2,776 research outputs found
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Electromigration modeling and layout optimization for advanced VLSI
textElectromigration (EM) is a critical problem for interconnect reliability in advanced VLSI design. Because EM is a strong function of current density, a smaller cross-sectional area of interconnects can degrade the EM-related lifetime of IC, which is expected to become more severe in future technology nodes. Moreover, as EM is governed by various factors such as temperature, material property, geometrical shape, and mechanical stress, different interconnect structures can have distinct EM issues and solutions to mitigate them. For example, one of the most prominent technologies, die stacking technology of three-dimensional (3D) ICs, can have different EM problems from that of planer ICs, due to their unique interconnects such as through-silicon vias (TSVs).
This dissertation investigates EM in various interconnect structures, and applies the EM models to optimize IC layout. First, modeling of EM is developed for chip-level interconnects, such as wires, local vias, TSVs, and multi-scale vias (MSVs). Based on the models, fast and accurate EM-prediction methods are proposed for the chip-level designs. After that, by utilizing the EM-prediction methods, the layout optimization methods are suggested, such as EM-aware routing for 3D ICs and EM-aware redundant via insertion for the future technology nodes in VLSI.
Experimental results show that the proposed EM modeling approaches enable fast and accurate EM evaluation for chip design, and the EM-aware layout optimization methods improve EM-robustness of advanced VLSI designs.Electrical and Computer Engineerin
HIGH PERFORMANCE CLOCK DISTRIBUTION FOR HIGH-SPEED VLSI SYSTEMS
Tohoku University堀口 進課
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Standard cell optimization and physical design in advanced technology nodes
Integrated circuits (ICs) are at the heart of modern electronics, which rely heavily on the state-of-the-art semiconductor manufacturing technology. The key to pushing forward semiconductor technology is IC feature-size miniaturization. However, this brings ever-increasing design complexities and manufacturing challenges to the $340 billion semiconductor industry. The manufacturing of two-dimensional layout on high-density metal layers depends on complex design-for-manufacturing techniques and sophisticated empirical optimizations, which introduces huge amounts of turnaround time and yield loss in advanced technology nodes. Our study reveals that unidirectional layout design can significantly reduce the manufacturing complexities and improve the yield, which is becoming increasingly adopted in semiconductor industry [61, 89]. The lithography printing of unidirectional layout can be tightly controlled using advanced patterning techniques, such as self-aligned double and quadruple patterning. Despite the manufacturing benefits, unidirectional layout leads to more restrictive solution space and brings significant impacts on the IC design automation ow for routing closure. Notably, unidirectional routing limits the standard cell pin accessibility, which further exacerbates the resource competitions during routing. Moreover, for post-routing optimization, traditional redundant-via insertion has become obsolete under unidirectional routing style, which makes the yield enhancement task extremely challenging. Regardless of complex multiple patterning and design-for-manufacturing approaches, mask optimization through resolution enhancement techniques remains as the key strategy to improve the yield of the semiconductor manufacturing processes. Among them, Sub-Resolution Assist Feature (SRAF) generation is a very important method to improve lithographic process windows. Model-based SRAF generation has been widely used to achieve high accuracy but it is time-consuming and hard to obtain consistent SRAFs. This dissertation proposes novel CAD algorithms and methodologies for standard cell optimization and physical design in advanced technology nodes, which ultimately reduces the design cycle and manufacturing cost of IC design. First, a standard cell pin access optimization engine is proposed to evaluate the pin accessibility of a given standard cell library. We further propose novel pin access planning techniques and concurrent pin access optimizations to efficiently resolve the routing resource competitions, which generates much better routing solutions than state-of-the-art, manufacturing-friendly routers. To systematically improve the manufacturing yield in the post-routing stage, a global optimization engine has been introduced for redundant local-loop insertion considering advanced manufacturing constraints. Finally, we propose the first machine learning-based framework for fast yet consistent SRAF generation with the high quality of results.Electrical and Computer Engineerin
Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits
Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount
The 30/20 GHz flight experiment system, phase 2. Volume 2: Experiment system description
A detailed technical description of the 30/20 GHz flight experiment system is presented. The overall communication system is described with performance analyses, communication operations, and experiment plans. Hardware descriptions of the payload are given with the tradeoff studies that led to the final design. The spacecraft bus which carries the payload is discussed and its interface with the launch vehicle system is described. Finally, the hardwares and the operations of the terrestrial segment are presented
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Improved Physical Design for Manufacturing Awareness and Advanced VLSI
Increasing challenges arise with each new semiconductor technology node, especially in advanced nodes, where the industry tries to extract every ounce of benefit as it approaches the limits of physics, through manufacturing-aware design technology co-optimization and design-based equivalent scaling. The increasing complexity of design and process technologies, and ever-more complex design rules, also become hurdles for academic researchers, separating academic researchers from the most up-to-date technical issues.This thesis presents innovative methodologies and optimizations to address the above challenges. There are three directions in this thesis: (i) manufacturing-aware design technology co-optimization; (ii) advanced node design-based equivalent scaling; and (iii) an open source academic detailed routing flow.To realize manufacturing-aware design technology co-optimization, this thesis presents two works: (i) a multi-row detailed placement optimization for neighbor diffusion effect mitigation between neighboring standard cells; and (ii) a post-routing optimization to generate 2D block mask layout for dummy segment removal in self-aligned multiple patterning.To achieve advanced node design-based equivalent scaling, this thesis presents two improved physical design methodologies: (i) a post-placement flop tray generation approach for clock power reduction; and (ii) a detailed placement approach to exploit inter-row M1 routing for congestion and wirelength reduction.To address the increasing gap between academia and industry, this thesis presents two works toward an open source academic detailed routing flow: (i) a complete, robust, scalable and design ruleaware dynamic programming-based pin access analysis framework; and (ii) TritonRoute – the open source detailed router that is capable of delivering DRC-clean detailed routing solutions in advanced nodes.This thesis concludes with a summary of its contributions and open directions for future research
Practical Techniques for Improving Performance and Evaluating Security on Circuit Designs
As the modern semiconductor technology approaches to nanometer era, integrated circuits (ICs) are facing more and more challenges in meeting performance demand and security. With the expansion of markets in mobile and consumer electronics, the increasing demands require much faster delivery of reliable and secure IC products. In order to improve the performance and evaluate the security of emerging circuits, we present three practical techniques on approximate computing, split manufacturing and analog layout automation. Approximate computing is a promising approach for low-power IC design. Although a few accuracy-configurable adder (ACA) designs have been developed in the past, these designs tend to incur large area overheads as they rely on either redundant computing or complicated carry prediction. We investigate a simple ACA design that contains no redundancy or error detection/correction circuitry and uses very simple carry prediction. The simulation results show that our design dominates the latest previous work on accuracy-delay-power tradeoff while using 39% less area. One variant of this design provides finer-grained and larger tunability than that of the previous works. Moreover, we propose a delay-adaptive self-configuration technique to further improve the accuracy-delay-power tradeoff. Split manufacturing prevents attacks from an untrusted foundry. The untrusted foundry has front-end-of-line (FEOL) layout and the original circuit netlist and attempts to identify critical components on the layout for Trojan insertion. Although defense methods for this scenario have been developed, the corresponding attack technique is not well explored. Hence, the defense methods are mostly evaluated with the k-security metric without actual attacks. We develop a new attack technique based on structural pattern matching. Experimental comparison with existing attack shows that the new attack technique achieves about the same success rate with much faster speed for cases without the k-security defense, and has a much better success rate at the same runtime for cases with the k-security defense. The results offer an alternative and practical interpretation for k-security in split manufacturing.
Analog layout automation is still far behind its digital counterpart. We develop the layout automation framework for analog/mixed-signal ICs. A hierarchical layout synthesis flow which works in bottom-up manner is presented. To ensure the qualified layouts for better circuit performance, we use the constraint-driven placement and routing methodology which employs the expert knowledge via design constraints. The constraint-driven placement uses simulated annealing process to find the optimal solution. The packing represented by sequence pairs and constraint graphs can simultaneously handle different kinds of placement constraints. The constraint-driven routing consists of two stages, integer linear programming (ILP) based global routing and sequential detailed routing. The experiment results demonstrate that our flow can handle complicated hierarchical designs with multiple design constraints. Furthermore, the placement performance can be further improved by using mixed-size block placement which works on large blocks in priority
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