Forecasting mix-sensitive semiconductor fabrication tool set requirements under demand uncertainty

Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2001.Includes bibliographical references (leaves 74-75).by Alison L. Page.S.M.M.B.A

Simulation and optimization techniques applied in semiconductor assembly and test operations

The importance of back-end operations in semiconductor manufacturing has been growing steadily in the face of higher customer expectations and stronger competition in the industry. In order to achieve low cycle times, high throughput, and high utilization while improving due-date performance, more effective tools are needed to support machine setup and lot dispatching decisions. In previous work, the problem of maximizing the weighted throughput of lots undergoing assembly and test (AT), while ensuring that critical lots are given priority, was investigated and a greedy randomized adaptive search procedure (GRASP) developed to find solutions. Optimization techniques have long been used for scheduling manufacturing operations on a daily basis. Solutions provide a prescription for machine setups and job processing over a finite the planning horizon. In contrast, simulation provides more detail but in a normative sense. It tells you how the system will evolve in real time for a given demand, a given set of resources and rules for using them. A simulation model can also accommodate changeovers, initial setups and multi-pass requirements easily. The first part of the research is to show how the results of an optimization model can be integrated with the decisions made within a simulation model. The problem addressed is defined in terms of four hierarchical objectives: minimize the weighted sum of key device shortages, maximize weighted throughput, minimize the number of machines used, and minimize makespan for a given set of lots in queue, and a set of resources that includes machines and tooling. The facility can be viewed as a reentrant flow shop. The basic simulation was written in AutoSched AP (ASAP) and then enhanced with the help of customization features available in the software. Several new dispatch rules were developed. Rule_First_setup is able to initialize the simulation with the setups obtained with the GRASP. Rule_All_setups enables a machine to select the setup provided by the optimization solution whenever a decision is about to be made on which setup to choose subsequent to the initial setup. Rule_Hotlot was also proposed to prioritize the processing of the hot lots that contain key devices. The objective of the second part of the research is to design and implement heuristics within the simulation model to schedule back-end operations in a semiconductor AT facility. Rule_Setupnum lets the machines determine which key device to process according to a machine setup frequency table constructed from the GRASP solution. GRASP_asap embeds a more robust selection features of GRASP in the ASAP model through customization. This allows ASAP to explore a larger portion of the feasible region at each decision point by randomizing machine setups using adaptive probability distributions that are a function of solution quality. Rule_Greedy, which is a simplification of GRASP_asap, always picks the setup for a particular machine that gives the greatest marginal improvement in the objective function among all candidates. The purpose of the third part of the research is to statistically validate the relative effectiveness of our top six dispatch rules by comparing their performance on 30 real and randomly generated data sets. Using both GRASP and our ASAP discrete event simulation model, we have (1) identified the general order of dispatch rule performance, (2) investigated the impact of having setups installed on machines at time zero on rule performance, (3) determined the conditions under which restricting the maximum number of changeover affects the rule performance, and (4) studied the factors that might simultaneously affect rule performance with the help of a common random numbers experimental design. In the analysis, the first two objectives, weighted key device shortages and weighted throughput, are used to measure outcomes.Operations Research and Industrial Engineerin

Sensitivity Analysis and Discrete Stochastic Optimization for Semiconductor Manufacturing Systems

The semiconductor industry is a capital-intensive industry with rapid time-to-market, short product development cycles, complex product flows and other characteristics. These factors make it necessary to utilize equipment efficiently and reduce cycle times. Further, the complexity and highly stochastic nature of these manufacturing systems make it difficult to study their characteristics through analytical models. Hence we resort to simulation-based methodologies to model these systems.This research aims at developing and implementing simulation-based operations research techniques to facilitate System Control (through sensitivity analysis) and System Design (through optimization) for semiconductor manufacturing systems.Sensitivity analysis for small changes in input parameters is performed using gradient estimation techniques. Gradient estimation methods are evaluated by studying the state of the art and comparing the finite difference method and simultaneous perturbation method by applying them to a stochastic manufacturing system. The results are compared with the gradients obtained through analytical queueing models. The finite difference method is implemented in a heterogeneous simulation environment (HSE)-based decision support tool for process engineers. This tool performs heterogeneous simulations and sensitivity analyses.The gradient-based techniques used for sensitivity analysis form the building blocks for a gradient-based discrete stochastic optimization procedure. This procedure is applied to the problem of allocating a limited budget to machine purchases to achieve throughput requirements and minimize cycle time. The performance of the algorithm is evaluated by applying the algorithm on a wide range of problem instances

Outsourcing trends in semiconductor industry

Thesis (S.M. in Engineering and Management)--Massachusetts Institute of Technology, Engineering Systems Division, 2010.Cataloged from PDF version of thesis.Includes bibliographical references (p. 82-83).Microelectronic devices traditionally were manufactured by companies that both designed and produced integrated chips. This process was important in 1970's and 1980's when the manufacturing processes required tweaking the design, understanding of the manufacturing processes and occasional need to redesign. As manufacturing techniques and standards evolved, companies have changed their business model and have started to outsource their manufacturing to merchant foundries. Semiconductor companies have also started to outsource the design and verification of their chips to third party design service companies and focus on core competence like research and development of new technologies and defining protocols. This trend has evolved even though the chips have become much more complex, hard to design and hard to manufacture. This thesis studies the different players in the supply chain, how each player has evolved and the challenges companies face in making decisions regarding outsourcing internal processes. It was found that the advancements in the downstream industries such as EDA, Design Suppliers and EMS have helped fabless companies remain competitive with IDM's (Integrated Device Manufacturers). The fabless companies compete in different markets that do not need the most advanced processing technologies used by leading-edge companies.by Karthikeyan Malli Mohan.S.M.in Engineering and Managemen

Run by Run Control for Semiconductor Manufacturing

A new type of Run-by-Run controller based on the DHOBE (Dasgupta-Huang Optimal Bounding Ellipsoid) algorithm is designed and simulated for semiconductor manufacturing process. One approach is to use the algorithm to implement online model identification which leads to a model-reference controller. The other approach utilizes the worst case idea, to implement the set-valued controller. Both kinds of controllers are applied to linear and quadratic models which are derived from experiments. The controllers are simulated for cases when processes satisfy slow drifting, abrupt shift, bad data and model errors. The controllers are tuned according to the requirements of the algorithm and process and the simulation data is analyzed according to the performance benchmark. All the simulation results are compared to either the Exponentiallly Weighted Moving Average (EWMA) or Optimal Adaptive Quality Controller (OAQC) control method

Development of a seamlessly integrated factory planning software tool (prototype) to evaluate and optimize surface mount manufacturing lines

Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1995.Includes bibliographical references (p. 182).by Vijay Mehra.M.S

Dynamic Scheduling Method for Job-Shop Manufacturing Systems by Deep Reinforcement Learning with Proximal Policy Optimization

With the rapid development of Industrial 4.0, the modern manufacturing system has been experiencing profoundly digital transformation. The development of new technologies helps to improve the efficiency of production and the quality of products. However, for the increasingly complex production systems, operational decision making encounters more challenges in terms of having sustainable manufacturing to satisfy customers and markets’ rapidly changing demands. Nowadays, rule-based heuristic approaches are widely used for scheduling management in production systems, which, however, significantly depends on the expert domain knowledge. In this way, the efficiency of decision making could not be guaranteed nor meet the dynamic scheduling requirement in the job-shop manufacturing environment. In this study, we propose using deep reinforcement learning (DRL) methods to tackle the dynamic scheduling problem in the job-shop manufacturing system with unexpected machine failure. The proximal policy optimization (PPO) algorithm was used in the DRL framework to accelerate the learning process and improve performance. The proposed method was testified within a real-world dynamic production environment, and it performs better compared with the state-of-the-art methods

Entwicklung und Einführung von Produktionssteuerungsverbesserungen für die kundenorientierte Halbleiterfertigung

Production control in a semiconductor production facility is a very complex and timeconsuming task. Different demands regarding facility performance parameters are defined by customer and facility management. These requirements are usually opponents, and an efficient strategy is not simple to define. In semiconductor manufacturing, the available production control systems often use priorities to define the importance of each production lot. The production lots are ranked according to the defined priorities. This process is called dispatching. The priority allocation is carried out by special algorithms. In literature, a huge variety of different strategies and rules is available. For the semiconductor foundry business, there is a need for a very flexible and adaptable policy taking the facility state and the defined requirements into account. At our case the production processes are characterized by a low-volume high-mix product portfolio. This portfolio causes additional stability problems and performance lags. The unstable characteristic increases the influence of reasonable production control logic. This thesis offers a very flexible and adaptable production control policy. This policy is based on a detailed facility model with real-life production data. The data is extracted from a real high-mix low-volume semiconductor facility. The dispatching strategy combines several dispatching rules. Different requirements like line balance, throughput optimization and on-time delivery targets can be taken into account. An automated detailed facility model calculates a semi-optimal combination of the different dispatching rules under a defined objective function. The objective function includes different demands from the management and the customer. The optimization is realized by a genetic heuristic for a fast and efficient finding of a close-to-optimal solution. The strategy is evaluated with real-life production data. The analysis with the detailed facility model of this fab shows an average improvement of 5% to 8% for several facility performance parameters like cycle time per mask layer. Finally the approach is realized and applied at a typical high-mix low-volume semiconductor facility. The system realization bases on a JAVA implementation. This implementation includes common state-of-the-art technologies such as web services. The system replaces the older production control solution. Besides the dispatching algorithm, the production policy includes the possibility to skip several metrology operations under defined boundary conditions. In a real-life production process, not all metrology operations are necessary for each lot. The thesis evaluates the influence of the sampling mechanism to the production process. The solution is included into the system implementation as a framework to assign different sampling rules to different metrology operations. Evaluations show greater improvements at bottleneck situations. After the productive introduction and usage of both systems, the practical results are evaluated. The staff survey offers good acceptance and response to the system. Furthermore positive effects on the performance measures are visible. The implemented system became part of the daily tools of a real semiconductor facility.Produktionssteuerung im Bereich der kundenorientierten Halbleiterfertigung ist heutzutage eine sehr komplexe und zeitintensive Aufgabe. Verschiedene Anforderungen bezüglich der Fabrikperformance werden seitens der Kunden als auch des Fabrikmanagements definiert. Diese Anforderungen stehen oftmals in Konkurrenz. Dadurch ist eine effiziente Strategie zur Kompromissfindung nicht einfach zu definieren. Heutige Halbleiterfabriken mit ihren verfügbaren Produktionssteuerungssystemen nutzen oft prioritätsbasierte Lösungen zur Definition der Wichtigkeit eines jeden Produktionsloses. Anhand dieser Prioritäten werden die Produktionslose sortiert und bearbeitet. In der Literatur existiert eine große Bandbreite verschiedener Algorithmen. Im Bereich der kundenorientierten Halbleiterfertigung wird eine sehr flexible und anpassbare Strategie benötigt, die auch den aktuellen Fabrikzustand als auch die wechselnden Kundenanforderungen berücksichtigt. Dies gilt insbesondere für den hochvariablen geringvolumigen Produktionsfall. Diese Arbeit behandelt eine flexible Strategie für den hochvariablen Produktionsfall einer solchen Produktionsstätte. Der Algorithmus basiert auf einem detaillierten Fabriksimulationsmodell mit Rückgriff auf Realdaten. Neben synthetischen Testdaten wurde der Algorithmus auch anhand einer realen Fertigungsumgebung geprüft. Verschiedene Steuerungsregeln werden hierbei sinnvoll kombiniert und gewichtet. Wechselnde Anforderungen wie Linienbalance, Durchsatz oder Liefertermintreue können adressiert und optimiert werden. Mittels einer definierten Zielfunktion erlaubt die automatische Modellgenerierung eine Optimierung anhand des aktuellen Fabrikzustandes. Die Optimierung basiert auf einen genetischen Algorithmus für eine flexible und effiziente Lösungssuche. Die Strategie wurde mit Realdaten aus der Fertigung einer typischen hochvariablen geringvolumigen Halbleiterfertigung geprüft und analysiert. Die Analyse zeigt ein Verbesserungspotential von 5% bis 8% für die bekannten Performancekriterien wie Cycletime im Vergleich zu gewöhnlichen statischen Steuerungspolitiken. Eine prototypische Implementierung realisiert diesen Ansatz zur Nutzung in der realen Fabrikumgebung. Die Implementierung basiert auf der JAVA-Programmiersprache. Aktuelle Implementierungsmethoden erlauben den flexiblen Einsatz in der Produktionsumgebung. Neben der Fabriksteuerung wurde die Möglichkeit der Reduktion von Messoperationszeit (auch bekannt unter Sampling) unter gegebenen Randbedingungen einer hochvariablen geringvolumigen Fertigung untersucht und geprüft. Oftmals ist aufgrund stabiler Prozesse in der Fertigung die Messung aller Lose an einem bestimmten Produktionsschritt nicht notwendig. Diese Arbeit untersucht den Einfluss dieses gängigen Verfahrens aus der Massenfertigung für die spezielle geringvolumige Produktionsumgebung. Die Analysen zeigen insbesondere in Ausnahmesituationen wie Anlagenausfällen und Kapazitätsengpässe einen positiven Effekt, während der Einfluss unter normalen Produktionsbedingungen aufgrund der hohen Produktvariabilität als gering angesehen werden kann. Nach produktiver Einführung in einem typischen Vertreter dieser Halbleiterfabriken zeigten sich schnell positive Effekte auf die Fabrikperformance als auch eine breite Nutzerakzeptanz. Das implementierte System wurde Bestandteil der täglichen genutzten Werkzeuglandschaft an diesem Standort

Online Simulation in Semiconductor Manufacturing

In semiconductor manufacturing discrete event simulation systems are quite established to support multiple planning decisions. During the recent years, the productivity is increasing by using simulation methods. The motivation for this thesis is to use online simulation not only for planning decisions, but also for a wide range of operational decisions. Therefore an integrated online simulation system for short term forecasting has been developed. The production environment is a mature high mix logic wafer fab. It has been selected because of its vast potential for performance improvement. In this thesis several aspects of online simulation will be addressed: The first aspect is the implementation of an online simulation system in semiconductor manufacturing. The general problem is to achieve a high speed, a high level of detail, and a high forecast accuracy. To resolve these problems, an online simulation system has been created. The simulation model has a high level of detail. It is created automatically from underling fab data. To create such a simulation model from fab data, additional problems related to the underlying data arise. The major parts are the data access, the data integration, and the data quality. These problems have been solved by using an integrated data model with several data extraction, data transformation, and data cleaning steps. The second aspect is related to the accuracy of online simulation. The overall problem is to increase the forecast horizon, increase the level of detail of the forecast and reduce the forecast error. To provide useful forecast results, the simulation model contains a high level of modeling details and a proper initialization. The influences on the forecast quality will be analyzed. The results show that the simulation forecast accuracy achieves good quality to predict future fab performance. The last aspect is to find ways to use simulation forecast results to improve the fab performance. Numerous applications have been identified. For each application a description is available. It contains the requirements of such a forecast, the decision variables, and background information. An application example shows, where a performance problem exists and how online simulation is able to resolve it. To further enhance the real time capability of online simulation, a major part is to investigate new ways to connect the simulation model with the wafer fab. For fab driven simulation, the simulation model and the real wafer fab run concurrently. The wafer fab provides several events to update the simulation during runtime. So the model is always synchronized with the real fab. It becomes possible to start a simulation run in real time. There is no further delay for data extraction, data transformation and model creation. A prototype for a single work center has been implemented to show the feasibility