Minimizing Channel Density with Movable Terminals

We give algorithms to minimize density for VLSI channel routing problems with terminals that are movable subject to certain constraints. The main cases considered are channels with linear order constraints, channels with linear order constraints and separation constraints, channels with movable modules containing fixed terminals, and channels with movable modules and terminals. In each case, we improve previous results for running time and space by a factor of L/\lgn and L, respectively, where L is the channel length, and n is the number of terminals

Baseband analog front-end and digital back-end for reconfigurable multi-standard terminals

Multimedia applications are driving wireless network operators to add high-speed data services such as Edge (E-GPRS), WCDMA (UMTS) and WLAN (IEEE 802.11a,b,g) to the existing GSM network. This creates the need for multi-mode cellular handsets that support a wide range of communication standards, each with a different RF frequency, signal bandwidth, modulation scheme etc. This in turn generates several design challenges for the analog and digital building blocks of the physical layer. In addition to the above-mentioned protocols, mobile devices often include Bluetooth, GPS, FM-radio and TV services that can work concurrently with data and voice communication. Multi-mode, multi-band, and multi-standard mobile terminals must satisfy all these different requirements. Sharing and/or switching transceiver building blocks in these handsets is mandatory in order to extend battery life and/or reduce cost. Only adaptive circuits that are able to reconfigure themselves within the handover time can meet the design requirements of a single receiver or transmitter covering all the different standards while ensuring seamless inter-interoperability. This paper presents analog and digital base-band circuits that are able to support GSM (with Edge), WCDMA (UMTS), WLAN and Bluetooth using reconfigurable building blocks. The blocks can trade off power consumption for performance on the fly, depending on the standard to be supported and the required QoS (Quality of Service) leve

Integrated phased array systems in silicon

Silicon offers a new set of possibilities and challenges for RF, microwave, and millimeter-wave applications. While the high cutoff frequencies of the SiGe heterojunction bipolar transistors and the ever-shrinking feature sizes of MOSFETs hold a lot of promise, new design techniques need to be devised to deal with the realities of these technologies, such as low breakdown voltages, lossy substrates, low-Q passives, long interconnect parasitics, and high-frequency coupling issues. As an example of complete system integration in silicon, this paper presents the first fully integrated 24-GHz eight-element phased array receiver in 0.18-μm silicon-germanium and the first fully integrated 24-GHz four-element phased array transmitter with integrated power amplifiers in 0.18-μm CMOS. The transmitter and receiver are capable of beam forming and can be used for communication, ranging, positioning, and sensing applications

Second year technical report on-board processing for future satellite communications systems

Advanced baseband and microwave switching techniques for large domestic communications satellites operating in the 30/20 GHz frequency bands are discussed. The nominal baseband processor throughput is one million packets per second (1.6 Gb/s) from one thousand T1 carrier rate customer premises terminals. A frequency reuse factor of sixteen is assumed by using 16 spot antenna beams with the same 100 MHz bandwidth per beam and a modulation with a one b/s per Hz bandwidth efficiency. Eight of the beams are fixed on major metropolitan areas and eight are scanning beams which periodically cover the remainder of the U.S. under dynamic control. User signals are regenerated (demodulated/remodulated) and message packages are reformatted on board. Frequency division multiple access and time division multiplex are employed on the uplinks and downlinks, respectively, for terminals within the coverage area and dwell interval of a scanning beam. Link establishment and packet routing protocols are defined. Also described is a detailed design of a separate 100 x 100 microwave switch capable of handling nonregenerated signals occupying the remaining 2.4 GHz bandwidth with 60 dB of isolation, at an estimated weight and power consumption of approximately 400 kg and 100 W, respectively

Using ant colony optimization for routing in microprocesors

Power consumption is an important constraint on VLSI systems. With the advancement in technology, it is now possible to pack a large range of functionalities into VLSI devices. Hence it is important to find out ways to utilize these functionalities with optimized power consumption. This work focuses on curbing power consumption at the design stage. This work emphasizes minimizing active power consumption by minimizing the load capacitance of the chip. Capacitance of wires and vias can be minimized using Ant Colony Optimization (ACO) algorithms. ACO provides a multi agent framework for combinatorial optimization problems and hence is used to handle multiple constraints of minimizing wire-length and vias to achieve the goal of minimizing capacitance and hence power consumption. The ACO developed here is able to achieve an 8% reduction of wire-length and 7% reduction in vias thereby providing a 7% reduction in total capacitance, compared to other state of the art routers

Device modelling for bendable piezoelectric FET-based touch sensing system

Flexible electronics is rapidly evolving towards devices and circuits to enable numerous new applications. The high-performance, in terms of response speed, uniformity and reliability, remains a sticking point. The potential solutions for high-performance related challenges bring us back to the timetested silicon based electronics. However, the changes in the response of silicon based devices due to bending related stresses is a concern, especially because there are no suitable models to predict this behavior. This also makes the circuit design a difficult task. This paper reports advances in this direction, through our research on bendable Piezoelectric Oxide Semiconductor Field Effect Transistor (POSFET) based touch sensors. The analytical model of POSFET, complimented with Verilog-A model, is presented to describe the device behavior under normal force in planar and stressed conditions. Further, dynamic readout circuit compensation of POSFET devices have been analyzed and compared with similar arrangement to reduce the piezoresistive effect under tensile and compressive stresses. This approach introduces a first step towards the systematic modeling of stress induced changes in device response. This systematic study will help realize high-performance bendable microsystems with integrated sensors and readout circuitry on ultra-thin chips (UTCs) needed in various applications, in particular, the electronic skin (e-skin)

EVEREST IST - 2002 - 00185 : D23 : final report

Deliverable públic del projecte europeu EVERESTThis deliverable constitutes the final report of the project IST-2002-001858 EVEREST. After its successful completion, the project presents this document that firstly summarizes the context, goal and the approach objective of the project. Then it presents a concise summary of the major goals and results, as well as highlights the most valuable lessons derived form the project work. A list of deliverables and publications is included in the annex.Postprint (published version