Automatic Bridge-based Interface for Differential Capacitive Full Sensing

Abstract The authors here propose, for the first time, an automatic analog interface for differential capacitance estimation, able to reveal and quantify both low and high (full-range) capacitive variations. The working principle is based on a modified De-Sauty AC bridge configuration where two differential capacitances and two resistances are employed, one of which is implemented by a Voltage Controlled Resistor (VCR). Through a suitable feedback loop, a very accurate estimation over the complete range of the differential capacitance variation is possible, while the bridge allows a continuous differential capacitance evaluation without the need of knowing the accurate value of the sensor baseline and/or its variation range. A general but very simple formula, considering both the "autobalancing" and the "out-of-equilibrium" ranges, is also given. Theoretical, experimental and simulated results are in a very good agreement. Sensitivity and resolution values, typical of sensors and their interfaces, have been determined in a practical case, showing satisfactory values

Development of the Telemetrical Intraoperative Soft Tissue Tension Monitoring System in Total Knee Replacement with MEMS and ASIC Technologies

The alignment of the femoral and tibial components of the Total Knee Arthoplasty (TKA) is one of the most important factors to implant survivorship. Hence, numerous ligament balancing techniques and devices have been developed in order to accurately balance the knee intra-operatively. Spacer block, tensioner and tram adapter are instruments that allow surgeons to qualitatively balance the flexion and extension gaps during TKA. However, even with these instruments, the surgical procedure still relies on the skill and experience of the surgeon. The objective of this thesis is to develop a computerized surgical instrument that can acquire intra-operative data telemetrically for surgeons and engineers. Microcantilever is chosen to be used as the strain sensing elements. Even though many high end off-the-shelf data acquisition components and integrated circuit (IC) chips exist on the market, yet multiple components are required to process the entire array of microcantilevers and achieve the desired functions. Due to the size limitation of the off-chip components, an Application Specific Integrated Circuit (ASIC) chip is designed and fabricated. Using a spacer block as a base, sensors, a data acquisition system as well as the transmitter and antenna are embedded into it. The electronics are sealed with medical grade epoxy

Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators

The paper reports on the fabrication and characterization of high-resolution strain sensors for structural materials based on Silicon On Insulator flexural resonators manufactured by polysilicon Low-Pressure Chemical Vapour Deposition vacuum packaging. The sensors present sensitivity of 164 Hz/με and strain resolution limit of 150 pε on steel for a measurement time of 315 ms, in both tensile and compressive strain regimes. The readout of the sensor is implemented with a transimpedance oscillator circuit implemented on Printed Circuit Board, in which a microcontroller-based reciprocal frequency counter is integrated. The performance of the sensors on steel are investigated for measurement bandwidths from 1.5 to 500 Hz and a comparison with conventional metal strain gauges is proposed.The contribution of Mr. Filippo Bonafè, Mr. Fabrizio Tamarri, Mr. Michele Sanmartin and Mr. Giulio Pizzochero in the clean room processing employed for the manufacturing of the MEMS sensors is acknowledged. The contribution of Dr. Michele Bellettato in sample preparation is also acknowledged.This is the author accepted manuscript. The final version is available from Elsevier via http://dx.doi.org/10.1016/j.sna.2016.01.00

An Implantable Low Pressure, Low Drift, Dual BioPressure Sensor and In-Vivo Calibration Methods Thereof

The human body’s intracranial pressure (ICP) is a critical component in sustaining healthy blood flow to the brain while allowing adequate volume for brain tissue within the rigid structures of the cranium. Disruptions in the body’s autoregulation of intracranial pressure are often caused by hemorrhage, tumors, edema, or excess cerebral spinal fluid resulting in treatments that are estimated to globally cost up to approximately five billion dollars annually. A critical element in the contemporary management of acute head injury, intracranial hemorrhage, stroke, or other conditions resulting in intracranial hypertension, is the real-time monitoring of ICP. Currently, such mainstream clinical monitoring can only take place short-term within an acute care hospital. The monitoring is prone to measurement drift and is comprised of externally tethered pressure sensors that are temporarily implanted into the brain, thus carrying a significant risk of infection. To date, reliable, low drift, completely internalized, long-term ICP monitoring devices remain elusive. The successful development of such a device would not only be safer and more reliable in the short-term but would expand the use of ICP monitoring for the management of chronic intracranial hypertension and enable further clinical research into these disorders. The research herein reviews the current challenges of existing ICP monitoring systems, develops a new novel sensing technology, and evaluates the same for potentially facilitating long-term implantable ICP sensing. Based upon the findings of this research, this dissertation proposes and evaluates a dual matched-die piezo-resistive strain sensing device, with a novel in-vivo calibration system and method thereof, for application to long-term implantable ICP sensing

Integrated Electronics for Wireless Imaging Microsystems with CMUT Arrays

Integration of transducer arrays with interface electronics in the form of single-chip CMUT-on-CMOS has emerged into the field of medical ultrasound imaging and is transforming this field. It has already been used in several commercial products such as handheld full-body imagers and it is being implemented by commercial and academic groups for Intravascular Ultrasound and Intracardiac Echocardiography. However, large attenuation of ultrasonic waves transmitted through the skull has prevented ultrasound imaging of the brain. This research is a prime step toward implantable wireless microsystems that use ultrasound to image the brain by bypassing the skull. These microsystems offer autonomous scanning (beam steering and focusing) of the brain and transferring data out of the brain for further processing and image reconstruction. The objective of the presented research is to develop building blocks of an integrated electronics architecture for CMUT based wireless ultrasound imaging systems while providing a fundamental study on interfacing CMUT arrays with their associated integrated electronics in terms of electrical power transfer and acoustic reflection which would potentially lead to more efficient and high-performance systems. A fully wireless architecture for ultrasound imaging is demonstrated for the first time. An on-chip programmable transmit (TX) beamformer enables phased array focusing and steering of ultrasound waves in the transmit mode while its on-chip bandpass noise shaping digitizer followed by an ultra-wideband (UWB) uplink transmitter minimizes the effect of path loss on the transmitted image data out of the brain. A single-chip application-specific integrated circuit (ASIC) is de- signed to realize the wireless architecture and interface with array elements, each of which includes a transceiver (TRX) front-end with a high-voltage (HV) pulser, a high-voltage T/R switch, and a low-noise amplifier (LNA). Novel design techniques are implemented in the system to enhance the performance of its building blocks. Apart from imaging capability, the implantable wireless microsystems can include a pressure sensing readout to measure intracranial pressure. To do so, a power-efficient readout for pressure sensing is presented. It uses pseudo-pseudo differential readout topology to cut down the static power consumption of the sensor for further power savings in wireless microsystems. In addition, the effect of matching and electrical termination on CMUT array elements is explored leading to new interface structures to improve bandwidth and sensitivity of CMUT arrays in different operation regions. Comprehensive analysis, modeling, and simulation methodologies are presented for further investigation.Ph.D

Smart polymeric temperature sensors – for biological systems

The damaged brain is vulnerable to increase in brain temperature after a severe head injury. Continuous monitoring of intracranial temperature depicts functionality essential to the treatment of brain injury Many innovations have been made in the biomedical industry relying on electronic implants in treating condition such as traumatic brain injury (TBI) or other cerebral diseases. Hence, a methodical and reliable way to measure the temperature is crucial to assess the patient’s situation. In this investigation, an analysis of various approaches to detect the change in the temperature due to resistance, current-voltage characteristics with respect to time has been evaluated. Also, studies describing various materials used in sensors, their working principles and the results anticipated in these discrete procedures are presented. These smart temperature sensors have provided the accuracy and the stability compared to earlier methods used to detect the change in brain temperature since temperature is one of the most important variables in brain monitoring

Low-Power Reconfigurable Sensing Circuitry for the Internet-of-Things Paradigm

With ubiquitous wireless communication via Wi-Fi and nascent 5th Generation mobile communications, more devices -- both smart and traditionally dumb -- will be interconnected than ever before. This burgeoning trend is referred to as the Internet-of-Things. These new sensing opportunities place a larger burden on the underlying circuitry that must operate on finite battery power and/or within energy-constrained environments. New developments of low-power reconfigurable analog sensing platforms like field-programmable analog arrays (FPAAs) present an attractive sensing solution by processing data in the analog domain while staying flexible in design. This work addresses some of the contemporary challenges of low-power wireless sensing via traditional application-specific sensing and with FPAAs. A large emphasis is placed on furthering the development of FPAAs by making them more accessible to designers without a strong integrated-circuit background -- much like FPGAs have done for digital designers

High performance readout circuits and devices for Lorentz force resonant CMOS-MEMS magnetic sensors

In the last decades, sensing capabilities of martphones have greatly improved since the early mobile phones of the 90’s. Moreover, wearables and the automotive industry require increasing electronics and sensing sophistication. In such echnological advance, Micro Electro Mechanical Systems (MEMS) have played an important role as accelerometers and gyroscopes were the first sensors based on MEMS technology massively introduced in the market. In contrast, it still does not exist a commercial MEMS-based compass, even though Lorentz force MEMS magnetometers were first proposed in the late 90’s. Currently, Lorentz force MEMS magnetometers have been under the spotlight as they can offer an integrated solution to nowadays sensing power. As a consequence, great advances have been achieved, but various bottlenecks limit the introduction of Lorentz force MEMS compasses in the market. First, current MEMS magnetometers require high current consumption and high biasing voltages to achieve good sensitivities. Moreover, even though devices with excellent performance and sophistication are found in the literature, there is still a lack of research on the readout electronic circuits, specially in the digital signal processing, and closed loop control. Second, most research outcomes rely on custom MEMS fabrication rocesses to manufacture the devices. This is the same approach followed in current commercial MEMS, but it requires different fabrication processes for the electronics and the MEMS. As a consequence, manufacturing cost is high and sensor performance is affected by the MEMS-electronics interface parasitics. This dissertation presents potential solutions to these issues in order to pave the road to the commercialization of Lorentz force MEMS compasses. First, a complete closed loop, digitally controlled readout system is proposed. The readout circuitry, implemented with off-the-shelf commercial components, and the digital control, on an FPGA, are proposed as a proof of concept of the feasibility, and potential benefits, of such architecture. The proposed system has a measured noise of 550 nT / vHz while the MEMS is biased with 300 µA rms and V = 1 V . Second, various CMOS-MEMS magnetometers have been designed using the BEOL part of the TSMC and SMIC 180 nm standard CMOS processes, and wet and vapor etched. The devices measurement and characterisation is used to analyse the benefits and drawbacks of each design as well as releasing process. Doing so, a high volume manufacturing viability can be performed. Yield values as high as 86% have been obtained for one device manufactured in a SMIC 180 nm full wafer run, having a sensitivity of 2.82 fA/µT · mA and quality factor Q = 7.29 at ambient pressure. While a device manufactured in TSMC 180 nm has Q = 634.5 and a sensitivity of 20.26 fA/µT ·mA at 1 mbar and V = 1 V. Finally, an integrated circuit has been designed that contains all the critical blocks to perform the MEMS signal readout. The MEMS and the electronics have been manufactured using the same die area and standard TSMC 180 nm process in order to reduce parasitics and improve noise and current consumption. Simulations show that a resolution of 8.23 µT /mA for V = 1 V and BW = 10 Hz can be achieved with the designed device.En les últimes dècades, tenint en compte els primers telèfons mòbils dels anys 90, les capacitats de sensat dels telèfons intel·ligents han millorat notablement. A més, la indústria automobilística i de wearables necessiten cada cop més sofisticació en el sensat. Els Micro Electro Mechanical Systems (MEMS) han tingut un paper molt important en aquest avenç tecnològic, ja que acceleròmetres i giroscopis varen ser els primers sensors basats en la tecnologia MEMS en ser introduïts massivament al mercat. En canvi, encara no existeix en la indústria una brúixola electrònica basada en la tecnologia MEMS, tot i que els magnetòmetres MEMS varen ser proposats per primera vegada a finals dels anys 90. Actualment, els magnetòmetres MEMS basats en la força de Lorentz són el centre d'atenció donat que poden oferir una solució integrada a les capacitats de sensat actuals. Com a conseqüència, s'han aconseguit grans avenços encara que existeixen diversos colls d'ampolla que encara limiten la introducció al mercat de brúixoles electròniques MEMS basades en la força de Lorentz. Per una banda, els agnetòmetres MEMS actuals necessiten un consum de corrent i un voltatge de polarització elevats per aconseguir una bona sensibilitat. A més, tot i que a la literatura hi podem trobar dispositius amb rendiments i sofisticació excel·lents, encara existeix una manca de recerca en el circuit de condicionament, especialment de processat digital i control del llaç. Per altra banda, moltes publicacions depenen de processos de fabricació de MEMS fets a mida per fabricar els dispositius. Aquesta és la mateixa aproximació que s'utilitza actualment en la indústria dels MEMS, però té l'inconvenient que requereix processos de fabricació diferents pels MEMS i l’electrònica. Per tant, el cost de fabricació és alt i el rendiment del sensor queda afectat pels paràsits en la interfície entre els MEMS i l'electrònica. Aquesta tesi presenta solucions potencials a aquests problemes amb l'objectiu d'aplanar el camí a la comercialització de brúixoles electròniques MEMS basades en la força de Lorentz. En primer lloc, es proposa un circuit de condicionament complet en llaç tancat controlat digitalment. Aquest s'ha implementat amb components comercials, mentre que el control digital del llaç s'ha implementat en una FPGA, tot com una prova de concepte de la viabilitat i beneficis potencials que representa l'arquitectura proposada. El sistema presenta un soroll de 550 nT / vHz quan el MEMS està polaritzat amb 300 µArms i V = 1 V . En segon lloc, s'han dissenyat varis magnetòmetres CMOS-MEMS utilitzant la part BEOL dels processos CMOS estàndard de TSMC i SMIC 180 nm, que després s'han alliberat amb líquid i gas. La mesura i caracterització dels dispositius s’ha utilitzat per analitzar els beneficis i inconvenients de cada disseny i procés d’alliberament. D'aquesta manera, s'ha pogut realitzar un anàlisi de la viabilitat de la seva fabricació en massa. S'han obtingut valors de yield de fins al 86% per un dispositiu fabricat amb SMIC 180 nm en una oblia completa, amb una sensibilitat de 2.82 fA/µT · mA i un factor de qualitat Q = 7.29 a pressió ambient. Per altra banda, el dispositiu fabricat amb TSMC 180 nm presenta una Q = 634.5 i una sensibilitat de 20.26 fA/µT · mA a 1 mbar amb V = 1 V. Finalment, s'ha dissenyat un circuit integrat que conté tots els blocs per a realitzar el condicionament de senyal del MEMS. El MEMS i l'electrònica s'han fabricat en el mateix dau amb el procés estàndard de TSMC 180 nm per tal de reduir paràsits i millorar el soroll i el consum de corrent. Les simulacions mostren una resolució de 8.23 µT /mA amb V = 1 V i BW = 10 Hz pel dispositiu dissenyat

Bridges Structural Health Monitoring and Deterioration Detection Synthesis of Knowledge and Technology

INE/AUTC 10.0

Remotely interrogated MEMS pressure sensor

This thesis considers the design and implementation of passive wireless microwave readable pressure sensors on a single chip. Two novel-all passive devices are considered for wireless pressure operation. The first device consists of a tuned circuit operating at 10 GHz fabricated on SiO2 membrane, supported on a silicon wafer. A pressure difference across the membrane causes it to deflect so that a passive resonant circuit detunes. The circuit is remotely interrogated to read off the sensor data. The chip area is 20 mm2 and the membrane area is 2mm2 with thickness of 4 µm. Two on chip passive resonant circuits were investigated: a meandered dipole and a zigzag antenna. Both have a physical length of 4.25 mm. the sensors show a shift in their resonant frequency in response to changing pressure of 10.28-10.27 GHz for the meandered dipole, and 9.61-9.58 GHz for the zigzag antenna. The sensitivities of the meandered dipole and zigzag sensors are 12.5 kHz and 16 kHz mbar, respectively. The second device is a pressure sensor on CMOS chip. The sensing element is capacitor array covering an area of 2 mm2 on a membrane. This sensor is coupled with a dipole antenna operating at 8.77 GHz. The post processing of the CMOS chip is carried out only in three steps, and the sensor on its own shows a sensitivity of 0.47fF/mbar and wireless sensitivity of 27 kHz/mbar. The MIM capacitors on membrane can be used to detune the resonant frequency of an antenna