3,715 research outputs found

    Statistical Power Supply Dynamic Noise Prediction in Hierarchical Power Grid and Package Networks

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    One of the most crucial high performance systems-on-chip design challenge is to front their power supply noise sufferance due to high frequencies, huge number of functional blocks and technology scaling down. Marking a difference from traditional post physical-design static voltage drop analysis, /a priori dynamic voltage drop/evaluation is the focus of this work. It takes into account transient currents and on-chip and package /RLC/ parasitics while exploring the power grid design solution space: Design countermeasures can be thus early defined and long post physical-design verification cycles can be shortened. As shown by an extensive set of results, a carefully extracted and modular grid library assures realistic evaluation of parasitics impact on noise and facilitates the power network construction; furthermore statistical analysis guarantees a correct current envelope evaluation and Spice simulations endorse reliable result

    Statistical circuit simulations - from ‘atomistic’ compact models to statistical standard cell characterisation

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    This thesis describes the development and application of statistical circuit simulation methodologies to analyse digital circuits subject to intrinsic parameter fluctuations. The specific nature of intrinsic parameter fluctuations are discussed, and we explain the crucial importance to the semiconductor industry of developing design tools which accurately account for their effects. Current work in the area is reviewed, and three important factors are made clear: any statistical circuit simulation methodology must be based on physically correct, predictive models of device variability; the statistical compact models describing device operation must be characterised for accurate transient analysis of circuits; analysis must be carried out on realistic circuit components. Improving on previous efforts in the field, we posit a statistical circuit simulation methodology which accounts for all three of these factors. The established 3-D Glasgow atomistic simulator is employed to predict electrical characteristics for devices aimed at digital circuit applications, with gate lengths from 35 nm to 13 nm. Using these electrical characteristics, extraction of BSIM4 compact models is carried out and their accuracy in performing transient analysis using SPICE is validated against well characterised mixed-mode TCAD simulation results for 35 nm devices. Static d.c. simulations are performed to test the methodology, and a useful analytic model to predict hard logic fault limitations on CMOS supply voltage scaling is derived as part of this work. Using our toolset, the effect of statistical variability introduced by random discrete dopants on the dynamic behaviour of inverters is studied in detail. As devices scaled, dynamic noise margin variation of an inverter is increased and higher output load or input slew rate improves the noise margins and its variation. Intrinsic delay variation based on CV/I delay metric is also compared using ION and IEFF definitions where the best estimate is obtained when considering ION and input transition time variations. Critical delay distribution of a path is also investigated where it is shown non-Gaussian. Finally, the impact of the cell input slew rate definition on the accuracy of the inverter cell timing characterisation in NLDM format is investigated

    On-Chip Noise Sensor for Integrated Circuit Susceptibility Investigations

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    page number: 12International audienceWith the growing concerns about electromagnetic compatibility of integrated circuits, the need for accurate prediction tools and models to reduce risks of non-compliance becomes critical for circuit designers. However, on-chip characterization of noise is still necessary for model validation and design optimization. Although different on-chip measurement solutions have been proposed for emission issue characterization, no on-chip measurement methods have been proposed to address the susceptibility issues. This paper presents an on-chip noise sensor dedicated to the study of circuit susceptibility to electromagnetic interferences. A demonstration of the sensor measurement performances and benefits is proposed through a study of the susceptibility of a digital core to conducted interferences. Sensor measurements ensure a better characterization of actual coupling of interferences within the circuit and a diagnosis of failure origins

    Design and debugging of multi-step analog to digital converters

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    With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

    Cross-Layer Resiliency Modeling and Optimization: A Device to Circuit Approach

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    The never ending demand for higher performance and lower power consumption pushes the VLSI industry to further scale the technology down. However, further downscaling of technology at nano-scale leads to major challenges. Reduced reliability is one of them, arising from multiple sources e.g. runtime variations, process variation, and transient errors. The objective of this thesis is to tackle unreliability with a cross layer approach from device up to circuit level

    Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

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    The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

    A digital tuning scheme for digitally programmable integrated continuous-time filters and techniques for high-precision monolithic linear circuit design and implementation

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    Multiple topics which all focus on precision monolithic circuit design but beyond this are not directly related to each other are presented. The first topic is a digital tuning scheme for digitally programmable integrated continuous-time filters (4), (8) - (10). Emphasis of this research is on development of a more general tuning scheme which can be applicable to various filter functions as well as high-frequency applications. The tuning scheme consists of two phases: system identification and adjustment. Various continuous-time filter identification methods including time-domain and frequency-domain approaches are investigated, and a filter adjustment algorithm is presented. Potential of high accuracy of the proposed tuning scheme and successful applicability to high-frequency filters with versatile functions have been demonstrated through simulations and experiments;Four other topics are separately presented. First, nonidealities associated with high-precision amplifiers (5), (7) are discussed. Special emphasis is given on analysis of statistical characteristics of random CMRR and offset of CMOS op-amps which can help estimating yield of high-volume production and help engineers design for a given yield. Next, an automatic offset compensation scheme for CMOS op-amps with ping-pong control (2), (6) is presented. A very low-voltage circuit design technique using floating gate MOSFETs (3) is introduced. Finally, an accurate and matching-free threshold voltage extraction scheme using a ratio-independent SC amplifier and a dynamic current mirror (1) is discussed

    Concepts for smart AD and DA converters

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    This thesis studies the `smart' concept for application to analog-to-digital and digital-to-analog converters. The smart concept aims at improving performance - in a wide sense - of AD/DA converters by adding on-chip intelligence to extract imperfections and to correct for them. As the smart concept can correct for certain imperfections, it can also enable the use of more efficient architectures, thus yielding an additional performance boost. Chapter 2 studies trends and expectations in converter design with respect to applications, circuit design and technology evolution. Problems and opportunities are identfied, and an overview of performance criteria is given. Chapter 3 introduces the smart concept that takes advantage of the expected opportunities (described in chapter 2) in order to solve the anticipated problems. Chapter 4 applies the smart concept to digital-to-analog converters. In the discussed example, the concept is applied to reduce the area of the analog core of a current-steering DAC. It is shown that a sub-binary variable-radix approach reduces the area of the current-source elements substantially (10x compared to state-of-the-art), while maintaining accuracy by a self-measurement and digital pre-correction scheme. Chapter 5 describes the chip implementation of the sub-binary variable-radix DAC and discusses the experimental results. The results confirm that the sub-binary variable-radix design can achieve the smallest published current-source-array area for the given accuracy (12bit). Chapter 6 applies the smart concept to analog-to-digital converters, with as main goal the improvement of the overall performance in terms of a widely used figure-of-merit. Open-loop circuitry and time interleaving are shown to be key to achieve high-speed low-power solutions. It is suggested to apply a smart approach to reduce the effect of the imperfections, unintentionally caused by these key factors. On high-level, a global picture of the smart solution is proposed that can solve the problems while still maintaining power-efficiency. Chapter 7 deals with the design of a 500MSps open-loop track-and-hold circuit. This circuit is used as a test case to demonstrate the proposed smart approaches. Experimental results are presented and compared against prior art. Though there are several limitations in the design and the measurement setup, the measured performance is comparable to existing state-of-the-art. Chapter 8 introduces the first calibration method that counteracts the accuracy issues of the open-loop track-and-hold. A description of the method is given, and the implementation of the detection algorithm and correction circuitry is discussed. The chapter concludes with experimental measurement results. Chapter 9 introduces the second calibration method that targets the accuracy issues of time-interleaved circuits, in this case a 2-channel version of the implemented track-and-hold. The detection method, processing algorithm and correction circuitry are analyzed and their implementation is explained. Experimental results verify the usefulness of the method
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