Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi.Postprint (published version

Graphics Processing Unit-Based Computer-Aided Design Algorithms for Electronic Design Automation

The electronic design automation (EDA) tools are a specific set of software that play important roles in modern integrated circuit (IC) design. These software automate the design processes of IC with various stages. Among these stages, two important EDA design tools are the focus of this research: floorplanning and global routing. Specifically, the goal of this study is to parallelize these two tools such that their execution time can be significantly shortened on modern multi-core and graphics processing unit (GPU) architectures. The GPU hardware is a massively parallel architecture, enabling thousands of independent threads to execute concurrently. Although a small set of EDA tools can benefit from using GPU to accelerate their speed, most algorithms in this field are designed with the single-core paradigm in mind. The floorplanning and global routing algorithms are among the latter, and difficult to render any speedup on the GPU due to their inherent sequential nature. This work parallelizes the floorplanning and global routing algorithm through a novel approach and results in significant speedups for both tools implemented on the GPU hardware. Specifically, with a complete overhaul of solution space and design space exploration, a GPU-based floorplanning algorithm is able to render 4-166X speedup, while achieving similar or improved solutions compared with the sequential algorithm. The GPU-based global routing algorithm is shown to achieve significant speedup against existing state-of-the-art routers, while delivering competitive solution quality. Importantly, this parallel model for global routing renders a stable solution that is independent from the level of parallelism. In summary, this research has shown that through a design paradigm overhaul, sequential algorithms can also benefit from the massively parallel architecture. The findings of this study have a positive impact on the efficiency and design quality of modern EDA design flow

Course grained low power design flow using UPF

Increased system complexity has led to the substitution of the traditional bottom-up design flow by systematic hierarchical design flow. The main motivation behind the evolution of such an approach is the increasing difficulty in hardware realization of complex systems. With decreasing channel lengths, few key problems such as timing closure, design sign-off, routing complexity, signal integrity, and power dissipation arise in the design flows. Specifically, minimizing power dissipation is critical in several high-end processors. In high-end processors, the design complexity contributes to the overall dynamic power while the decreasing transistor size results in static power dissipation. This research aims at optimizing the design flow for power and timing using the unified power format (UPF). UPF provides a strategic format to specify power-aware design information at every stage in the flow. The low power reduction techniques enforced in this research are multi-voltage, multi-threshold voltage (Vth), and power gating with state retention. An inherent design challenge addressed in this research is the choice of power optimization techniques as the flow advances from synthesis to physical design. A top-down digital design flow for a 32 bit MIPS RISC processor has been implemented with and without UPF synthesis flow for 65nm technology. The UPF synthesis is implemented with two voltages, 1.08V and 0.864V (Multi-VDD). Area, power and timing metrics are analyzed for the flows developed. Power savings of about 20 % are achieved in the design flow with \u27multi-threshold\u27 power technique compared to that of the design flow with no low power techniques employed. Similarly, 30 % power savings are achieved in the design flow with the UPF implemented when compared to that of the design flow with \u27multi-threshold\u27 power technique employed. Thus, a cumulative power savings of 42% has been achieved in a complete power efficient design flow (UPF) compared to that of the generic top-down standard flow with no power saving techniques employed. This is substantiated by the low voltage operation of modules in the design, reduction in clock switching power by gating clocks in the design and extensive use of HVT and LVT standard cells for implementation. The UPF synthesis flow saw the worst timing slack and more area when compared to those of the `multi-threshold\u27 or the generic flow. Percentage increase in the area with UPF is approximately 15%; a significant source for this increase being the additional power controlling logic added

Using Physical Compilation to Implement a System on Chip Platform

The goal of this thesis was to setup a complete design flow involving physical synthesis. The design chosen for this purpose was a system-on-chip (SoC) platform developed at the University of Tennessee. It involves a Leon Processor with a minimal cache configuration, an AMBA on-chip bus and an Advanced Encryption Standard module which performs decryption. As transistor size has entered the deep submicron level, iterations involved in the design cycle have increased due to the domination of interconnect delays over cell delays. Traditionally, interconnect delay has been estimated through the use of wire-load models. However, since there is no physical placement information, the delay estimation may be ineffective and result in increased iterations. Hence, placement-based synthesis has recently been introduced to provide better interconnect delay estimation. The tool used in this thesis to implement the system-on-chip design using physical synthesis is Synopsys Physical Compiler. The flow has been setup through the use of the Galaxy Reference Flow scripts obtained from Synopsys. As part of the thesis, an analysis of the differences between a physically synthesized design and a logically synthesized one in terms of area and delay is presented

A Modular Approach to Adaptive Reactive Streaming Systems

The latest generations of FPGA devices offer large resource counts that provide the headroom to implement large-scale and complex systems. However, there are increasing challenges for the designer, not just because of pure size and complexity, but also in harnessing effectively the flexibility and programmability of the FPGA. A central issue is the need to integrate modules from diverse sources to promote modular design and reuse. Further, the capability to perform dynamic partial reconfiguration (DPR) of FPGA devices means that implemented systems can be made reconfigurable, allowing components to be changed during operation. However, use of DPR typically requires low-level planning of the system implementation, adding to the design challenge. This dissertation presents ReShape: a high-level approach for designing systems by interconnecting modules, which gives a ‘plug and play’ look and feel to the designer, is supported by tools that carry out implementation and verification functions, and is carried through to support system reconfiguration during operation. The emphasis is on the inter-module connections and abstracting the communication patterns that are typical between modules – for example, the streaming of data that is common in many FPGA-based systems, or the reading and writing of data to and from memory modules. ShapeUp is also presented as the static precursor to ReShape. In both, the details of wiring and signaling are hidden from view, via metadata associated with individual modules. ReShape allows system reconfiguration at the module level, by supporting type checking of replacement modules and by managing the overall system implementation, via metadata associated with its FPGA floorplan. The methodology and tools have been implemented in a prototype for a broad domain-specific setting – networking systems – and have been validated on real telecommunications design projects

Efficient approaches in interconnect-driven floorplanning.

Lai Tsz Wai.Thesis (M.Phil.)--Chinese University of Hong Kong, 2003.Includes bibliographical references (leaves 123-129).Abstracts in English and Chinese.Chapter 1 --- Introduction --- p.1Chapter 1.1 --- VLSI Design Cycle --- p.2Chapter 1.2 --- Physical Design Cycle --- p.4Chapter 1.3 --- Floorplanning --- p.7Chapter 1.3.1 --- Types of Floorplan and Floorplan Representations --- p.11Chapter 1.3.2 --- Interconnect-driven Floorplanning --- p.13Chapter 1.4 --- Motivations and Contributions --- p.17Chapter 1.5 --- Organization of this Thesis --- p.18Chapter 2 --- Literature Review on Floorplan Representation --- p.20Chapter 2.1 --- Slicing Floorplan Representation --- p.20Chapter 2.1.1 --- Normalized Polish Expression --- p.20Chapter 2.2 --- Non-slicing Floorplan Representations --- p.21Chapter 2.2.1 --- Sequence Pair (SP) --- p.21Chapter 2.2.2 --- Bounded-sliceline Grid (BSG) --- p.23Chapter 2.2.3 --- O-tree --- p.25Chapter 2.2.4 --- B*-tree --- p.26Chapter 2.3 --- Mosaic Floorplan Representations --- p.28Chapter 2.3.1 --- Corner Block List (CBL) --- p.28Chapter 2.3.2 --- Twin Binary Trees (TBT) --- p.31Chapter 2.3.3 --- Twin Binary Sequences (TBS) --- p.32Chapter 2.4 --- Summary --- p.34Chapter 3 --- Literature Review on Interconnect Optimization in Floorplan- ning --- p.37Chapter 3.1 --- Wirelength Estimation --- p.37Chapter 3.2 --- Congestion Optimization --- p.38Chapter 3.2.1 --- Integrated Floorplanning and Interconnect Planning --- p.41Chapter 3.2.2 --- Multi-layer Global Wiring Planning (GWP) --- p.43Chapter 3.2.3 --- Estimating Routing Congestion using Probabilistic Anal- ysis --- p.44Chapter 3.2.4 --- Congestion Minimization During Placement --- p.46Chapter 3.2.5 --- Modelling and Minimization of Routing Congestion --- p.48Chapter 3.3 --- Buffer Planning --- p.49Chapter 3.3.1 --- Buffer Clustering with Feasible Region --- p.51Chapter 3.3.2 --- Routability-driven Repeater Clustering Algorithm with Iterative Deletion --- p.55Chapter 3.3.3 --- Planning Buffer Locations by Network Flow --- p.58Chapter 3.3.4 --- Buffer Planning using Integer Multicommodity Flow --- p.60Chapter 3.3.5 --- Buffer Planning Problem using Tile Graph --- p.60Chapter 3.3.6 --- Probabilistic Analysis for Buffer Block Planning --- p.62Chapter 3.3.7 --- Fast Buffer Planning and Congestion Optimization --- p.63Chapter 3.4 --- Summary --- p.66Chapter 4 --- Congestion Evaluation: Wire Density Model --- p.68Chapter 4.1 --- Introduction --- p.68Chapter 4.2 --- Overview of Our Floorplanner --- p.70Chapter 4.3 --- Wire Density Model --- p.71Chapter 4.3.1 --- Computation of Ni --- p.72Chapter 4.3.2 --- Computation of Pi --- p.74Chapter 4.3.3 --- Usage of Mirror TBT --- p.76Chapter 4.4 --- Implementation --- p.76Chapter 4.4.1 --- Efficient Calculation of Ni --- p.76Chapter 4.4.2 --- Solving the LCA Problem Efficiently --- p.81Chapter 4.4.3 --- Cost Function --- p.81Chapter 4.4.4 --- Complexity --- p.81Chapter 4.5 --- Experimental Results --- p.82Chapter 4.6 --- Conclusion --- p.83Chapter 5 --- Buffer Planning: Simple Buffer Planning Method --- p.85Chapter 5.1 --- Introduction --- p.85Chapter 5.2 --- Variable Interval Buffer Insertion Constraint --- p.87Chapter 5.3 --- Overview of Our Floorplanner --- p.88Chapter 5.4 --- Buffer Planning --- p.89Chapter 5.4.1 --- Feasible Grids --- p.89Chapter 5.4.2 --- Table Look-up Approach --- p.89Chapter 5.5 --- Implementation --- p.91Chapter 5.5.1 --- Building the Look-up Tables --- p.91Chapter 5.5.2 --- An Example of Look-up Table Construction --- p.94Chapter 5.5.3 --- A Faster Approach for Building the Look-up Tables --- p.101Chapter 5.5.4 --- An Example of the Faster Look-up Table Construction --- p.105Chapter 5.5.5 --- I/O Pin Locations --- p.106Chapter 5.5.6 --- Cost Function --- p.110Chapter 5.5.7 --- Complexity --- p.111Chapter 5.6 --- Experimental Results --- p.112Chapter 5.6.1 --- Selected Value for A --- p.112Chapter 5.6.2 --- Performance of Our Floorplanner --- p.113Chapter 5.7 --- Conclusion --- p.116Chapter 6 --- Conclusion --- p.118Chapter A --- An Efficient Algorithm for the Least Common Ancestor Prob- lem --- p.120Bibliography --- p.12