 3.5.1 --- Moves --- p.39Chapter 3.5.2 --- Cost Function --- p.40Chapter 3.6 --- Experimental Results --- p.40Chapter 3.6.1 --- Extension to Minimize Level Shifters --- p.45Chapter 3.6.2 --- Extension to Consider Power Network Routing --- p.46Chapter 3.7 --- Summary --- p.46Chapter 4 --- MSV Driven Floorplanning with Timing --- p.49Chapter 4.1 --- Introduction --- p.49Chapter 4.2 --- Problem Formulation --- p.52Chapter 4.3 --- Algorithm Overview --- p.56Chapter 4.4 --- Voltage Assignment Problem --- p.56Chapter 4.4.1 --- Lagrangian Relaxation --- p.58Chapter 4.4.2 --- Transformation into the Primal Minimum Cost Flow Problem --- p.60Chapter 4.4.3 --- Cost-Scaling Algorithm --- p.64Chapter 4.4.4 --- Solution Transformation --- p.66Chapter 4.5 --- Simulated Annealing --- p.69Chapter 4.5.1 --- Moves --- p.69Chapter 4.5.2 --- Speeding up heuristic --- p.69Chapter 4.5.3 --- Cost Function --- p.70Chapter 4.5.4 --- Annealing Schedule --- p.71Chapter 4.6 --- Experimental Results --- p.71Chapter 4.7 --- Summary --- p.72Chapter 5 --- Conclusion --- p.76Bibliography --- p.8

Elastic bundles :modelling and architecting asynchronous circuits with granular rigidity

PhD ThesisIntegrated Circuit (IC) designs these days are predominantly System-on-Chips (SoCs). The complexity of designing a SoC has increased rapidly over the years due to growing process and environmental variations coupled with global clock distribution di culty. Moreover, traditional synchronous design is not apt to handle the heterogeneous timing nature of modern SoCs. As a countermeasure, the semiconductor industry witnessed a strong revival of asynchronous design principles. A new paradigm of digital circuits emerged, as a result, namely mixed synchronous-asynchronous circuits. With a wave of recent innovations in synchronous-asynchronous CAD integration, this paradigm is showing signs of commercial adoption in future SoCs mainly due to the scope for reuse of synchronous functional blocks and IP cores, and the co-existence of synchronous and asynchronous design styles in a common EDA framework. However, there is a lack of formal methods and tools to facilitate mixed synchronousasynchronous design. In this thesis, we propose a formal model based on Petri nets with step semantics to describe these circuits behaviourally. Implication of this model in the veri cation and synthesis of mixed synchronous-asynchronous circuits is studied. Till date, this paradigm has been mainly explored on the basis of Globally Asynchronous Locally Synchronous (GALS) systems. Despite decades of research, GALS design has failed to gain traction commercially. To understand its drawbacks, a simulation framework characterising the physical and functional aspects of GALS SoCs is presented. A novel method for synthesising mixed synchronous-asynchronous circuits with varying levels of rigidity is proposed. Starting with a high-level data ow model of a system which is intrinsically asynchronous, the key idea is to introduce rigidity of chosen granularity levels in the model without changing functional behaviour. The system is then partitioned into functional blocks of synchronous and asynchronous elements before being transformed into an equivalent circuit which can be synthesised using standard EDA tools

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Design Methods and Tools for Application-Specific Predictable Networks-on-Chip

As the complexity of applications grows with each new generation, so does the demand for computation power. To satisfy the computation demands at manageable power levels, we see a shift in the design paradigm from single processor systems to Multiprocessor Systems-on-Chip (MPSoCs). MPSoCs leverage the parallelism in applications to increase the performance at the same power levels. To further improve the computation to power consumption ratio, MPSoCs for embedded applications are heterogeneous and integrate cores that are specialized to perform the different functionalities of the application. With technology scaling, wire power consumption is increasing compared to logic, making communication as expensive as computation. Therefore customizing the interconnect is necessary to achieve energy efficiency. Designing an optimal application specific Network-on-Chip (NoC), that meets application demands, requires the exploration of a large design space. Automatic design and optimization of the NoC is required in order to achieve fast design closure, especially for heterogeneous MPSoCs. To continue to meet the computation requirements of future applications new technologies are emerging. Three dimensional integration promises to increase the number of transistors by stacking multiple silicon layers. This will lead to an increase in the number of cores of the MPSoCs resulting in increased communication demands. To compensate for the increase in the wire delay in new technology nodes as well as to reduce the power consumption further, multi-synchronous design is becoming popular. With multiple clock signals, different parts of the MPSoC can be clocked at different frequencies according to the current demands of the application and can even be shutdown when they are not used at all. This further complicates the design of the NoC.Many applications require different levels of guarantee from the NoC in order to perform their functionality correctly. As communication traffic patterns become more complex, the performance of the NoC can no longer be predicted statically. Therefore designing the interconnect network requires that such guarantees are provided during the dynamic operation of the system which includes the interaction with major subsystems (i.e., main memory) and not just the interconnect itself. In this thesis, I present novel methods to design application-specific NoCs that meet performance demands, under the constraints of new technologies. To provide different levels of Quality of Service, I integrate methods to estimate the NoC performance during the design phase of the interconnect topology. I present methods and architectures for NoCs to efficiently access memory systems, in order to achieve predictable operation of the systems from the point of view of the communication as well as the bottleneck target devices. Therefore the main contribution of the thesis is twofold: scientific as I propose new algorithms to perform topology synthesis and engineering by presenting extensive experiments and architectures for NoC design

Design of Thermal Management Control Policies for Multiprocessors Systems on Chip

The contribution of this thesis is a thorough study of thermal aware policy design for MPSoCs. The study includes the modelling of their thermal behavior as well as the improvement and the definition of new thermal management and balancing policies. The work is structured on three main specific disciplines. The areas of contributions are: modeling, algorithms and system design. This thesis extends the field of modeling by proposing new techniques to represent the thermal behavior of MPSoCs using a mathematical formalization. Heat transfer and modelling of physical properties of MPSoCs have been extensively studied. Special emphasis is given to the way the system cools down (i.e. micro-cooling, natural heat dissipation etc.) and the heat propagates inside the MPSoC. The second contribution of this work is related to policies, which manage MPSoC working frequencies and micro-cooling pumps to satisfy user requirements in the most effective possible way, while consuming the lowest possible amount of resources. Several families of thermal policies algorithms have been studied and analyzed in this work for both 2D and 3D MPSoCs including liquid cooling technologies. The discipline of system design has also been extended during the development of this thesis. Thermal management policies have been implemented in real emulation platforms and contributions in this area are related to the design and implementation of proposed innovations in real MPSoC platforms

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

Heurísticas bioinspiradas para el problema de Floorplanning 3D térmico de dispositivos MPSoCs

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leída el 20-06-2013Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Architectural-Physical Co-Design of 3D CPUs with Micro-Fluidic Cooling

The performance, energy efficiency and cost improvements due to traditional technology scaling have begun to slow down and present diminishing returns. Underlying reasons for this trend include fundamental physical limits of transistor scaling, the growing significance of quantum effects as transistors shrink, and a growing mismatch between transistors and interconnects regarding size, speed and power. Continued Moore's Law scaling will not come from technology scaling alone, and must involve improvements to design tools and development of new disruptive technologies such as 3D integration. 3D integration presents potential improvements to interconnect power and delay by translating the routing problem into a third dimension, and facilitates transistor density scaling independent of technology node. Furthermore, 3D IC technology opens up a new architectural design space of heterogeneously-integrated high-bandwidth CPUs. Vertical integration promises to provide the CPU architectures of the future by integrating high performance processors with on-chip high-bandwidth memory systems and highly connected network-on-chip structures. Such techniques can overcome the well-known CPU performance bottlenecks referred to as memory and communication wall. However the promising improvements to performance and energy efficiency offered by 3D CPUs does not come without cost, both in the financial investments to develop the technology, and the increased complexity of design. Two main limitations to 3D IC technology have been heat removal and TSV reliability. Transistor stacking creates increases in power density, current density and thermal resistance in air cooled packages. Furthermore the technology introduces vertical through silicon vias (TSVs) that create new points of failure in the chip and require development of new BEOL technologies. Although these issues can be controlled to some extent using thermal-reliability aware physical and architectural 3D design techniques, high performance embedded cooling schemes, such as micro-fluidic (MF) cooling, are fundamentally necessary to unlock the true potential of 3D ICs. A new paradigm is being put forth which integrates the computational, electrical, physical, thermal and reliability views of a system. The unification of these diverse aspects of integrated circuits is called Co-Design. Independent design and optimization of each aspect leads to sub-optimal designs due to a lack of understanding of cross-domain interactions and their impacts on the feasibility region of the architectural design space. Co-Design enables optimization across layers with a multi-domain view and thus unlocks new high-performance and energy efficient configurations. Although the co-design paradigm is becoming increasingly necessary in all fields of IC design, it is even more critical in 3D ICs where, as we show, the inter-layer coupling and higher degree of connectivity between components exacerbates the interdependence between architectural parameters, physical design parameters and the multitude of metrics of interest to the designer (i.e. power, performance, temperature and reliability). In this dissertation we present a framework for multi-domain co-simulation and co-optimization of 3D CPU architectures with both air and MF cooling solutions. Finally we propose an approach for design space exploration and modeling within the new Co-Design paradigm, and discuss the possible avenues for improvement of this work in the future

Automatic synthesis and optimization of chip multiprocessors

The microprocessor technology has experienced an enormous growth during the last decades. Rapid downscale of the CMOS technology has led to higher operating frequencies and performance densities, facing the fundamental issue of power dissipation. Chip Multiprocessors (CMPs) have become the latest paradigm to improve the power-performance efficiency of computing systems by exploiting the parallelism inherent in applications. Industrial and prototype implementations have already demonstrated the benefits achieved by CMPs with hundreds of cores.CMP architects are challenged to take many complex design decisions. Only a few of them are:- What should be the ratio between the core and cache areas on a chip?- Which core architectures to select?- How many cache levels should the memory subsystem have?- Which interconnect topologies provide efficient on-chip communication?These and many other aspects create a complex multidimensional space for architectural exploration. Design Automation tools become essential to make the architectural exploration feasible under the hard time-to-market constraints. The exploration methods have to be efficient and scalable to handle future generation on-chip architectures with hundreds or thousands of cores.Furthermore, once a CMP has been fabricated, the need for efficient deployment of the many-core processor arises. Intelligent techniques for task mapping and scheduling onto CMPs are necessary to guarantee the full usage of the benefits brought by the many-core technology. These techniques have to consider the peculiarities of the modern architectures, such as availability of enhanced power saving techniques and presence of complex memory hierarchies.This thesis has several objectives. The first objective is to elaborate the methods for efficient analytical modeling and architectural design space exploration of CMPs. The efficiency is achieved by using analytical models instead of simulation, and replacing the exhaustive exploration with an intelligent search strategy. Additionally, these methods incorporate high-level models for physical planning. The related contributions are described in Chapters 3, 4 and 5 of the document.The second objective of this work is to propose a scalable task mapping algorithm onto general-purpose CMPs with power management techniques, for efficient deployment of many-core systems. This contribution is explained in Chapter 6 of this document.Finally, the third objective of this thesis is to address the issues of the on-chip interconnect design and exploration, by developing a model for simultaneous topology customization and deadlock-free routing in Networks-on-Chip. The developed methodology can be applied to various classes of the on-chip systems, ranging from general-purpose chip multiprocessors to application-specific solutions. Chapter 7 describes the proposed model.The presented methods have been thoroughly tested experimentally and the results are described in this dissertation. At the end of the document several possible directions for the future research are proposed

Modeling DVFS and Power-Gating Actuators for Cycle-Accurate NoC-Based Simulators

Networks-on-chip (NoCs) are a widely recognized viable interconnection paradigm to support the multi-core revolution. One of the major design issues of multicore architectures is still the power, which can no longer be considered mainly due to the cores, since the NoC contribution to the overall energy budget is relevant. To face both static and dynamic power while balancing NoC performance, different actuators have been exploited in literature, mainly dynamic voltage frequency scaling (DVFS) and power gating. Typically, simulation-based tools are employed to explore the huge design space by adopting simplified models of the components. As a consequence, the majority of state-of-the-art on NoC power-performance optimization do not accurately consider timing and power overheads of actuators, or (even worse) do not consider them at all, with the risk of overestimating the benefits of the proposed methodologies. This article presents a simulation framework for power-performance analysis of multicore architectures with specific focus on the NoC. It integrates accurate power gating and DVFS models encompassing also their timing and power overheads. The value added of our proposal is manyfold: (i) DVFS and power gating actuators are modeled starting from SPICE-level simulations; (ii) such models have been integrated in the simulation environment; (iii) policy analysis support is plugged into the framework to enable assessment of different policies; (iv) a flexible GALS (globally asynchronous locally synchronous) support is provided, covering both handshake and FIFO re-synchronization schemas. To demonstrate both the flexibility and extensibility of our proposal, two simple policies exploiting the modeled actuators are discussed in the article