Implementation of packaged integrated antenna with embedded front end for Bluetooth applications

The design, integration and realization of system in enhanced package approach towards fully functional system level integration by using a compact Bluetooth USB dongle as the demonstrator is presented here. The integration was done on FR4 substrates, which is totally compatible with today’s printed circuit board manufacturing capability. A commercially available Bluetooth integrated chip was chosen as the chipset of our demonstrator, and a package integrated antenna together with an embedded front end completes the system in package integration. The front end developed here is based on an embedded meander line combline filter and an embedded transformer balun. The filter has a 35% area reduction when compared with the classical combline filter and similar performance. The balun has the coils distributed on three layers that minimized the board area needed it and optimizes the performances. The proposed packaged integrated antenna approach is successfully demonstrated here and the new module shows excellent performance when compared with a commercial solution, surpassing the normal Bluetooth class II dongle range which is up to 10 m and increasing the module range up to 120 m without an extra power amplifier

CONTREX: Design of embedded mixed-criticality CONTRol systems under consideration of EXtra-functional properties

The increasing processing power of today’s HW/SW platforms leads to the integration of more and more functions in a single device. Additional design challenges arise when these functions share computing resources and belong to different criticality levels. CONTREX complements current activities in the area of predictable computing platforms and segregation mechanisms with techniques to consider the extra-functional properties, i.e., timing constraints, power, and temperature. CONTREX enables energy efficient and cost aware design through analysis and optimization of these properties with regard to application demands at different criticality levels. This article presents an overview of the CONTREX European project, its main innovative technology (extension of a model based design approach, functional and extra-functional analysis with executable models and run-time management) and the final results of three industrial use-cases from different domain (avionics, automotive and telecommunication).The work leading to these results has received funding from the European Community’s Seventh Framework Programme FP7/2007-2011 under grant agreement no. 611146

Thermo-mechanical analysis of flexible and stretchable systems

This paper presents a summary of the modeling and technology developed for flexible and stretchable electronics. The integration of ultra thin dies at package level, with thickness in the range of 20 to 30 μ m, into flexible and/or stretchable materials are demonstrated as well as the design and reliability test of stretchable metal interconnections at board level are analyzed by both experiments and finite element modeling. These technologies can achieve mechanically bendable and stretchable subsystems. The base substrate used for the fabrication of flexible circuits is a uniform polyimide layer, while silicones materials are preferred for the stretchable circuits. The method developed for chip embedding and interconnections is named Ultra Thin Chip Package (UTCP). Extensions of this technology can be achieved by stacking and embedding thin dies in polyimide, providing large benefits in electrical performance and still allowing some mechanical flexibility. These flexible circuits can be converted into stretchable circuits by replacing the relatively rigid polyimide by a soft and elastic silicone material. We have shown through finite element modeling and experimental validation that an appropriate thermo mechanical design is necessary to achieve mechanically reliable circuits and thermally optimized packages

Conformal Magnetic Composite RFID for Wearable RF and Bio-Monitoring Applications

©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.10.1109/TMTT.2008.2006810This paper introduces for the first time a novel flexible magnetic composite material for RF identification (RFID) and wearable RF antennas. First, one conformal RFID tag working at 480 MHz is designed and fabricated as a benchmarking prototype and the miniaturization concept is verified. Then, the impact of the material is thoroughly investigated using a hybrid method involving electromagnetic and statistical tools. Two separate statistical experiments are performed, one for the analysis of the impact of the relative permittivity and permeability of the proposed material and the other for the evaluation of the impact of the dielectric and magnetic loss on the antenna performance. Finally, the effect of the bending of the antenna is investigated, both on the S-parameters and on the radiation pattern. The successful implementation of the flexible magnetic composite material enables the significant miniaturization of RF passives and antennas in UHF frequency bands, especially when conformal modules that can be easily fine-tuned are required in critical biomedical and pharmaceutical applications

Wireless extension to the existing SystemC design methodology

This research uses a SystemC design methodology to model and design complex wireless communication systems, because in the recent years, the complexity of wireless communication systems has increased and the modelling and design of such systems has become inefficient and challenging. The most important aspect of modelling wireless communication systems is that system design choices may affect the communication behaviour and also communication design choices may impact on the system design. Whilst, the SystemC modelling language shows great promise in the modelling of complex hardware/software systems, it still lacks a standard framework that supports modelling of wireless communication systems (particularly the use of wireless communication channels). SystemC lacks elements and components that can be used to express and simulate wireless systems. It does not support noise links natively. To fill this gap, this research proposes to extend the existing SystemC design methodology to include an efficient simulation of wireless systems. It proposes to achieve this by employing a system-level model of a noisy wireless communication channel, along with a small repertoire of standard components (which of course can be replaced on a per application basis). Finally, to validate our developed methodology, a flocking behaviour system is selected as a demonstration (case study). This is a very complex system modelled based on the developed methodology and partitioned along different parameters. By applying our developed methodology to model this system as a case study, we can prove that incorporating and fixing the wireless channel, wireless protocol, noise or all of these elements early in the design methodology is very advantageous. The modelled system is introduced to simulate the behaviour of the particles (mobile units) that form a mobile ad-hoc communication network. Wireless communication between particles is addressed with two scenarios: the first is created using a wireless channel model to link each pair of particles, which means the wireless communication between particles is addressed using a Point-to-Point (P2P) channel; the other scenario is created using a shared channel (broadcast link). Therefore, incorporating wireless features into existing SystemC design methodology, as done in this research, is a very important task, because by developing SystemC as a design tool to support wireless systems, hardware aspects, software parts and communication can be modelled, refined and validated simultaneously on the same platform, and the design space expanded into a two-dimensional design space comprising system and communication