Heterogeneous 2.5D integration on through silicon interposer

© 2015 AIP Publishing LLC. Driven by the need to reduce the power consumption of mobile devices, and servers/data centers, and yet continue to deliver improved performance and experience by the end consumer of digital data, the semiconductor industry is looking for new technologies for manufacturing integrated circuits (ICs). In this quest, power consumed in transferring data over copper interconnects is a sizeable portion that needs to be addressed now and continuing over the next few decades. 2.5D Through-Si-Interposer (TSI) is a strong candidate to deliver improved performance while consuming lower power than in previous generations of servers/data centers and mobile devices. These low-power/high-performance advantages are realized through achievement of high interconnect densities on the TSI (higher than ever seen on Printed Circuit Boards (PCBs) or organic substrates), and enabling heterogeneous integration on the TSI platform where individual ICs are assembled at close proximity

Multiphysics modeling and simulation for large-scale integrated circuits

This dissertation is a process of seeking solutions to two important and challenging problems related to the design of modern integrated circuits (ICs): the ever increasing couplings among the multiphysics and the large problem size arising from the escalating complexity of the designs. A multiphysics-based computer-aided design methodology is proposed and realized to address multiple aspects of a design simultaneously, which include electromagnetics, heat transfer, fluid dynamics, and structure mechanics. The multiphysics simulation is based on the finite element method for its unmatched capabilities in handling complicate geometries and material properties. The capability of the multiphysics simulation is demonstrated through its applications in a variety of important problems, including the static and dynamic IR-drop analyses of power distribution networks, the thermal-ware high-frequency characterization of through-silicon-via structures, the full-wave electromagnetic analysis of high-power RF/microwave circuits, the modeling and analysis of three-dimensional ICs with integrated microchannel cooling, the characterization of micro- and nanoscale electrical-mechanical systems, and the modeling of decoupling capacitor derating in the power integrity simulations. To perform the large-scale analysis in a highly efficient manner, a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme are incorporated into the proposed multiphysics simulation. Significant reduction in computation time is achieved through the two numerical schemes and the parallel computing with multiple processors

Efficient and Scalable Computing for Resource-Constrained Cyber-Physical Systems: A Layered Approach

With the evolution of computing and communication technology, cyber-physical systems such as self-driving cars, unmanned aerial vehicles, and mobile cognitive robots are achieving increasing levels of multifunctionality and miniaturization, enabling them to execute versatile tasks in a resource-constrained environment. Therefore, the computing systems that power these resource-constrained cyber-physical systems (RCCPSs) have to achieve high efficiency and scalability. First of all, given a fixed amount of onboard energy, these computing systems should not only be power-efficient but also exhibit sufficiently high performance to gracefully handle complex algorithms for learning-based perception and AI-driven decision-making. Meanwhile, scalability requires that the current computing system and its components can be extended both horizontally, with more resources, and vertically, with emerging advanced technology. To achieve efficient and scalable computing systems in RCCPSs, my research broadly investigates a set of techniques and solutions via a bottom-up layered approach. This layered approach leverages the characteristics of each system layer (e.g., the circuit, architecture, and operating system layers) and their interactions to discover and explore the optimal system tradeoffs among performance, efficiency, and scalability. At the circuit layer, we investigate the benefits of novel power delivery and management schemes enabled by integrated voltage regulators (IVRs). Then, between the circuit and microarchitecture/architecture layers, we present a voltage-stacked power delivery system that offers best-in-class power delivery efficiency for many-core systems. After this, using Graphics Processing Units (GPUs) as a case study, we develop a real-time resource scheduling framework at the architecture and operating system layers for heterogeneous computing platforms with guaranteed task deadlines. Finally, fast dynamic voltage and frequency scaling (DVFS) based power management across the circuit, architecture, and operating system layers is studied through a learning-based hierarchical power management strategy for multi-/many-core systems

High-frequency characterization of embedded components in printed circuit boards

The embedding of electronic components is a three-dimensional packaging technology, where chips are placed inside of the printed circuit board instead of on top. The advantage of this technology is the reduced electronic interconnection length between components. The shorter this connection, the faster the signal transmission can occur. Different high-frequency aspects of chip embedding are investigated within this dissertation: interconnections to the embedded chip, crosstalk between signals on the chip and on the board, and interconnections running on top of or underneath embedded components. The high-frequency behavior of tracks running near embedded components is described using a broadband model for multilayer microstrip transmission lines. The proposed model can be used to predict the characteristic impedance and the loss of the lines. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The per-unit-length shunt impedance parameters are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of a frequency-dependent effective height that can be used to determine the per-unit-length resistance and inductance. A deliberate choice was made for a simple but accurate model that could easily be implemented in current high-frequency circuit simulators. Next to quasi-static electromagnetic simulations, a dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model. The verification of the model using simulation and measurements shows that the proposed model slightly overestimates the loss of the measured multilayer microstrips, but is more accurate than the simulations in predicting the characteristic impedance