Power quality and electromagnetic compatibility: special report, session 2

The scope of Session 2 (S2) has been defined as follows by the Session Advisory Group and the Technical Committee: Power Quality (PQ), with the more general concept of electromagnetic compatibility (EMC) and with some related safety problems in electricity distribution systems. Special focus is put on voltage continuity (supply reliability, problem of outages) and voltage quality (voltage level, flicker, unbalance, harmonics). This session will also look at electromagnetic compatibility (mains frequency to 150 kHz), electromagnetic interferences and electric and magnetic fields issues. Also addressed in this session are electrical safety and immunity concerns (lightning issues, step, touch and transferred voltages). The aim of this special report is to present a synthesis of the present concerns in PQ&EMC, based on all selected papers of session 2 and related papers from other sessions, (152 papers in total). The report is divided in the following 4 blocks: Block 1: Electric and Magnetic Fields, EMC, Earthing systems Block 2: Harmonics Block 3: Voltage Variation Block 4: Power Quality Monitoring Two Round Tables will be organised: - Power quality and EMC in the Future Grid (CIGRE/CIRED WG C4.24, RT 13) - Reliability Benchmarking - why we should do it? What should be done in future? (RT 15

Handheld-Impedance-Measurement System with seven-decade capability and potentiostatic function

This paper describes design and test of a new impedance-measurement system for nonlinear devices that exhibits a seven-decade range and works down to a frequency of 0.01 Hz. The system is specifically designed for electrochemical measurements, but the proposed architecture can be employed in many other fields where flexible signal generation and analysis are required. The system employs an unconventional signal generator based on two pulsewidth modulation (PWM) oscillators and an autocalibration system that allows uncertainties of less than 3% to be obtained over a range of 1 kΩ to 100 GΩ. A synchronous demodulation processing allows the noise superimposed to the low-amplitude input signals to be made negligibl

Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level

A Traveling Standard for the Calibration of Data Acquisition Boards

The large use of measurement systems based on data acquisition boards makes the traceability-chain assurance a tricky problem due to the difficulty in consistently calibrating such boards. In this paper, the authors describe a traveling standard which can be used for the calibration of many commercially available acquisition boards. By employing such a traveling standard, the calibration procedure can be remotely exercised by a calibration laboratory through the personal computer which hosts the board that has to be calibrated. In such a way, the calibration results refer to environmental, software, and hardware conditions that exactly match the board-operating conditions. Furthermore, the board unavailability time is drastically reduced, with a consequent economic advantage for the board owner. The traveling standard is based on a microcontroller which is responsible for the communication with the PC that hosts the board and for the board-stimulus generation, and on a digital multimeter, which acts as a reference standard

Elf: computer automation and error correction for a microwave network analyzer

A microwave measurement system has been developed that combines a personal computer (PC) and an conventional vector network analyzer to yield a full complex-error-corrected automatic network analyzer. The system consists of a Hewlett-Packard HP 8410C network analyzer, an HP 8350B sweep oscillator, and an IBM PC. A program called Elf runs on the PC, performing calibration and measurement algorithms and providing a flexible, menu-oriented user interface. The system, when calibrated, achieves a worst-case measurement error vector of magnitude ≤ 0.02 for transmission and reflection coefficient measurements over the 2-12.4-GHz frequency range and has a measurement speed of three frequency points/s. Elf provides an inexpensive method for upgrading the HP 8410 to achieve the high accuracy of an automatic network analyzer

MIS capacitor studies on silicon carbide single crystals

Cubic SIC metal-insulator-semiconductor (MIS) capacitors with thermally grown or chemical-vapor-deposited (CVD) insulators were characterized by capacitance-voltage (C-V), conductance-voltage (G-V), and current-voltage (I-V) measurements. The purpose of these measurements was to determine the four charge densities commonly present in an MIS capacitor (oxide fixed charge, N(f); interface trap level density, D(it); oxide trapped charge, N(ot); and mobile ionic charge, N(m)) and to determine the stability of the device properties with electric-field stress and temperature. The section headings in the report include the following: Capacitance-voltage and conductance-voltage measurements; Current-voltage measurements; Deep-level transient spectroscopy; and Conclusions (Electrical characteristics of SiC MIS capacitors)

Power transistor switching characterization

The switching properties of power transistors are investigated. The devices studied were housed in IO-3 cases and were of an n(+)-p-n(-)-n(+) vertical dopant structure. The effects of the magnitude of the reverse-base current and temperature on the reverse-bias second breakdown characteristics are discussed. Brief discussions of device degradation due to second breakdown and of a constant voltage turn-off circuit are included. A description of a vacuum tube voltage clamp circuit which reduces clamped collector voltage overshoot is given

Printed Circuit Board (PCB) design process and fabrication

This module describes main characteristics of Printed Circuit Boards (PCBs). A brief history of PCBs is introduced in the first chapter. Then, the design processes and the fabrication of PCBs are addressed and finally a study case is presented in the last chapter of the module.Peer ReviewedPostprint (published version