Design, Extraction, and Optimization Tool Flows and Methodologies for Homogeneous and Heterogeneous Multi-Chip 2.5D Systems

Chip and packaging industries are making significant progress in 2.5D design as a result of increasing popularity of their application. In advanced high-density 2.5D packages, package redistribution layers become similar to chip Back-End-of-Line routing layers, and the gap between them scales down with pin density improvement. Chiplet-package interactions become significant and severely affect system performance and reliability. Moreover, 2.5D integration offers opportunities to apply novel design techniques. The traditional die-by-die design approach neither carefully considers these interactions nor fully exploits the cross-boundary design opportunities. This thesis presents chiplet-package cross-boundary design, extraction, analysis, and optimization tool flows and methodologies for high-density 2.5D packaging technologies. A holistic flow is presented that can capture all parasitics from chiplets and the package and improve system performance through iterative optimizations. Several design techniques are demonstrated for agile development and quick turn-around time. To validate the flow in silicon, a chip was taped out and studied in TSMC 65nm technology. As the holistic flow cannot handle heterogeneous technologies, in-context flows are presented. Three different flavors of the in-context flow are presented, which offer trade-offs between scalability and accuracy in heterogeneous 2.5D system designs. Inductance is an inseparable part of a package design. A holistic flow is presented that takes package inductance into account in timing analysis and optimization steps. Custom CAD tools are developed to make these flows compatible with the industry standard tools and the foundry model. To prove the effectiveness of the flows several design cases of an ARM Cortex-M0 are implemented for comparitive study

Block-level Designs of Die-to-Wafer Bonded 3D ICs and Their Design Quality Tradeoffs

Abstract-In 3D ICs, block-level designs provide various advantages over designs done at other granularity such as gate-level because they promote the reuse of IP blocks. In this paper, we study block-level 3D-IC designs, where the footprint of the dies in the stack are different. This happens in case of die-to-wafer bonding, which is more popular choice for near-term low-cost 3D designs. We study design quality tradeoffs among three different ways to place through-silicon vias (TSVs): TSV-farm, TSV-distributed, and TSV-whitespace. In our holistic approach, we use wirelength, power, performance, temperature, and mechanical stress metrics to conduct comprehensive comparative studies on the three design styles. In addition, we provide analysis on the impact of TSV size and pitch on the design quality of these three styles

Placement for fast and reliable through-silicon-via (TSV) based 3D-IC layouts

The objective of this research is to explore the feasibility of addressing the major performance and reliability problems or issues, such as wirelength, stress-induced carrier mobility variation, temperature, and quality trade-offs, found in three-dimensional integrated circuits (3D ICs) that use through-silicon vias (TSVs) at placement stage. Four main works that support this goal are included. In the first work, wirelength of TSV-based 3D ICs is the main focus. In the second work, stress-induced carrier mobility variation in TSV-based 3D ICs is examined. In the third work, temperature inside TSV-based 3D ICs is investigated. In the final work, the quality trade-offs of TSV-based 3D-IC designs are explored. In the first work, a force-directed, 3D, and gate-level placement algorithm that efficiently handles TSVs is developed. The experiments based on synthesized benchmarks indicate that the developed algorithm helps generate GDSII layouts of 3D-IC designs that are optimized in terms of wirelength. In addition, the impact of TSVs on other physical aspects of 3D-IC designs is also studied by analyzing the GDSII layouts. In the second work, the model for carrier mobility variation caused by TSV and STI stresses is developed as well as the timing analysis flow considering the stresses. The impact of TSV and STI stresses on carrier mobility variation and performance of 3D ICs is studied. Furthermore, a TSV-stress-driven, force-directed, and 3D placement algorithm is developed. It exploits carrier mobility variation, caused by stress around TSVs after fabrication, to improve the timing and area objectives during placement. In addition, the impact of keep-out zone (KOZ) around TSVs on stress, carrier mobility variation, area, wirelength, and performance of 3D ICs is studied. In the third work, two temperature-aware global placement algorithms are developed. They exploit die-to-die thermal coupling in 3D ICs to improve temperature during placement. In addition, a framework used to evaluate the results from temperature-aware global placements is developed. The main component of the framework is a GDSII-level thermal analysis that considers all structures inside a TSV-based 3D IC while computing temperature. The developed placers are compared with several state-of-the-art placers published in recent literature. The experimental results indicate that the developed algorithms help improve the temperature of 3D ICs effectively. In the final work, three block-level design styles for TSV-based die-to-wafer bonded 3D ICs are discussed. Several 3D-IC layouts in the three styles are manually designed. The main difference among these layouts is the position of TSVs. Finally, the area, wirelength, timing, power, temperature, and mechanical stress of all layouts are compared to explore the trade-offs of layout quality.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Mukhopadhyay, Saibal; Committee Member: Swaminathan, Madhava

EFFICIENT HARDWARE PRIMITIVES FOR SECURING LIGHTWEIGHT SYSTEMS

In the era of IoT and ubiquitous computing, the collection and communication of sensitive data is increasingly being handled by lightweight Integrated Circuits. Efficient hardware implementations of crytographic primitives for resource constrained applications have become critical, especially block ciphers which perform fundamental operations such as encryption, decryption, and even hashing. We study the efficiency of block ciphers under different implementation styles. For low latency applications that use unrolled block cipher implementations, we design a glitch filter to reduce energy consumption. For lightweight applications, we design a novel architecture for the widely used AES cipher. The design eliminates inefficiencies in data movement and clock activity, thereby significantly improving energy efficiency over state-of-the-art architectures. Apart from efficiency, vulnerability to implementation attacks are a concern, which we mitigate by our randomization capable lightweight AES architecture. We fabricate our designs in a commercial 16nm FinFET technology and present measured testchip data on energy consumption and side channel resistance. Finally, we address the problem of supply chain security by using image processing techniques to extract fingerprints from surface texture of plastic IC packages for IC authentication and counterfeit prevention. Collectively these works present efficient and cost effective solutions to secure lightweight systems

A review of advances in pixel detectors for experiments with high rate and radiation

The Large Hadron Collider (LHC) experiments ATLAS and CMS have established hybrid pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and radiation environments, as they operate close to the LHC interaction points. With the High Luminosity-LHC upgrade now in sight, for which the tracking detectors will be completely replaced, new generations of pixel detectors are being devised. They have to address enormous challenges in terms of data throughput and radiation levels, ionizing and non-ionizing, that harm the sensing and readout parts of pixel detectors alike. Advances in microelectronics and microprocessing technologies now enable large scale detector designs with unprecedented performance in measurement precision (space and time), radiation hard sensors and readout chips, hybridization techniques, lightweight supports, and fully monolithic approaches to meet these challenges. This paper reviews the world-wide effort on these developments.Comment: 84 pages with 46 figures. Review article.For submission to Rep. Prog. Phy

High level behavioural modelling of boundary scan architecture.

This project involves the development of a software tool which enables the integration of the IEEE 1149.1/JTAG Boundary Scan Test Architecture automatically into an ASIC (Application Specific Integrated Circuit) design. The tool requires the original design (the ASIC) to be described in VHDL-IEEE 1076 Hardware Description Language. The tool consists of the two major elements: i) A parsing and insertion algorithm developed and implemented in 'C'; ii) A high level model of the Boundary Scan Test Architecture implemented in 'VHDL'. The parsing and insertion algorithm is developed to deal with identifying the design Input/Output (I/O) terminals, their types and the order they appear in the ASIC design. It then attaches suitable Boundary Scan Cells to each I/O, except power and ground and inserts the high level models of the full Boundary Scan Architecture into the ASIC without altering the design core structure

Algorithmic studies on PCB routing

As IC technology advances, the package size keeps shrinking while the pin count of a package keeps increasing. A modern IC package can have a pin count of thousands. As a result, a complex printed circuit board (PCB) can host more than ten thousand signal nets. Such a huge pin count and net count make manual design of packages and PCBs an extremely time-consuming and error-prone task. On the other hand, increasing clock frequency imposes various physical constraints on PCB routing. These constraints make traditional IC and PCB routers not applicable to modern PCB routing. To the best of our knowledge, there is no mature commercial or academic automated router that handles these constraints well. Therefore, automated PCB routers that are tuned to handle such constraints become a necessity in modern design. In this dissertation, we propose novel algorithms for three major aspects of PCB routing: escape routing, area routing and layer assignment. Escape routing for packages and PCBs has been studied extensively in the past. Network flow is pervasively used to model this problem. However, previous studies are incomplete in two senses. First, none of the previous works correctly model the diagonal capacity, which is essential for 45 degree routing in most packages and PCBs. As a result, existing algorithms may either produce routing solutions that violate the diagonal capacity or fail to output a legal routing even though one exists. Second, few works discuss the escape routing problem of differential pairs. In high-performance PCBs, many critical nets use differential pairs to transmit signals. How to escape differential pairs from a pin array is an important issue that has received too little attention in the literature. In this dissertation, we propose a new network flow model that guarantees the correctness when diagonal capacity is taken into consideration. This model leads to the first optimal algorithm for escape routing. We also extend our model to handle missing pins. We then propose two algorithms for the differential pair escape routing problem. The first one computes the optimal routing for a single differential pair while the second one is able to simultaneously route multiple differential pairs considering both routability and wire length. We then propose a two-stage routing scheme based on the two algorithms. In our routing scheme, the second algorithm is used to generate initial routing and the first algorithm is used to perform rip-up and reroute. Length-constrained routing is another very important problem for PCB routing. Previous length-constrained routers all have assumptions on the routing topology. We propose a routing scheme that is free of any restriction on the routing topology. The novelty of our proposed routing scheme is that we view the length-constrained routing problem as an area assignment problem and use a placement structure to help transform the area assignment problem into a mathematical programming problem. Experimental results show that our routing scheme can handle practical designs that previous routers cannot handle. For designs that they could handle, our router runs much faster. Length-constrained routing requires the escaped nets to have matching ordering along the boundaries of the pin arrays. However, in some practical designs, the net ordering might be mismatched. To address this issue, we propose a preprocessing step to untangle such twisted nets. We also introduce a practical routing style, which we call single-detour routing, to simplify the untangling problem. We discover a necessary and sufficient condition for the existence of single-detour routing solutions and present a dynamic programming based algorithm that optimally solves the problem. By integrating our algorithm into the bus router in a length-constrained router, we show that many routing problems that cannot be solved previously can now be solved with insignificant increase in runtime. The nets on a PCB are usually grouped into buses. Because of the high pin density of the packages, the buses need to be assigned into multiple routing layers. We propose a layer assignment algorithm to assign a set of buses into multiple layers without causing any conflict. Our algorithm guarantees to produce a layer assignment with minimum number of layers. The key idea is to transform the layer assignment problem into a bipartite matching problem. This research result is an improvement over a previous work, which is optimal for only one layer

Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications

Im Rahmen der vorliegenden Dissertation zum Thema „Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications“ wurde auf Basis einer 130 nm SiGe BiCMOS Technologie ein Through-Silicon Via (TSV) Technologiemodul zur Herstellung elektrischer Durchkontaktierungen für die Anwendung im Millimeterwellen und Sub-THz Frequenzbereich entwickelt. TSVs wurden mittels elektromagnetischer Simulationen modelliert und in Bezug auf ihre elektrischen Eigenschaften bis in den sub-THz Bereich bis zu 300 GHz optimiert. Es wurden die Wechselwirkungen zwischen Modellierung, Fertigungstechnologie und den elektrischen Eigenschaften untersucht. Besonderes Augenmerk wurde auf die technologischen Einflussfaktoren gelegt. Daraus schlussfolgernd wurde das TSV Technologiemodul entwickelt und in eine SiGe BiCMOS Technologie integriert. Hierzu wurde eine Via-Middle Integration gewählt, welche eine Freilegung der TSVs von der Wafer Rückseite erfordert. Durch die geringe Waferdicke von ca. 75 μm wird einen Carrier Wafer Handling Prozess verwendet. Dieser Prozess wurde unter der Randbedingung entwickelt, dass eine nachfolgende Bearbeitung der Wafer innerhalb der BiCMOS Pilotlinie erfolgen kann. Die Rückseitenbearbeitung zielt darauf ab, einen Redistribution Layer auf der Rückseite der BiCMOS Wafer zu realisieren. Hierzu wurde ein Prozess entwickelt, um gleichzeitig verschiedene TSV Strukturen mit variablen Geometrien zu realisieren und damit eine hohe TSV Design Flexibilität zu gewährleisten. Die TSV Strukturen wurden von DC bis über 300 GHz charakterisiert und die elektrischen Eigenschaften extrahiert. Dabei wurde gezeigt, dass TSV Verbindungen mit sehr geringer Dämpfung <1 dB bis 300 GHz realisierbar sind und somit ausgezeichnete Hochfrequenzeigenschaften aufweisen. Zuletzt wurden vielfältige Anwendungen wie das Grounding von Hochfrequenzschaltkreisen, Interposer mit Waveguides und 300 GHz Antennen dargestellt. Das Potential für Millimeterwellen Packaging und 3D Integration wurde evaluiert. TSV Technologien sind heutzutage in vielen Anwendungen z.B. im Bereich der Systemintegration von Digitalschaltkreisen und der Spannungsversorgung von integrierten Schaltkreisen etabliert. Im Rahmen dieser Arbeit wurde der Einsatz von TSVs für Millimeterwellen und dem sub-THz Frequenzbereich untersucht und die Anwendung für den sub-THz Bereich bis 300 GHz demonstriert. Dadurch werden neue Möglichkeiten der Systemintegration und des Packaging von Höchstfrequenzsystemen geschaffen.:Bibliographische Beschreibung List of symbols and abbreviations Acknowledgement 1. Introduction 2. FEM Modeling of BiCMOS & Interposer Through-Silicon Vias 3. Fabrication of BiCMOS & Silicon Interposer with TSVs 4. Characterization of BiCMOS Embedded Through-Silicon Vias 5. Applications 6. Conclusion and Future Work 7. Appendix 8. Publications & Patents 9. Bibliography 10. List of Figures and Table