A BCB Diaphragm Based Adhesive Wafer Bonded CMUT Probe for Biomedical Application

This dissertation presents the design methodology, fabrication procedure, and key experimental characterization results of a linear array of capacitive micromachined ultrasonic transducers (CMUT) for possible ophthalmic anterior segment imaging application. The design methodology involves analytical, 3-D electromechanical finite element analysis, and Verasonics Vantage 128 ultrasonic research platform based diagnostic imaging simulations to develop a technique that minimizes electrical charging and center frequency drift while improving the transduction efficiency. In the design, Bisbenzocyclobutene (BCB), a low K polymer from Dow Chemical Company, has been innovatively used for the first time to fabricate the structural layer of the CMUT diaphragm, realize the interelectrode dielectric spacer, and to act as a low temperature adhesive bonding agent. Additionally, the top CMUT electrode has been placed at the bottom of the diaphragm to affect higher capacitance change that increases sensitivity and provides additional decoupling of the electrical charging effects. Several arrays with element count ranging from 8 to 128 elements and a center frequency range of 5 MHz to 40 MHz have been designed and fabricated. Due to an unforeseen adhesion issue during wirebonding, a 32 channel 40 MHz CMUT array has been packaged manually to validate the fabrication process and CMUT operation. Extensive SEM inspections of the CMUT cross-sections show good agreement with the design specifications. Static and dynamic measurements using a Polytec laser Doppler vibrometer, impedance measurement using an Agilent vector network analyzer, and LCR measurement results are in excellent agreement with analytical and FEA analysis using IntelliSuite. The frequency analysis exhibits high electromechanical coupling coefficient of 0.66 at a low bias voltage of 20 V and high uniformity. A successful measurement of the lower drift of the center frequency 0.32% and higher coupling coefficient verifies the hypothesis that the excellent electrical, structural, and processing characteristics of BCB is a viable option to mitigate the dielectric charging and improve the transduction efficiency of CMUTs

Lead-Free Piezoelectric Transducers for Microelectronic Wirebonding Applications

Author name used in this publication: K. W. KwokAuthor name used in this publication: S. H. ChoyAuthor name used in this publication: H. L. W. Chan2010-2011 > Academic research: refereed > Chapter in an edited book (author)published_fina

Piezoelectric Micromachined Ultrasound Transducer (PMUT) Arrays for Integrated Sensing, Actuation and Imaging

Many applications of ultrasound for sensing, actuation and imaging require miniaturized and low power transducers and transducer arrays integrated with electronic systems. Piezoelectric micromachined ultrasound transducers (PMUTs), diaphragm-like thin film flexural transducers typically formed on silicon substrates, are a potential solution for integrated transducer arrays. This paper presents an overview of the current development status of PMUTs and a discussion of their suitability for miniaturized and integrated devices. The thin film piezoelectric materials required to functionalize these devices are discussed, followed by the microfabrication techniques used to create PMUT elements and the constraints the fabrication imposes on device design. Approaches for electrical interconnection and integration with on-chip electronics are discussed. Electrical and acoustic measurements from fabricated PMUT arrays with up to 320 diaphragm elements are presented. The PMUTs are shown to be broadband devices with an operating frequency which is tunable by tailoring the lateral dimensions of the flexural membrane or the thicknesses of the constituent layers. Finally, the outlook for future development of PMUT technology and the potential applications made feasible by integrated PMUT devices are discussed

MEMS Technology for Biomedical Imaging Applications

Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community

Development of EMAT and piezoelectric transducers for high temperature ultrasonic thickness measurements

Improving reliability of components operating at high temperature, such as pipelines, boilers and reactors, within a range of industries is of importance in the asset management process. This thesis concerns the development and testing of ultrasound transducers for use at elevated temperatures, up to 500 _C, without the use of active cooling. Ultrasound thickness measurement applications employing these high temperature transducers includes both portable-type non-destructive testing (NDT) inspections and permanent condition monitoring, primarily towards detection of corrosion and erosion. The development and optimisation of an electromagnetic acoustic transducer (EMAT) design which generates and detects bulk radially polarised shear waves utilising a high temperature permanent magnet and a ceramic encapsulated spiral coil is discussed. This design was optimised for use on magnetite coated mild steel samples; it was shown that the magnetostriction mechanism tends to dominate, depending upon sample properties, producing large signals even at elevated temperatures. High temperature laboratory trials (up to 500 oC) demonstrated the non-linear change in signal amplitude with increasing temperature on magnetite coated mild steel samples, attributed to the complex non-linear relationship between magnetostrictive strains and applied external magnetic field. The EMAT provided good signal amplitude, even at relatively large sample-EMAT lift-off (up to 8.0 mm), demonstrating the applicability of this EMAT for high temperature scanning inspections. A longterm industrial field trial on a high temperature pipeline (≈ 350 oC) in a refinery exhibited the suitability of this design for high temperature continuous monitoring applications. A piezoelectric transducer with a novel compression-type design was optimised for application at high temperature, with the use of a waveguide, high temperature piezoelectric element and high temperature backing material; the optimisation of these components is discussed. This transducer design incorporates compression applied via a central bolt, to achieve acoustic coupling between the components, avoiding the use of adhesive layers, to generate bulk longitudinal waves. With the application of a bismuth titanate piezoelectric element, the transducer was able to generate signals on stainless steel whilst withstanding high temperatures (up to 500 oC) continuously without cooling

Fabrication of CMUTS based on PMMA adhesive wafer bonding

Capacitive Micromachined Ultrasonic Transducers (CMUTs) are the potential alternatives for the conventional piezoelectric ultrasonic transducers. CMUTs have been under an extensive research and development since their first development in the mid- 1990s. Initially developed for air-coupled applications, CMUTs have shown far better acceptability in immersion-based applications (i.e. medical ultrasonic imaging, medical therapy, and underwater imaging) when compared to the piezoelectric ultrasonic transducers. CMUTs are parallel-plate capacitors fabricated using the Micro Electro Mechanical Systems (MEMS) technology. Despite of the fact that various CMUT fabrication methods have been reported in the literature, there are still many challenges to address in CMUTs design and fabrication. Standard fabrication techniques are further sub-divided into the Sacrificial Layer Release Process and the Wafer Bonding methods. A number of complications are associated with these techniques, such as optimization of the design parameters, process complexity, sacrificial layer material with the corresponding etchant selection, wafer cost and selection. In particular, the sacrificial release methods consist of complex fabrication steps. Furthermore, structural parameters like gap height and radius have optimization issues during the sacrificial release process. On the other hand, the wafer bonding techniques for the CMUTs fabrication are simple and have a great control over the structure parameters in contrast to the sacrificial release methods. At the same time, the wafer-bonded CMUTs require very high quality wafer surface and have a very high contamination sensitivity. For this purpose, this dissertation aims to develop a simple, low cost and lower constraint thermocompression-based technique for the CMUT fabrication. The proposed wafer bonding technique for the CMUT fabrication in the dissertation uses Polymethyl methacrylate (PMMA) adhesive as an intermediate layer for the thermocompression wafer bonding. The advantages associated with the PMMA adhesivebased wafer bonding over the other wafer bonding methods include low process temperature (usually 200 C or less), high wafer surface defects and contamination tolerance, high surface energy and low bonding stresses. These factors will add cost effectiveness and simplicity to the CMUTs fabrication process. Furthermore, the achieved receive sensitivity with the reported CMUT is found comparable to the commercially available ultrasonic transducer

Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator

Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algorithm to process the signals obtained from an ultrasonic generator. Experimental tests verified that the classification method is capable of accurately predicting bond quality, indicated by bonded area measured by X-ray tomography. Samples classified during bonding were subjected to temperature cycling between -55 °C and +125 °C, and the distribution of bond life amongst the different classes was analyzed. It is demonstrated that the as-bonded quality classification is closely correlated with thermal cycling life and can, therefore, be used as a nondestructive tool for monitoring bond quality and predicting useful service life

A high-tolerance matching method against load fluctuation for ultrasonic transducers

Fluctuation of acoustic load significantly weakens the performance of ultrasonic system. To address this problem in a simple way, we consider the main input and output variables related to the ultrasonic transducer's performance and propose a detailed mathematical model based on the simplest LC matching network containing only one capacitor and one inductor. In this model, a new resonance frequency f0 brought by matching components was found and defined. The optimum analysis method is used to solve the model, and a high-tolerance matching method against load fluctuation is obtained. Analysis indicates that when activated at the mechanical resonance frequency, the impedance and apparent power of the PT matched by the proposed method are constant no matter how the load changes, and thereby can significantly increase the stability and robustness of ultrasonic systems. For its simple structure and high performance, the proposed matching method can be widely applied in most ultrasonic systems. The tolerance of the proposed method against other environmental factors and high-order LC matching networks were also discussed. In addition, the feasibility and advantage of the proposed matching method are also verified by experiments