Power efficient, event driven data acquisition and processing using asynchronous techniques

PhD ThesisData acquisition systems used in remote environmental monitoring equipment and biological sensor nodes rely on limited energy supply soured from either energy harvesters or battery to perform their functions. Among the building blocks of these systems are power hungry Analogue to Digital Converters and Digital Signal Processors which acquire and process samples at predetermined rates regardless of the monitored signal’s behavior. In this work we investigate power efficient event driven data acquisition and processing techniques by implementing an asynchronous ADC and an event driven power gated Finite Impulse Response (FIR) filter. We present an event driven single slope ADC capable of generating asynchronous digital samples based on the input signal’s rate of change. It utilizes a rate of change detection circuit known as the slope detector to determine at what point the input signal is to be sampled. After a sample has been obtained it’s absolute voltage value is time encoded and passed on to a Time to Digital Converter (TDC) as part of a pulse stream. The resulting digital samples generated by the TDC are produced at a rate that exhibits the same rate of change profile as that of the input signal. The ADC is realized in 0.35mm CMOS process, covers a silicon area of 340mm by 218mm and consumes power based on the input signal’s frequency. The samples from the ADC are asynchronous in nature and exhibit random time periods between adjacent samples. In order to process such asynchronous samples we present a FIR filter that is able to successfully operate on the samples and produce the desired result. The filter also poses the ability to turn itself off in-between samples that have longer sample periods in effect saving power in the process

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Development of a 6-bit 15.625 MHz CMOS two-step flash analog-to-digital converter for a low dead time sub-nanosecond time measurement system

The development of a 6-bit 15.625 MHz CMOS two-step analog-to-digital converter (ADC) is presented. The ADC was developed for use in a low dead time, high-performance, sub-nanosecond time-to-digital converter (TDC). The TDC is part of a new custom CMOS application specific integrated circuit (ASIC) that will be incorporated in the next generation of front-end electronics for high-performance positron emission tomography imaging. The ADC is based upon a two-step flash architecture that reduces the comparator count by a factor-of-two when compared to a traditional flash ADC architecture and thus a significant reduction in area, power dissipation, and input capacitance of the converter is achieved. The converter contains time-interleaved auto-zeroed CMOS comparators. These comparators utilize offset correction in both the preamplifier and the subsequent regenerative latch stage to guarantee good integral and differential non-linearity performance of the converter over extreme process conditions. Also, digital error correction was employed to overcome most of the major metastability problems inherent in flash converters and to guarantee a completely monotonic transfer function. Corrected comparator offset measurements reveal that the CMOS comparator design maintains a worse case input-referred offset of less than 1 mV at conversion rates up to 8 MHz and less than a 2 mV offset at conversion rates as high as 16 MHz while dissipating less than 2.6 mW. Extensive laboratory measurements indicate that the ADC achieves differential and integral non-linearity performance of less than ±1/2 LSB with a 20 mV/LSB resolution. The ADC dissipates 90 mW from a single 5 V supply and occupies a die area of 1.97 mm x 1.13 mm in 0.8 μm CMOS technology

A built-in self-test technique for high speed analog-to-digital converters

Fundação para a Ciência e a Tecnologia (FCT) - PhD grant (SFRH/BD/62568/2009

Study and application of direct RF power injection methodology and mitigation of electromagnetic interference in ADCs

There are many publications available in literature regarding the DPI (Direct Power Injection) technique for electronic systems, but few works specifically addressed for mixed-signal converters, which are components existent in almost all electronic devices. IEC 62132-4(International Electrotechnical Commission, 2006) and 62132-1(International Electrotechnical Commission, 2006) standards describe a method for measuring immunity of integrated circuits (IC) in the presence of conducted RF disturbances. This method ensures a high degree of repeatability and correlation of immunity measurements. Knowledge of the electromagnetic immunity of an IC allows the designer to decide if the system will need external protection, and how much effort should be directed to this solution. In this context, the purpose of this work is the study and application of the DPI methodology for injection of EMI in a mixed-signal programmable device, evaluating mitigation possibilities, with special focus on the analog-to-digital converters (ADCs). The main objective is to evaluate the impact of electromagnetic interference (EMI) on different converters (two Successive Approximation Register ADCs, operating with distinct sampling rate and a Sigma-Delta ADC) of the Cypress Semiconductor Programmable SoC (System-on-Chip), PSoC 5LP. Additionally a previously proposed fault tolerance methodology, based on triplication with hardware and time diversity is tested. Results show distinct behaviors of each converter to conducted EMI. Finally, the tested tolerance technique showed to be suitable to reduce error rate of such data acquisition system operating under EMI disturbance.Existem muitas publicações disponíveis na literatura sobre a técnica de DPI (Direct Power Injection ou injeção direta de energia) para sistemas eletrônicos, mas poucos trabalhos direcionados para conversores de sinais mistos, que são componentes existentes em quase todos os dispositivos eletrônicos. As normas IEC 62132-4 (IEC, 2006) e 62132-1 (IEC, 2006) descrevem um método para medir a imunidade de circuitos integrados (CI) na presença de distúrbios de RF conduzidos. Este método garante um alto grau de repetibilidade e correlação das medições da imunidade. O conhecimento da imunidade eletromagnética de um CI permite que o projetista decida se o sistema precisará de proteção externa e quanto esforço deve ser direcionado para esta solução. Nesse contexto, o objetivo deste trabalho é o estudo e aplicação da metodologia DPI para injeção de interferência eletromagnética em um dispositivo programável de sinal misto, avaliando as possibilidades de mitigação, com foco especial em conversores analógico-digitais (ADCs). O principal objetivo é avaliar o impacto da interferência eletromagnética em diferentes conversores (dois ADCs baseados em aproximação sucessiva, operando com taxa de amostragem distintas e um ADC do tipo Sigma-Delta) do SoC(System-on-Chip) programável da Cypress Semiconductor, PSoC 5LP. Além disso, é testada uma metodologia de tolerância a falhas proposta anteriormente, baseada em triplicação com diversidade de hardware e temporal. Os resultados mostram comportamentos distintos de cada conversor para a interferência eletromagnética conduzida. Finalmente, a técnica de tolerância testada mostrou-se adequada para reduzir a taxa de erros desse sistema de aquisição de dados operando sob perturbação eletromagnética

Study of Single-Event Transient Effects on Analog Circuits

Radiation in space is potentially hazardous to microelectronic circuits and systems such as spacecraft electronics. Transient effects on circuits and systems from high energetic particles can interrupt electronics operation or crash the systems. This phenomenon is particularly serious in complementary metal-oxide-semiconductor (CMOS) integrated circuits (ICs) since most of modern ICs are implemented with CMOS technologies. The problem is getting worse with the technology scaling down. Radiation-hardening-by-design (RHBD) is a popular method to build CMOS devices and systems meeting performance criteria in radiation environment. Single-event transient (SET) effects in digital circuits have been studied extensively in the radiation effect community. In recent years analog RHBD has been received increasing attention since analog circuits start showing the vulnerability to the SETs due to the dramatic process scaling. Analog RHBD is still in the research stage. This study is to further study the effects of SET on analog CMOS circuits and introduces cost-effective RHBD approaches to mitigate these effects. The analog circuits concerned in this study include operational amplifiers (op amps), comparators, voltage-controlled oscillators (VCOs), and phase-locked loops (PLLs). Op amp is used to study SET effects on signal amplitude while the comparator, the VCO, and the PLL are used to study SET effects on signal state during transition time. In this work, approaches based on multi-level from transistor, circuit, to system are presented to mitigate the SET effects on the aforementioned circuits. Specifically, RHBD approach based on the circuit level, such as the op amp, adapts the auto-zeroing cancellation technique. The RHBD comparator implemented with dual-well and triple-well is studied and compared at the transistor level. SET effects are mitigated in a LC-tank oscillator by inserting a decoupling resistor. The RHBD PLL is implemented on the system level using triple modular redundancy (TMR) approach. It demonstrates that RHBD at multi-level can be cost-effective to mitigate the SEEs in analog circuits. In addition, SETs detection approaches are provided in this dissertation so that various mitigation approaches can be implemented more effectively. Performances and effectiveness of the proposed RHBD are validated through SPICE simulations on the schematic and pulsed-laser experiments on the fabricated circuits. The proposed and tested RHBD techniques can be applied to other relevant analog circuits in the industry to achieve radiation-tolerance

275 C Downhole Switched-Mode Power Supply

A vee-square (V2) control based controller IC is developed for a switch mode power supply capable of operating at extreme temperature/harsh environment conditions. A buck type regulator with silicon carbide power junction field effect transistors (JFET) as power devices is used to analyze the performance of controller. Special emphases are made on the analog sub-blocks--voltage reference, operational transconductance amplifier and comparator as individual building blocks. Transformer coupled gate drives and high temperature operable magnetic cores and capacitors are identified and tested for use in the design. Conventional ceramic chip packaging of ICs combined with lead carrier type mounting of passive filter components is introduced for hybrid packaging of the complete product. The developed SMPS is anticipated to support the operation of down-hole microcontrollers and other electronics devices that require low/medium power filtered dc inputs over an operating temperature of 275 C

High-speed Analog-to-digital Converters For Modern Satellite Receivers: Design Verification Test And Sensitivity Analysis

Mixed-signal System-on-chip devices such as analog-to-digital converters (ADCs) have become increasingly prevalent in the semiconductor industry. Since the complexity and applications are different for each device, complex testing and characterization methods are required. Specifically, signal integrity in I/O interfaces requires that standard RF design and test techniques must be integrated into mixed signal processes. While such techniques may be difficult to implement, on-chip test-vehicles and RF circuitry offer the possibility of wireless approaches to chip testing. This would eliminate expensive wafer probing solution to verify the design of high-speed ADC functionality currently required for high-speed product evaluation. This thesis describes a new high-speed analog-to-digital converter test methodology. The target systems used on-chip digital de-multiplexing and clock distribution. A detail sequence of performance testing operations is presented. Digital outputs are post processed and fed into a computer-aided ADC performance characterization tool which is custom-developed in a MATLAB GUI. The problems of high sampling rate ADC testing are described. The test methodologies described reduce test costs and overcome many test hardware limitations. As our focus is on satellite receiver systems, we emphasize the measurement of inter-modulation distortion and effective resolution bandwidth. As a primary characterization component, Fourier analysis is used and we address the issue of sample window adjustment to eliminate spectral leakage and false spur generation. A 6-bit 800 MSamples/sec dual channel SiGe-based ADC is used as a target example and investigated on the corner lot process variations to determine the impact of process variations and the sensitivity of the ADCs to critical process parameter variations