70 research outputs found

    Advances in Hydrogels

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    Hydrogels are a class of soft materials with crosslinked network structures. They show good biocompatibility, biodegradability, hydrophilicity, and mechanical properties similar to those of tissue, so they have a wide range of applications. In recent years, a variety of multifunctional hydrogels with excellent performance have been developed, greatly expanding the depth and breadth of their applications. This book is the reprint of the Special Issue “Advances in Hydrogels”, which focused on the recent advances regarding hydrogels, aiming to provide reference for researchers in related fields. This book included one editorial, thirteen original research articles, and three valuable reviews from thirteen different countries including Canada, China, Thailand, Mexico, India, Saudi Arabia, Chile, Germany, the Czech Republic, Colombia, Romania, Israel, and the USA

    Agricultural Structures and Mechanization

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    In our globalized world, the need to produce quality and safe food has increased exponentially in recent decades to meet the growing demands of the world population. This expectation is being met by acting at multiple levels, but mainly through the introduction of new technologies in the agricultural and agri-food sectors. In this context, agricultural, livestock, agro-industrial buildings, and agrarian infrastructure are being built on the basis of a sophisticated design that integrates environmental, landscape, and occupational safety, new construction materials, new facilities, and mechanization with state-of-the-art automatic systems, using calculation models and computer programs. It is necessary to promote research and dissemination of results in the field of mechanization and agricultural structures, specifically with regard to farm building and rural landscape, land and water use and environment, power and machinery, information systems and precision farming, processing and post-harvest technology and logistics, energy and non-food production technology, systems engineering and management, and fruit and vegetable cultivation systems. This Special Issue focuses on the role that mechanization and agricultural structures play in the production of high-quality food and continuously over time. For this reason, it publishes highly interdisciplinary quality studies from disparate research fields including agriculture, engineering design, calculation and modeling, landscaping, environmentalism, and even ergonomics and occupational risk prevention

    Collected Papers (Neutrosophics and other topics), Volume XIV

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    This fourteenth volume of Collected Papers is an eclectic tome of 87 papers in Neutrosophics and other fields, such as mathematics, fuzzy sets, intuitionistic fuzzy sets, picture fuzzy sets, information fusion, robotics, statistics, or extenics, comprising 936 pages, published between 2008-2022 in different scientific journals or currently in press, by the author alone or in collaboration with the following 99 co-authors (alphabetically ordered) from 26 countries: Ahmed B. Al-Nafee, Adesina Abdul Akeem Agboola, Akbar Rezaei, Shariful Alam, Marina Alonso, Fran Andujar, Toshinori Asai, Assia Bakali, Azmat Hussain, Daniela Baran, Bijan Davvaz, Bilal Hadjadji, Carlos Díaz Bohorquez, Robert N. Boyd, M. Caldas, Cenap Özel, Pankaj Chauhan, Victor Christianto, Salvador Coll, Shyamal Dalapati, Irfan Deli, Balasubramanian Elavarasan, Fahad Alsharari, Yonfei Feng, Daniela Gîfu, Rafael Rojas Gualdrón, Haipeng Wang, Hemant Kumar Gianey, Noel Batista Hernández, Abdel-Nasser Hussein, Ibrahim M. Hezam, Ilanthenral Kandasamy, W.B. Vasantha Kandasamy, Muthusamy Karthika, Nour Eldeen M. Khalifa, Madad Khan, Kifayat Ullah, Valeri Kroumov, Tapan Kumar Roy, Deepesh Kunwar, Le Thi Nhung, Pedro López, Mai Mohamed, Manh Van Vu, Miguel A. Quiroz-Martínez, Marcel Migdalovici, Kritika Mishra, Mohamed Abdel-Basset, Mohamed Talea, Mohammad Hamidi, Mohammed Alshumrani, Mohamed Loey, Muhammad Akram, Muhammad Shabir, Mumtaz Ali, Nassim Abbas, Munazza Naz, Ngan Thi Roan, Nguyen Xuan Thao, Rishwanth Mani Parimala, Ion Pătrașcu, Surapati Pramanik, Quek Shio Gai, Qiang Guo, Rajab Ali Borzooei, Nimitha Rajesh, Jesús Estupiñan Ricardo, Juan Miguel Martínez Rubio, Saeed Mirvakili, Arsham Borumand Saeid, Saeid Jafari, Said Broumi, Ahmed A. Salama, Nirmala Sawan, Gheorghe Săvoiu, Ganeshsree Selvachandran, Seok-Zun Song, Shahzaib Ashraf, Jayant Singh, Rajesh Singh, Son Hoang Le, Tahir Mahmood, Kenta Takaya, Mirela Teodorescu, Ramalingam Udhayakumar, Maikel Y. Leyva Vázquez, V. Venkateswara Rao, Luige Vlădăreanu, Victor Vlădăreanu, Gabriela Vlădeanu, Michael Voskoglou, Yaser Saber, Yong Deng, You He, Youcef Chibani, Young Bae Jun, Wadei F. Al-Omeri, Hongbo Wang, Zayen Azzouz Omar

    High-Density Solid-State Memory Devices and Technologies

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    This Special Issue aims to examine high-density solid-state memory devices and technologies from various standpoints in an attempt to foster their continuous success in the future. Considering that broadening of the range of applications will likely offer different types of solid-state memories their chance in the spotlight, the Special Issue is not focused on a specific storage solution but rather embraces all the most relevant solid-state memory devices and technologies currently on stage. Even the subjects dealt with in this Special Issue are widespread, ranging from process and design issues/innovations to the experimental and theoretical analysis of the operation and from the performance and reliability of memory devices and arrays to the exploitation of solid-state memories to pursue new computing paradigms

    Application of Power Electronics Converters in Smart Grids and Renewable Energy Systems

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    This book focuses on the applications of Power Electronics Converters in smart grids and renewable energy systems. The topics covered include methods to CO2 emission control, schemes for electric vehicle charging, reliable renewable energy forecasting methods, and various power electronics converters. The converters include the quasi neutral point clamped inverter, MPPT algorithms, the bidirectional DC-DC converter, and the push–pull converter with a fuzzy logic controller

    유전알고리즘 및 강화학습을 사용한 고속 회로 설계 자동화 프레임워크

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    학위논문(석사) -- 서울대학교대학원 : 융합과학기술대학원 지능정보융합학과, 2022.2. 전동석.Although design automation is a key enabler of modern large-scale digital systems, automating the transistor-level circuit design process still remains a challenge. Some recent works suggest that deep learning algorithms could be adopted to find optimal transistor dimensions in relatively small circuitry such as analog amplifiers. However, those approaches are not capable of exploring different circuit structures to meet the given design constraints. In this work, we propose an automatic circuit design framework that can generate practical circuit structures from scratch as well as optimize the size of each transistor, considering performance and reliability. We employ the framework to design level shifter circuits, and the experimental results show that the framework produces novel level shifter circuit topologies and the automatically optimized designs achieve 2.8-5.3× lower PDP than prior arts designed by human experts.설계 자동화는 대규모 디지털 시스템을 가능하게 하는 핵심 요소이지만 트랜지스터 수준에서 회로 설계 프로세스를 자동화하는 것은 여전히 어려운 과제로 남아 있습니다. 최근 연구에서는 아날로그 앰프와 같은 비교적 작은 회로에서 최적의 성능을 보이는 트랜지스터 크기를 찾기 위해 deep learning 알고리즘을 활용할 수 있다고 말합니다. 그러나 이러한 접근 방식은 주어진 설계 constraint를 충족하는 다른 회로 구조 탐색에 적용하기 어렵습니다. 본 연구에서는 성능과 신뢰성을 고려하여 각 트랜지스터의 크기를 최적화할 뿐만 아니라 처음부터 실용적인 회로 구조를 생성할 수 있는 자동 회로 설계 framework를 제안합니다. 우리는 framework를 사용하여 level shifter 회로를 설계했으며 실험 결과는 프레임워크가 새로운 level shifter 회로 토폴로지를 생성하고 자동으로 최적화된 설계가 인간 전문가가 설계한 선행 기술보다 2.8-5.3배 더 낮은 PDP를 달성한다는 것을 보여줍니다.Abstract i Contents ii List of Tables iv List of Figures v List of Algorithms vi 1 Introduction 1 2 Related work 6 2.1 Genetic Algorithm 6 2.2 NeuroEvolution of Augmenting Topologies (NEAT) 7 2.3 Reinforcement Learning (RL) 10 2.4 DDPG, D4PG, and PPO 12 2.5 Level Shifter 14 3 Proposed circuit design framework 17 3.1 Topology Generator 17 3.2 Circuit Optimizer 25 4 Experiment Result 32 4.1 Level Shifter Design 32 4.2 Topology Generation 34 4.3 Circuit Optimization 36 4.4 Test Chip Fabrication 42 4.5 Applicability of Topology Generator 47 5 Conclusion 50 Abstract (In Korean) 57석

    Advanced Applications of Rapid Prototyping Technology in Modern Engineering

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    Rapid prototyping (RP) technology has been widely known and appreciated due to its flexible and customized manufacturing capabilities. The widely studied RP techniques include stereolithography apparatus (SLA), selective laser sintering (SLS), three-dimensional printing (3DP), fused deposition modeling (FDM), 3D plotting, solid ground curing (SGC), multiphase jet solidification (MJS), laminated object manufacturing (LOM). Different techniques are associated with different materials and/or processing principles and thus are devoted to specific applications. RP technology has no longer been only for prototype building rather has been extended for real industrial manufacturing solutions. Today, the RP technology has contributed to almost all engineering areas that include mechanical, materials, industrial, aerospace, electrical and most recently biomedical engineering. This book aims to present the advanced development of RP technologies in various engineering areas as the solutions to the real world engineering problems

    3D modeling and integration of current and future interconnect technologies

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    Title from PDF of title page viewed June 21, 2021Dissertation advisor: Masud H. ChowdhuryVitaIncludes bibliographical references (pages 133-138)Thesis (Ph.D.)--School of Computing and Engineering and Department of Physics and Astronomy. University of Missouri--Kansas City, 2021To ensure maximum circuit reliability it is very important to estimate the circuit performance and signal integrity in the circuit design phase. A full phase simulation for performance estimation of a large-scale circuit not only require a massive computational resource but also need a lot of time to produce acceptable results. The estimation of performance/signal integrity of sub-nanometer circuits mostly depends on the interconnect capacitance. So, an accurate model for interconnect capacitance can be used in the circuit CAD (computer-aided design) tools for circuit performance estimation before circuit fabrication which reduces the computational resource requirement as well as the time constraints. We propose a new capacitance models for interconnect lines in multilevel interconnect structures by geometrically modeling the electrical flux lines of the interconnect lines. Closed-form equations have been derived analytically for ground and coupling capacitance. First, the capacitance model for a single line is developed, and then the new model is used to derive expressions for the capacitance of a line surrounded by neighboring lines in the same and the adjacent layers above and below. These expressions are simple, and the calculated results are within 10% of Ansys Q3D extracted values. Through silicon via (TSV) is one of the key components of the emerging 3D ICs. However, increasing number of TSVs in smaller silicon area leads to some severe negative impacts on the performance of the 3D IC. Growing signal integrity issues in TSVs is one of the major challenges of 3D integration. In this paper, different materials for the cores of the vias and the interposers are investigated to find the best possible combination that can reduce crosstalk and other losses like return loss and insertion loss in the TSVs. We have explored glass and silicon as interposer materials. The simulation results indicate that glass is the best option as interposer material although silicon interposer has some distinct advantages. For via cores three materials - copper (Cu), tungsten (W) and Cu-W bimetal are considered. From the analysis it can concluded that W would be better for high frequency applications due to lower transmission coefficient. Cu offers higher conductivity, but it has larger thermal expansion coefficient mismatch with silicon. The performance of Cu-W bimetal via would be in between Cu and W. However, W has a thermal expansion coefficient close to silicon. Therefore, bimetal Cu-W based TSV with W as the outer layer would be a suitable option for high frequency 3D IC. Here, we performed the analysis in terms of return loss, transmission coefficient and crosstalk in the vias. Signal speed in current digital systems depends mainly on the delay of interconnects. To overcome this delay problem and keep up with Moore’s law, 3D integrated circuit (vertical integration of multiple dies) with through-silicon via (TSV) has been introduced to ensure much smaller interconnect lengths, and lower delay and power consumption compared to conventional 2D IC technology. Like 2D circuit, the estimation of 3D circuit performance depends on different electrical parameters (capacitance, resistance, inductance) of the TSV. So, accurate modeling of the electrical parameters of the TSV is essential for the design and analysis of 3D ICs. We propose a set of new models to estimate the capacitance, resistance, and inductance of a Cu-filled TSV. The proposed analytical models are derived from the physical shape and the size of the TSV. The modeling approach is comprehensive and includes both the cylindrical and tapered TSVs as well as the bumps. On-chip integration of inductors has always been very challenging. However, for sub- 14nm on-chip applications, large area overhead imposed by the on-chip capacitors and inductors has become a more severe concern. To overcome this issue and ensure power integrity, a novel 3D Through-Silicon-Via (TSV) based inductor design is presented. The proposed TSV based inductor has the potential to achieve both high density and high performance. A new design of a Voltage Controlled Oscillator (VCO) utilizing the TSV based inductor is also presented. The implementation of the VCO is intended to study the feasibility, performance, and real-world application of the proposed TSV based inductor.Introduction -- Background of capacitance modeling of on-chip interconnect -- Accurate modeling of interconnect capacitance in multilevel interconnect structures for sub 22nm technology -- Analysis of different materials and structures for through silicon via and through glass via in 3D integrated circuits -- Impacts of different shapes of through-silicon-via core on 3D IC performance -- Accurate electrical modeling of cu-filled through-silicon-via (TSV) -- Design and characterize TSV based inductor for high frequency voltage-controlled oscillator design -- Conclusion and future wor
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