Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes

Today, power electronic reliability is a main subject of interest for many companies and laboratories. The main process leading to the IGBT failure is the cycling thermal stress. Indeed the current flow induce local heating and then mechanical stress. This paper deals with electro thermal stress under steady and transient current states. The main objective is to test bonded wires with active current cycle. Consequently, the thermo mechanical stress is obtained. A numerical 3D finite element model is presented and some experimental results are given. Indeed an infrared system monitors the temperature dispatching from an experimental test bench under active current cycle. The overall study is a first step before a global simulation (electrical thermal-mechanical) in order to optimize some geometric parameters of the packaging

Strain gage system evaluation program

A program was conducted to determine the reliability of various strain gage systems when applied to rotating compressor blades in an aircraft gas turbine engine. A survey of current technology strain gage systems was conducted to provide a basis for selecting candidate systems for evaluation. Testing and evaluation was conducted in an F 100 engine. Sixty strain gage systems of seven different designs were installed on the first and third stages of an F 100 engine fan. Nineteen strain gage failures occurred during 62 hours of engine operation, for a survival rate of 68 percent. Of the failures, 16 occurred at blade-to-disk leadwire jumps (84 percent), two at a leadwire splice (11 percent), and one at a gage splice (5 percent). Effects of erosion, temperature, G-loading, and stress levels are discussed. Results of a post-test analysis of the individual components of each strain gage system are presented

In situ diagnostics and prognostics of wire bonding faults in IGBT modules for electric vehicle drives

This paper presents a diagnostic and prognostic condition monitoring method for insulated-gate bipolar transistor (IGBT) power modules for use primarily in electric vehicle applications. The wire-bond-related failure, one of the most commonly observed packaging failures, is investigated by analytical and experimental methods using the on-state voltage drop as a failure indicator. A sophisticated test bench is developed to generate and apply the required current/power pulses to the device under test. The proposed method is capable of detecting small changes in the failure indicators of the IGBTs and freewheeling diodes and its effectiveness is validated experimentally. The novelty of the work lies in the accurate online testing capacity for diagnostics and prognostics of the power module with a focus on the wire bonding faults, by injecting external currents into the power unit during the idle time. Test results show that the IGBT may sustain a loss of half the bond wires before the impending fault becomes catastrophic. The measurement circuitry can be embedded in the IGBT drive circuits and the measurements can be performed in situ when the electric vehicle stops in stop-and-go, red light traffic conditions, or during routine servicing

The manufacture of flat conductor cable

The major techniques are described for fabricating flat conductor cable (FCC). Various types of FCC, including unshielded, shielded, power, and signal, in both existing and conceptual constructions, are covered

Aircraft electromagnetic compatibility

Illustrated are aircraft architecture, electromagnetic interference environments, electromagnetic compatibility protection techniques, program specifications, tasks, and verification and validation procedures. The environment of 400 Hz power, electrical transients, and radio frequency fields are portrayed and related to thresholds of avionics electronics. Five layers of protection for avionics are defined. Recognition is given to some present day electromagnetic compatibility weaknesses and issues which serve to reemphasize the importance of EMC verification of equipment and parts, and their ultimate EMC validation on the aircraft. Proven standards of grounding, bonding, shielding, wiring, and packaging are laid out to help provide a foundation for a comprehensive approach to successful future aircraft design and an understanding of cost effective EMC in an aircraft setting

Process Quality Improvement in Thermosonic Wire Bonding

This thesis demonstrates the feasibility of methods developed to increase the quality of the crescent bond together with the tail bond quality. Low pull force of the crescent bond limits the usage of insulated Au wire in microelectronics assembly. Premature break of the tail which results in the stoppage of the bonding machine is one of obstacles to overcome for Cu wire. The primary focus of this thesis is to understand the tail and crescent bonding process and then to propose methodologies to improve thermosonic wire bonding processes when Cu and insulated Au wires are used. Several series of experiments to investigate the crescent and tail bonding processes are performed on auto bonders. Cu and insulated Au wires with diameters of 25mm are bonded on the diepads of Ag leadframes. For simplicity, wire loops are oriented perpendicular to the ultrasonic direction. It was found that the crescent bond breaking force by pulling the wire loop (pull force) with insulated Au wire is about 80 % of that of bare Au wire. A modification of the crescent bonding process is made to increase the pull force with insulated Au wire. In the modified process, an insulation layer removing stage (cleaning stage) is inserted before the bonding stage. The cleaning stage consists of a scratching motion (shift) toward to the ball bond in combination with ultrasound. Bonds are then made on the fresh diepad with the insulation removed from the contact surface of the insulated Au wire. This process increases the pull force of the crescent bond up to 26% which makes it comparable to the results obtained with bare Au wire. An online tail breaking force measurement method is developed with a proximity sensor between wire clamp and horn. Detailed understanding of tail bond formation is achieved by studying tail bond imprints with scanning electron microscopy and energy dispersive x-ray analysis. Descriptions are given of the dependence of the tail breaking force on the bonding parameters, metallization variation, and cleanliness of the bond pad. Simultaneous optimization with pull force and tail breaking force can optimize the Cu wire bonding process both with high quality and robustness. It is recommended to first carry out conventional pull force optimization followed by a minimization of the bonding force parameter to the lowest value still fulfilling the pull force cpk requirement. The tail bond forms not only under the capillary chamfer, but also under the capillary hole. The tail breaking force includes both the interfacial bond breaking strength and the breaking strength of the thinned portion of the wire that will remain at the substrate as residue. Close investigations of the tail bond imprint with scanning electron microscopy indicate the presence of fractures of the substrate indicating substrate material being picked up by Cu wire tail. Pick up is found on Au and Cu wires, but the amount of pick up is much larger on Cu wire. The effect on the hardness of the subsequently formed Cu free air ball (FAB) as investigated with scanning electron microscopy and micro - hardness test shows that Cu FABs containing Au and Ag pick ups are softer than those without pick up. However, the hardness varies significantly more with Au pick up. The amount of Au pick up is estimated higher than 0.03 % of the subsequently formed FAB volume, exceeding typical impurity and dopant concentrations (0.01 %) added during manufacturing of the wire

Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles

Power semiconductor modules are the core components in power-train system of hybrid and electric vehicles (HEV/EV). With the global interests and efforts to popularize HEV/EV, automotive module has become one of the fast growing sectors of power semiconductor industry. However, the comprehensive requirements in power, frequency, efficiency, robustness, reliability, weight, volume, and cost of automotive module are stringent than industrial products due to extremely high standards of vehicle safety and harsh environment. The development of automotive power module is facing comprehensive challenges in designing of structure, material, and assembly technology. In this chapter, the status and trend of power semiconductor module packaging for HEV/EV are investigated. Firstly, the functionality of power electronics and module in HEV/EV power-train system, as well as the performance requirements by automotive industry, is addressed. A general overview of HEV/EV module design and manufacturing is discussed. Then, the typical state-of-the-art commercial and custom HEV/EV power modules are reviewed and evaluated. Lastly, the packaging trends of automotive module are investigated. The advanced assembly concept and technology are beneficial to thermal management, minimized parasitic parameters, enhancement of thermal and mechanical reliability, and the reduction of weight, volume, and cost

Thin film temperature sensor

Thin film surface temperature sensors were developed. The sensors were made of platinum-platinum/10 percent rhodium thermocouples with associated thin film-to-lead wire connections and sputtered on aluminum oxide coated simulated turbine blades for testing. Tests included exposure to vibration, low velocity hydrocarbon hot gas flow to 1250 K, and furnace calibrations. Thermal electromotive force was typically two percent below standard type S thermocouples. Mean time to failure was 42 hours at a hot gas flow temperature of 1250 K and an average of 15 cycles to room temperature. Failures were mainly due to separation of the platinum thin film from the aluminum oxide surface. Several techniques to improve the adhesion of the platinum are discussed

Active Device Fabrication Using Fiber Encapsulation Additive Manufacturing

Fiber Encapsulation Additive Manufacturing (FEAM) is a novel solid freeform fabrication process in which a fiber and a matrix are co-deposited simultaneously within a single printer along straight and curved 2-D and 3-D paths. Using a FEAM approach in which the fiber is a metal wire and the matrix is a thermoplastic polymer, simple electromechanical devices such as voice coils, inductive sensors, and membrane switches have been successfully produced. This paper will present an overview of the FEAM process, describe several fabricated devices, and discuss recent developments in controllably stopping and starting the wire, and in creating electrical junctions between individual wires, which together enable much more complex devices to be made.Mechanical Engineerin