Low-Power And High Performance Of An Optimized FinFET Based 8T SRAM Cell Design

The development of the nanotechnology leadsto the shrinking of the size of the transistors to nanometerregion. However, there are a lot of challenges due to sizescaling of the transistors such as short channel effects (SCEs)and threshold voltage roll-off issues. Fin-Type Field EffectTransistor (FinFET) is another alternative technology tosolve the issues of the conventional MOSFET and increasethe performance of the Static Random Access Memory(SRAM) circuit design. FinFET based SRAMs are faster andmore reliable which are often used as memory cache for highspeed operation. However, 6T SRAM cell suffers from accesstransistor sizing conflict resulting in a trade-off between readand write stability. This paper presents an investigation ofthe stability performance in retention, read and write modeof 22nm FinFET based 8T SRAM cell. The performancecomparison of 22nm FinFET based 6T and 8T SRAMs weremade. The simulation of the SRAM model are carried out inGTS Framework TCAD tool based on 22nm technology. In8T SRAM cell, two n-FinFETs are added to the conventional6T SRAM cell which will be controlled by the Read WordLine (RWL) to isolate the read and write operation path forbetter read stability. FinFET based 8T SRAM cell givesbetter performance in Static Noise Margin (SNM) and powerconsumption than 6T SRAM cells. The simulation resultsaffirms the proposed FinFET based 8T SRAM improvedread static noise margin by 166.67% and power consumptionby 76.13% as compared to the FinFET based 6T SRAM

Multi-port Memory Design for Advanced Computer Architectures

In this thesis, we describe and evaluate novel memory designs for multi-port on-chip and off-chip use in advanced computer architectures. We focus on combining multi-porting and evaluating the performance over a range of design parameters. Multi-porting is essential for caches and shared-data systems, especially multi-core System-on-chips (SOC). It can significantly increase the memory access throughput. We evaluate FinFET voltage-mode multi-port SRAM cells using different metrics including leakage current, static noise margin and read/write performance. Simulation results show that single-ended multi-port FinFET SRAMs with isolated read ports offer improved read stability and flexibility over classical double-ended structures at the expense of write performance. By increasing the size of the access transistors, we show that the single-ended multi-port structures can achieve equivalent write performance to the classical double-ended multi-port structure for 9% area overhead. Moreover, compared with CMOS SRAM, FinFET SRAM has better stability and standby power. We also describe new methods for the design of FinFET current-mode multi-port SRAM cells. Current-mode SRAMs avoid the full-swing of the bitline, reducing dynamic power and access time. However, that comes at the cost of voltage drop, which compromises stability. The design proposed in this thesis utilizes the feature of Independent Gate (IG) mode FinFET, which can leverage threshold voltage by controlling the back gate voltage, to merge two transistors into one through high-Vt and low-Vt transistors. This design not only reduces the voltage drop, but it also reduces the area in multi-port current-mode SRAM design. For off-chip memory, we propose a novel two-port 1-read, 1-write (1R1W) phasechange memory (PCM) cell, which significantly reduces the probability of blocking at the bank levels. Different from the traditional PCM cell, the access transistors are at the top and connected to the bitline. We use Verilog-A to model the behavior of Ge2Sb2Te5 (GST: the storage component). We evaluate the performance of the two-port cell by transistor sizing and voltage pumping. Simulation results show that pMOS transistor is more practical than nMOS transistor as the access device when both area and power are considered. The estimated area overhead is 1.7�, compared to single-port PCM cell. In brief, the contribution we make in this thesis is that we propose and evaluate three different kinds of multi-port memories that are favorable for advanced computer architectures

Performance analysis of 22NM FinFET-based 8T SRAM cell

As CMOS devices are approaching nanometer regime, there are a lot of consequences found in scaling down CMOS devices such as short channel effects and process variations which affect the reliability and performance of the devices. Researchers have found that FinFET is one of the outstanding nominee to overcome this issue since FinFET has better control over the channel and the lower overall capacitance which will increase the performance of the 6T Static Random Access Memory (SRAM) circuit design. It will help in reducing bitline loading and hence improve SRAM performance. The conventional 6T SRAM cell suffers serious stability degradation issue due to access disturbance at low power mode. The major problem in 6T SRAM is that, when the output voltage reduced below the threshold voltage of the transistor, it will destroy the read operation of the 6T SRAM cell. The noises are easy to destruct the stored-data in the nodes of the 6T SRAM cell due to the direct path between storage nodes and bit lines. To overcome this issue, an 8T SRAM cell has been proposed where the read stability is expected to improve. The purpose of this study is to simulate and evaluate the performance of FinFET-based 6T SRAM and 8T SRAM cell and compare their results. In 8T SRAM, the two additional access transistors eliminate the discharging path from RBL to ground in 6T SRAM cell which in turn help in improving the stability of read operation in 8T SRAM. The stability of SRAM cell is determined by the butterfly curve which is obtained by combining the voltage transfer curve (VTC) of the two cross-coupled inverters of the SRAM cell. GTS Framework TCAD tool is used to design and simulate the FinFET device structure, the schematic and the layout of SRAM cell. From the findings, the FinFET gives better Vth, DIBL, SS and ION than MOSFET. In addition, 6T and 8T FinFET-based SRAM cell have shown a better stability than 6T and 8T MOSFET-based SRAM cell in retention mode, read mode and write mode. Compared to FinFET-based 6T SRAM cell, FinFET-based 8T SRAM cell improved the read stability by 68.5% and not causing any degradation on the write and retention noise margin

PERFORMANCE EVALUTION OF CNTFET-BASED SRAM CELL DESIGN

Carbon Nanotube Field-Effect Transistor (CNTFET) technology with their excellent current capabilities, ballistic transport operation and superior thermal conductivities has proved to be a very promising and superior alternative to the conventional CMOS technology. A detailed analysis and simulation based assessment of circuit performance of this technology is presented here. As figures of merit speed, power consumption and stability are considered to evaluate the performance parameters of CNTFET-Based SRAM Cells with different chiral vectors for the optimum performance. A novel performance metric, presented as “SPR,” is used to assess these figures of merit. This comprehensive metric includes a metric of low power delay product (PDP) for write operation and high stability in the operation of a memory cell. It is shown that an 8T SRAM cell provides 73% higher SPR than Dual-Chiral based 6T SRAM cell for CNT technology and 124% higher SPR than its CMOS counterpart, thus attaining superior performance. The CNTFET-based 8T SRAM cell demonstrates that it provides high stability, low delay and low power, which is better than CNTFET-based 6T SRAM cell as well as CMOS SRAM cell

Design of SRAM Cell using Modified Lector and Dual Threshold Method Based on FINFET

FinFET (Fin Field Effect Transistor) is a new technology that satisfies the demand for a superior storage system by improving transistor circuit design (SS). CMOS devices experience a wide range of issues due to the gate's diminishing ability to control the channel. Increased total production costs are a few of these disadvantages. But this store needs to dissipate less power, have a quick access time, and a low leakage current. The increased power dissipation and leakage current of traditional CMOS-based SRAM (Static RAM) architectures cause a sharp decline in performance. The nanoscale gadget called FinFET is being introduced for use in SRAM fabrication due to its 3D gate architecture. The adoption of FinFET has helped boost overall performance in terms of efficiency, power, and footprint. And because it is immune to SCEs, FinFET has become the transistor of choice. In this study, we have examined a number of FinFET-based SRAM cells and compared them with CMOS technology. We have also suggested a novel 14T SRAM design that uses the Dual Threshold Method and Modified Lector Approach with FinFET, and it is implemented for the 1bit, 4bit, and 8bit

A Survey on Layout Implementation and Analysis of Different SRAM Cell Topologies

Because powered widgets are frequently used, the primary goal of electronics is to design low-power devices. Because of its applications in low-energy computing, memory cell operation with low voltage consumption has become a major interest in memory cell design. Because of specification changes in scaled methodologies, the only critical method for the success of low-voltage SRAM design is the stable operation of SRAM. The traditional SRAM cell enables high-density and fast differential sensing but suffers from semi-selective and read-risk issues. The simulation results show that the proposed design provides the fastest read operation and overall power delay product optimization. Compared to the current topologies of 6T, 8T, and 10T, while a traditional SRAM cell solves the reading disruption problem, previous strategies for solving these problems have been ineffective due to low efficiency, data-dependent leakage, and high energy per connection. Our primary goal is to reduce power consumption, improve read performance, and reduce the area and power of the proposed design cell work. The proposed leakage reduction design circuit has been implemented on the micro-wind tool. Delay and power consumption are important factors in memory cell performance. The primary goal of this project is to create a low-power SRAM cell

Cache memory design in the FinFET era

The major problem in the future technology scaling is the variations in process parameters that are interpreted as imperfections in the development process. Moreover, devices are more sensitive to the environmental changes of temperature and supply volt- age as well as to ageing. All these influences are manifested in the integrated circuits as increased power consumption, reduced maximal operating frequency and increased number of failures. These effects have been partially overcome with the introduction of the FinFET technology which have solved the problem of variability caused by Random Dopant Fluctuations. However, in the next ten years channel length is projected to shrink to 10nm where the variability source generated by Line Edge Roughness will dominate, and its effects on the threshold voltage variations will become critical. The embedded memories with their cells as the basic building unit are the most prone to these effects due to their the smallest dimensions. Because of that, memories should be designed with particular care in order to make possible further technology scaling. This thesis explores upcoming 10nm FinFETs and the existing issues in the cache memory design with this technology. More- over, it tries to present some original and novel techniques on the different level of design abstraction for mitigating the effects of process and environmental variability. At first original method for simulating variability of Tri-Gate Fin- FETs is presented using conventional HSPICE simulation environment and BSIM-CMG model cards. When that is accomplished, thorough characterisation of traditional SRAM cell circuits (6T and 8T) is performed. Possibility of using Independent Gate FinFETs for increasing cell stability has been explored, also. Gain Cells appeared in the recent past as an attractive alternative for in the cache memory design. This thesis partially explores this idea by presenting and performing detailed circuit analysis of the dynamic 3T gain cell for 10nm FinFETs. At the top of this work, thesis shows one micro-architecture optimisation of high-speed cache when it is implemented by 3T gain cells. We show how the cache coherency states can be used in order to reduce refresh energy of the memory as well as reduce memory ageing.El principal problema de l'escalat la tecnologia són les variacions en els paràmetres de disseny (imperfeccions) durant procés de fabricació. D'altra banda, els dispositius també són més sensibles als canvis ambientals de temperatura, la tensió d'alimentació, així com l'envelliment. Totes aquestes influències es manifesten en els circuits integrats com l'augment de consum d'energia, la reducció de la freqüència d'operació màxima i l'augment del nombre de xips descartats. Aquests efectes s'han superat parcialment amb la introducció de la tecnologia FinFET que ha resolt el problema de la variabilitat causada per les fluctuacions de dopants aleatòries. No obstant això, en els propers deu anys, l'ample del canal es preveu que es reduirà a 10nm, on la font de la variabilitat generada per les rugositats de les línies de material dominarà, i els seu efecte en les variacions de voltatge llindar augmentarà. Les memòries encastades amb les seves cel·les com la unitat bàsica de construcció són les més propenses a sofrir aquests efectes a causa de les seves dimensions més petites. A causa d'això, cal dissenyar les memòries amb una especial cura per tal de fer possible l'escalat de la tecnologia. Aquesta tesi explora la tecnologia de FinFETs de 10nm i els problemes existents en el disseny de memòries amb aquesta tecnologia. A més a més, presentem noves tècniques originals sobre diferents nivells d'abstracció del disseny per a la mitigació dels efectes les variacions tan de procés com ambientals. En primer lloc, presentem un mètode original per a la simulació de la variabilitat de Tri-Gate FinFETs usant entorn de simulació HSPICE convencional i models de tecnologia BSIMCMG. Després, es realitza la caracterització completa dels circuits de cel·les SRAM tradicionals (6T i 8T) conjuntament amb l'ús de Gate-independent FinFETs per augmentar l'estabilitat de la cèl·lula

Ultra Low Power Digital Circuit Design for Wireless Sensor Network Applications

Ny forskning innenfor feltet trådløse sensornettverk åpner for nye og innovative produkter og løsninger. Biomedisinske anvendelser er blant områdene med størst potensial og det investeres i dag betydelige beløp for å bruke denne teknologien for å gjøre medisinsk diagnostikk mer effektiv samtidig som man åpner for fjerndiagnostikk basert på trådløse sensornoder integrert i et ”helsenett”. Målet er å forbedre tjenestekvalitet og redusere kostnader samtidig som brukerne skal oppleve forbedret livskvalitet som følge av økt trygghet og mulighet for å tilbringe mest mulig tid i eget hjem og unngå unødvendige sykehusbesøk og innleggelser. For å gjøre dette til en realitet er man avhengige av sensorelektronikk som bruker minst mulig energi slik at man oppnår tilstrekkelig batterilevetid selv med veldig små batterier. I sin avhandling ” Ultra Low power Digital Circuit Design for Wireless Sensor Network Applications” har PhD-kandidat Farshad Moradi fokusert på nye løsninger innenfor konstruksjon av energigjerrig digital kretselektronikk. Avhandlingen presenterer nye løsninger både innenfor aritmetiske og kombinatoriske kretser, samtidig som den studerer nye statiske minneelementer (SRAM) og alternative minnearkitekturer. Den ser også på utfordringene som oppstår når silisiumteknologien nedskaleres i takt med mikroprosessorutviklingen og foreslår løsninger som bidrar til å gjøre kretsløsninger mer robuste og skalerbare i forhold til denne utviklingen. De viktigste konklusjonene av arbeidet er at man ved å introdusere nye konstruksjonsteknikker både er i stand til å redusere energiforbruket samtidig som robusthet og teknologiskalerbarhet øker. Forskningen har vært utført i samarbeid med Purdue University og vært finansiert av Norges Forskningsråd gjennom FRINATprosjektet ”Micropower Sensor Interface in Nanometer CMOS Technology”

Ultra-Low Power Ternary CMOS Platform for Physical Synthesis of Multi-Valued Logic and Memory Applications

Department of Electrical EngineeringMotivation of this work is to provide feasible, scalable, and designable multi-valued logic (MVL) device platform for physical synthesis of MVL circuits. Especially, ternary device and its general logic functions are focused, owing to most efficiently reduced circuit complexity per radix (R) increase. By designing the OFF-state constant current, not only the standby power (PS) issue of additional intermediate state is overcome, but also continuous supply voltage (VDD) scaling and dynamic power (PD) scaling are possible owing to single-step I-V characteristics. By applying a novel ternary device concept to CMOS technology with OFF-state current mechanism of band-to-band tunneling (BTBT) currents (IBTBT) and subthreshold diffusion current (Isub), the logic changes from binary to ternary are confirmed using mixed-mode device simulation. I experimentally demonstrate ternary CMOS (T-CMOS) and verified its low-power standard ternary inverter (STI) operation by designing channel profiles in conventional binary CMOS. The realized complementary ternary n/pMOS (T-n/pMOS) have fully gate bias (VG)-independent and symmetrical IBTBT of ~10 pA/???m based on proven ion-implantation process, which produces stable and designable intermediate state (VOM) at exactly VDD/2. To present T-CMOS design frameworks in terms of static noise margin (SNM) enhancement and ultra-low power operation, I develop the compact model of T-CMOS and verify the physical model parameters with experimental data. Through the feasible design of Isub with abrupt channel profile based on low thermal budget process, STI has a SNM of 283 mV (80 % of ideal SNM) at VDD= 1V operation and intermediate state stability of ??VOM < ?? 0.1V, even considering the random-dopant fluctuation (RDF) of 32 nm and 22 nm technology. Continuous VDD scaling below 0.5V (SNM= 40% at VDD = 0.3V) enables STI operation with ultra-low PD and PS based on exponentially reduced IBTBT currents. As MVL and memory (MVM) applications, minimum(MIN)/maximum(MAX) gates, analog-to-digital converter (ADC) circuit, and 5-state latch are studied with T-CMOS compact model. Especially ADC circuits revolutionary decreases number of device and circuit interconnection with 9.6% area of binary system.ope