MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

Interface Circuits for Microsensor Integrated Systems

ca. 200 words; this text will present the book in all promotional forms (e.g. flyers). Please describe the book in straightforward and consumer-friendly terms. [Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures have gained growing attention, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a severe interface design attention, especially concerning the analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems gets even harder the interface design due to the need of energy-aware cost-effective circuit interfaces integrating, where possible, energy harvesting solutions. The objective of this Special Issue is to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue aims to present and highlight the advances and the latest novel and emergent results on this topic, showing best practices, implementations and applications. The Guest Editors invite to submit original research contributions dealing with sensor interfacing related to this specific topic. Additionally, application oriented and review papers are encouraged.

System design of a low-power three-axis underdamped MEMS accelerometer with simultaneous electrostatic damping control

Recently, consumer electronics industry has known a spectacular growth that would have not been possible without pushing the integration barrier further and further. Micro Electro Mechanical Systems (MEMS) inertial sensors (e.g. accelerometers, gyroscopes) provide high performance, low power, low die cost solutions and are, nowadays, embedded in most consumer applications. In addition, the sensors fusion has become a new trend and combo sensors are gaining growing popularity since the co-integration of a three-axis MEMS accelerometer and a three-axis MEMS gyroscope provides complete navigation information. The resulting device is an Inertial measurement unit (IMU) able to sense multiple Degrees of Freedom (DoF). Nevertheless, the performances of the accelerometers and the gyroscopes are conditioned by the MEMS cavity pressure: the accelerometer is usually a damped system functioning under an atmospheric pressure while the gyroscope is a highly resonant system. Thus, to conceive a combo sensor, aunique low cavity pressure is required. The integration of both transducers within the same low pressure cavity necessitates a method to control and reduce the ringing phenomena by increasing the damping factor of the MEMS accelerometer. Consequently, the aim of the thesis is the design of an analog front-end interface able to sense and control an underdamped three-axis MEMSaccelerometer. This work proposes a novel closed-loop accelerometer interface achieving low power consumption The design challenge consists in finding a trade-off between the sampling frequency, the settling time and the circuit complexity since the sensor excitation plates are multiplexed between the measurement and the damping phases. In this context, a patenteddamping sequence (simultaneous damping) has been conceived to improve the damping efficiency over the state of the art approach performances (successive damping). To investigate the feasibility of the novel electrostatic damping control architecture, several mathematical models have been developed and the settling time method is used to assess the damping efficiency. Moreover, a new method that uses the multirate signal processing theory and allows the system stability study has been developed. This very method is used to conclude on the loop stability for a certain sampling frequency and loop gain value. Next, a 0.18μm CMOS implementation of the entire accelerometer signal chain is designed and validated

Integrated reference circuits for low-power capacitive sensor interfaces

This thesis consists of nine publications and an overview of the research topic, which also summarizes the work. The research described in this thesis concentrates on the design of low-power sensor interfaces for capacitive 3-axis micro-accelerometers. The primary goal throughout the thesis is to optimize power dissipation. Because the author made the main contribution to the design of the reference and power management circuits required, the overview part is dominated by the following research topics: current, voltage, and temperature references, frequency references, and voltage regulators. After an introduction to capacitive micro-accelerometers, the work describes the typical integrated readout electronics of a capacitive sensor on the functional level. The readout electronics can be divided into four different functional parts, namely the sensor readout itself, signal post-processing, references, and power management. Before the focus is shifted to the references and further to power management, different ways to realize the sensor readout are briefly discussed. Both current and voltage references are required in most analog and mixed-signal systems. A bandgap voltage reference, which inherently uses at least one current reference, is practical for the generation of an accurate reference voltage. Very similar circuit techniques can be exploited when implementing a temperature reference, the need for which in the sensor readout may be justified by the temperature compensation, for example. The work introduces non-linear frequency references, namely ring and relaxation oscillators, which are very suitable for the generation of the relatively low-frequency clock signals typically needed in the sensor interfaces. Such oscillators suffer from poor jitter and phase noise performance, the quantities of which also deserve discussion in this thesis. Finally, the regulation of the supply voltage using linear regulators is considered. In addition to extending the battery life by providing a low quiescent current, the regulator must be able to supply very low load currents and operate without off-chip capacitors

Low-power front-ends for capacitive three-axis accelerometers

This thesis consists of six publications and an overview of the research topic. The overview concentrates on background information of the capacitive accelerometers and front-ends. The publications focus on two low-power front-ends that were implemented for capacitive three-axis accelerometers and their operation as a part of an interface. The switched-capacitor front-ends that were implemented are based on the charge-balancing structures, namely a self-balancing bridge and a ΔΣ front-end, which convert the capacitive acceleration information to analog and digital signals, respectively. Both structures operate mechanically in open-loop configuration and are capable of reducing the effects of the electrostatic forces and displacement-to-capacitance conversion. According to the performance comparison presented in this thesis, both interfaces, which were implemented around the front-ends, exhibit competitive performance when compared to the commercial products of the day

Sub-Femto-Farad Resolution Electronic Interfaces for Integrated Capacitive Sensors: A Review

Capacitance detection is a universal transduction mechanism used in a wide variety of sensors and applications. It requires an electronic front-end converting the capacitance variation into another more convenient physical variable, ultimately determining the performance of the whole sensor. In this paper we present a comprehensive review of the different signal conditioning front-end topologies targeted in particular at sub-femtofarad resolution. Main design equations and analysis of the limits due to noise are reported in order to provide the designer with guidelines for choosing the most suitable topology according to the main design specifications, namely energy consumption, area occupation, measuring time and resolution. A data-driven comparison of the different solutions in literature is also carried out revealing that resolution, measuring time, area occupation and energy/conversion lower than 100 aF, 1 ms 0.1 mm2, and 100 pJ/conv. can be obtained by capacitance to digital topologies, which therefore allow to get the best compromise among all design specifications

DESIGN OF SMART SENSORS FOR DETECTION OF PHYSICAL QUANTITIES

Microsystems and integrated smart sensors represent a flourishing business thanks to the manifold benefits of these devices with respect to their respective macroscopic counterparts. Miniaturization to micrometric scale is a turning point to obtain high sensitive and reliable devices with enhanced spatial and temporal resolution. Power consumption compatible with battery operated systems, and reduced cost per device are also pivotal for their success. All these characteristics make investigation on this filed very active nowadays. This thesis work is focused on two main themes: (i) design and development of a single chip smart flow-meter; (ii) design and development of readout interfaces for capacitive micro-electro-mechanical-systems (MEMS) based on capacitance to pulse width modulation conversion. High sensitivity integrated smart sensors for detecting very small flow rates of both gases and liquids aiming to fulfil emerging demands for this kind of devices in the industrial to environmental and medical applications. On the other hand, the prototyping of such sensor is a multidisciplinary activity involving the study of thermal and fluid dynamic phenomenon that have to be considered to obtain a correct design. Design, assisted by finite elements CAD tools, and fabrication of the sensing structures using features of a standard CMOS process is discussed in the first chapter. The packaging of fluidic sensors issue is also illustrated as it has a great importance on the overall sensor performances. The package is charged to allow optimal interaction between fluids and the sensors and protecting the latter from the external environment. As miniaturized structures allows a great spatial resolution, it is extremely challenging to fabricate low cost packages for multiple flow rate measurements on the same chip. As a final point, a compact anemometer prototype, usable for wireless sensor network nodes, is described. The design of the full custom circuitry for signal extraction and conditioning is coped in the second chapter, where insights into the design methods are given for analog basic building blocks such as amplifiers, transconductors, filters, multipliers, current drivers. A big effort has been put to find reusable design guidelines and trade-offs applicable to different design cases. This kind of rational design enabled the implementation of complex and flexible functionalities making the interface circuits able to interact both with on chip sensors and external sensors. In the third chapter, the chip floor-plan designed in the STMicroelectronics BCD6s process of the entire smart flow sensor formed by the sensing structures and the readout electronics is presented. Some preliminary tests are also covered here. Finally design and implementation of very low power interfaces for typical MEMS capacitive sensors (accelerometers, gyroscopes, pressure sensors, angular displacement and chemical species sensors) is discussed. Very original circuital topologies, based on chopper modulation technique, will be illustrated. A prototype, designed within a joint research activity is presented. Measured performances spurred the investigation of new techniques to enhance precision and accuracy capabilities of the interface. A brief introduction to the design of active pixel sensors interface for hybrid CMOS imagers is sketched in the appendix as a preliminary study done during an internship in the CNM-IMB institute of Barcelona

The design, simulation and fabrication of microengineered silicon gyroscopes

This thesis is concerned with the development of a low cost resonant gyroscope, or rate of turn sensor, which is capable of being mass produced. The history and theory of the resonant gyroscope is reviewed, and then a survey of resonant gyroscope technology is presented. Two novel designs of resonant gyroscopes are described. These designs are developed using the finite element analysis method. The fabrication procedure required to manufacture these devices is also developed and presented. The fabrication procedures are based upon silicon micromachining technology developed from the semiconductor industry. Prototype structures are fabricated. The first of these devices has been demonstrated to operate successfully as a gyroscopic rate of turn sensor. A third design is also presented and developed using finite element analysis. This design demonstrates for the first time that it is possible to sense rates of turn about all three orthogonal axes independently, using just a single structure. A successful implementation of a structure of this type would eliminate the traditional requirement of one gyroscope per axis of rotation. The finite element simulations of the structure indicate that the design is suitable for mass production using silicon micromachining techniques

Design of a CMOS chopper instrumentation amplifier with rail-to-rail input and output ranges

This thesis deals with the design of a current feedback instrumentation amplifier, optimized for the readout of thermal sensors. This topology stands out for its excellent CMRR and the predisposition to feature low frequency error reduction techniques. Versatility is a main target for this work: 1 kHz bandwidth and Rail-To-Rail input common mode range allow the readout of a wide variety of sensors. Chopper modulation is used to reduce offset and flicker noise, achieving a 19 nV/sqrt(Hz) RTI noise density and a flicker corner frequency of less than 10 mHz. A low total output noise power is achieved as well, reaching an ENOB of 12 bits with less than 350 µA current consumption. The peculiar issue for this architecture, that is gain error, is solved by means of Port Swapping technique, together with an input Common Mode Equalization. Chopped offset and Port Swapping ripple are completely filtered away by a third order Butterworth State Variable low pass filter, implemented with Gm-C integrators