Investigation of Gallium Nitride Transistor Reliability through Accelerated Life Testing and Modeling

Gallium nitride high electron mobility transistors are attractive to the DoD for their ability to operate at high frequencies, voltages, temperatures, and power. Yet, there are concerns about the reliability of these devices. Various degradation mechanisms and their causes are proposed in the literature. A variety of reliability tests were conducted to understand these mechanisms and causes. A multi-stressor experiment revealed different failure mechanisms than are in the literature. In particular, the devices tested at high voltage in the OFF state did not degrade significantly as suggested by others\u27 reports. The validity of temperature-accelerated life testing when applied to GaN HEMT lifetime assessments is questioned. Temperature alone could not explain the differences in observed degradation. The tested devices showed excellent robustness to high forward gate stress, exhibiting only a slight change in gate diode characteristic, little decrease in maximum drain current, and a persisting breakdown voltage exceeding 200 V. The time-dependence of degradation was analyzed, and results of continuous- and pulsed-direct current stressing were compared

Temperature Dependent Analytical Modeling, Simulation and Characterizations of HEMTs in Gallium Nitride Process

Research is being conducted for a high-performance building block for high frequency and high temperature applications that combine lower costs with improved performance and manufacturability. Researchers have focused their attention on new semiconductor materials for use in device technology to address system improvements. Of the contenders, silicon carbide (SiC), gallium nitride (GaN), and diamond are emerging as the front-runners. GaN-based electronic devices, AlGaN/GaN heterojunction field effect transistors (HFETs), are the leading candidates for achieving ultra-high frequency and high-power amplifiers. Recent advances in device and amplifier performance support this claim. GaN is comparable to the other prominent material options for high-performance devices. The dissertation presents the work on analytical modeling and simulation of GaN high power HEMT and MOS gate HEMT, model verification with test data and device characterization at elevated temperatures. The model takes into account the carrier mobility, the doping densities, the saturation velocity, and the thickness of different layers. Considering the GaN material processing limitations and feedback from the simulation results, an application specific AlGaN/GaN RF power HEMT structure has been proposed. The doping concentrations and the thickness of various layers are selected to provide adequate channel charge density for the proposed devices. A good agreement between the analytical model, and the experimental data is demonstrated. The proposed temperature model can operate at higher voltages and shows stable operation of the devices at higher temperatures. The investigated temperature range is from 1000K to 6000K. The temperature models include the effect of temperature variation on the threshold voltage, carrier mobility, bandgap and saturation velocity. The calculated values of the critical parameters suggest that the proposed device can operate in the GHz range for temperature up to 6000K, which indicates that the device could survive in extreme environments. The models developed in this research will not only help the wide bandgap device researchers in the device behavioral study but will also provide valuable information for circuit designers

Characterization of Charge Trapping Phenomena in GaN-based HEMTs

This dissertation reports on charge-trapping phenomena and related parasitic effects in AlGaN/GaN high electron mobility transistors. By means of static and pulsed I-V measurements and deep-level transient spectroscopy, the main charge-trapping mechanisms affecting the dynamic performance of GaN-based HEMTs devoted to microwave and power switching applications have been comprehensively characterized, identifying the nature and the localization of the deep-levels responsible for the electrically active trap-states. A high-voltage measurement system capable for double-pulsed ID-VD, ID-VG and drain-current transient spectroscopy has been successfully designed and implemented. A characterization methodology, including the analysis of static I-V measurements, pulsed I-V measurements, and deep-level transient spectroscopy, has been developed to investigate the impact of voltage, current, and temperature on the parasitic effects of charge-trapping (threshold voltage instabilities, dynamic on-resistance increase, and transconductance reduction), and on trapping/detrapping kinetics. Experimental results gathered on transistor structures are supported by complementary capacitance deep-level transient spectroscopy (C-DLTS) performed on 2-terminal diode (FATFET) structures. Two main case-studies have been investigated. Schottky-gated AlGaN/GaN HEMTs grown on silicon carbide substrate employing iron and/or carbon doped buffers devoted to microwave applications, and MIS-gated double-heterostructure AlGaN/GaN/AlGaN HEMTs grown on silicon substrate devoted to power switching applications. The devices under test have been exposed to the complete set of current-voltage regimes experienced during the real life operations, including off-state, semi-on-state, and on-state. The main novel results are reported in the following: • Identification of a charge-trapping mechanism promoted by hot-electrons. This mechanism is critical in semi-on-state, with the combination of relatively high electric-field and relatively high drain-source current. • Identification of a positive temperature-dependent charge-trapping mechanism localized in the buffer-layer, potentially promoted by the vertical drain to substrate potential. This mechanism is critical in high drain-voltage off-state bias in high temperature operations. • Identification of deep-levels and charge-trapping related to the presence of doping compensation agents (iron and carbon) within the GaN buffer layer. • Identification of charge-trapping mechanism ascribed to the SiNX and/or Al2O3 insulating layers of MIS-gated HEMTs. This mechanism is promoted in the on-state with positive gate-voltage and positive gate leakage current. • Identification of a potential charge-trapping mechanism ascribed to reverse gate leakage current in Schottky-gate HEMTs exposed to high-voltage off-state. • The characterization of surface-traps in ungated and unpassivated devices by means of drain-current transient spectroscopy reveals a non-exponential and weakly thermally-activated detrapping behaviour. • Preliminary synthesis of a degradation mechanism characterized by the generation of defect-states, the worsening of parasitic charge-trapping effects, and the degradation of rf performance of AlGaN/GaN HEMTs devoted to microwave operations. The evidence of this degradation mechanism is appreciable only by means of rf or pulsed I-V measurements: no apparent degradation is found by means of DC analysis

Channel Temperature Determination for AlGaN/GaN HEMTs on SiC and Sapphire

Numerical simulation results (with emphasis on channel temperature) for a single gate AlGaN/GaN High Electron Mobility Transistor (HEMT) with either a sapphire or SiC substrate are presented. The static I-V characteristics, with concomitant channel temperatures (T(sub ch)) are calculated using the software package ATLAS, from Silvaco, Inc. An in-depth study of analytical (and previous numerical) methods for the determination of T(sub ch) in both single and multiple gate devices is also included. We develop a method for calculating T(sub ch) for the single gate device with the temperature dependence of the thermal conductivity of all material layers included. We also present a new method for determining the temperature on each gate in a multi-gate array. These models are compared with experimental results, and show good agreement. We demonstrate that one may obtain the channel temperature within an accuracy of +/-10 C in some cases. Comparisons between different approaches are given to show the limits, sensitivities, and needed approximations, for reasonable agreement with measurements

Trapping and Reliability Investigations in GaN-based HEMTs

GaN-based high electron mobility transistors (HEMTs) are promising candidates for future microwave equipment, such as new solid state power amplifiers (SSPAs), thanks to their excellent performance. A first demonstration of GaN-MMIC transmitter has been developed and put on board the PROBA-V mission. But this technology still suffers from the trapping phenomena, principally due to lattice defects. Thus, the aim of this research is to investigate the trapping effects and the reliability aspects of the GH50 power transistors for C-band applications. A new trap investigation protocol to obtain a complete overview of trap behavior from DC to radio-frequency operation modes, based on combined pulsed I/V measurements, DC and RF drain current measurements, and low-frequency dispersion measurements, is proposed. Furthermore, a nonlinear electro-thermal AlGaN/GaN model with a new additive thermal-trap model including the dynamic behavior of these trap states and their associated temperature variations is presented, in order to correctly predict the RF performance during real RF operating conditions. Finally, an advanced time-domain methodology is presented in order to investigate the device’s reliability and to determine its safe operating area. This methodology is based on the continual monitoring of the RF waveforms and DC parameters under overdrive conditions in order to assess the degradation of the transistor characteristics in the RF power amplifier

GaN-based power devices: Physics, reliability, and perspectives

Over the last decade, gallium nitride (GaN) has emerged as an excellent material for the fabrication of power devices. Among the semicon- ductors for which power devices are already available in the market, GaN has the widest energy gap, the largest critical field, and the highest saturation velocity, thus representing an excellent material for the fabrication of high-speed/high-voltage components. The presence of spon- taneous and piezoelectric polarization allows us to create a two-dimensional electron gas, with high mobility and large channel density, in the absence of any doping, thanks to the use of AlGaN/GaN heterostructures. This contributes to minimize resistive losses; at the same time, for GaN transistors, switching losses are very low, thanks to the small parasitic capacitances and switching charges. Device scaling and monolithic integration enable a high-frequency operation, with consequent advantages in terms of miniaturization. For high power/high- voltage operation, vertical device architectures are being proposed and investigated, and three-dimensional structures—fin-shaped, trench- structured, nanowire-based—are demonstrating great potential. Contrary to Si, GaN is a relatively young material: trapping and degradation processes must be understood and described in detail, with the aim of optimizing device stability and reliability. This Tutorial describes the physics, technology, and reliability of GaN-based power devices: in the first part of the article, starting from a discussion of the main proper- ties of the material, the characteristics of lateral and vertical GaN transistors are discussed in detail to provide guidance in this complex and interesting field. The second part of the paper focuses on trapping and reliability aspects: the physical origin of traps in GaN and the main degradation mechanisms are discussed in detail. The wide set of referenced papers and the insight into the most relevant aspects gives the reader a comprehensive overview on the present and next-generation GaN electronics

On-line Condition Monitoring, Fault Detection and Diagnosis in Electrical Machines and Power Electronic Converters

The objective of this PhD research is to develop robust, and non-intrusive condition monitoring methods for induction motors fed by closed-loop inverters. The flexible energy forms synthesized by these connected power electronic converters greatly enhance the performance and expand the operating region of induction motors. They also significantly alter the fault behavior of these electric machines and complicate the fault detection and protection. The current state of the art in condition monitoring of power-converter-fed electric machines is underdeveloped as compared to the maturing condition monitoring techniques for grid-connected electric machines. This dissertation first investigates the stator turn-to-turn fault modelling for induction motors (IM) fed by a grid directly. A novel and more meaningful model of the motor itself was developed and a comprehensive study of the closed-loop inverter drives was conducted. A direct torque control (DTC) method was selected for controlling IM’s electromagnetic torque and stator flux-linkage amplitude in industrial applications. Additionally, a new driver based on DTC rules, predictive control theory and fuzzy logic inference system for the IM was developed. This novel controller improves the performance of the torque control on the IM as it reduces most of the disadvantages of the classical and predictive DTC drivers. An analytical investigation of the impacts of the stator inter-turn short-circuit of the machine in the controller and its reaction was performed. This research sets a based knowledge and clear foundations of the events happening inside the IM and internally in the DTC when the machine is damaged by a turn fault in the stator. This dissertation also develops a technique for the health monitoring of the induction machine under stator turn failure. The developed technique was based on the monitoring of the off-diagonal term of the sequence component impedance matrix. Its advantages are that it is independent of the IM parameters, it is immune to the sensors’ errors, it requires a small learning stage, compared with NN, and it is not intrusive, robust and online. The research developed in this dissertation represents a significant advance that can be utilized in fault detection and condition monitoring in industrial applications, transportation electrification as well as the utilization of renewable energy microgrids. To conclude, this PhD research focuses on the development of condition monitoring techniques, modelling, and insightful analyses of a specific type of electric machine system. The fundamental ideas behind the proposed condition monitoring technique, model and analysis are quite universal and appeals to a much wider variety of electric machines connected to power electronic converters or drivers. To sum up, this PhD research has a broad beneficial impact on a wide spectrum of power-converter-fed electric machines and is thus of practical importance

Study of High-k Dielectrics and their Interfaces on Semiconductors for Device Applications

This thesis has focused on two emerging applications of high-k dielectrics in Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) and in Metal-InsulatorSemiconductor High Electron Mobility Transistors (MIS-HEMTs). The key aim has been to propose the best routes for passivation of semiconductor/high-k oxide interfaces by investigating the band alignments and interface properties of several oxides, such as Tm2O3, Ta2O5, ZrO2, Al2O3 and MgO, deposited on different semiconductors: Si, Ge, GaN, InGaAs and InGaSb. The electrical characterisation of fabricated MIS capacitor and (MIS)-HEMT devices have also been performed. Thulium silicate (TmSiO) has been identified as a promising candidate for integration as interfacial layer (IL) in HfO2/TiN MOSFETs. The physical properties of Tm2O3/IL/Si interface have been elucidated, where IL (TmSiO) has been formed using different post-deposition annealing (PDA) temperatures, from 550 to 750 °C. It has been found that the best-scaled stack (sub-nm IL) is formed at 550 °C PDA with a graded interface layer and a strong SiOx (Si 3+) component. A large valence band offset (VBO) of 2.8 eV and a large conduction band offset (CBO) of 1.9 eV have been derived for Tm2O3/Si by X-ray photoelectron spectroscopy (XPS) and variable angle spectroscopic ellipsometry. Further increase of device performance can be achieved by replacing Si with GaN for high frequency, high power and high-temperature operation. In this thesis, several GaN cleaning procedures have been considered: 30% NH4OH, 20% (NH4)2S, and 37% HCl. It has been found that the HCl treatment shows the lowest oxygen contamination and Garich surface, and hence has been used prior sputtering of Ta2O5, Al2O3, ZrO2 and MgO on GaN. The large VBOs of 1.1 eV and 1.2 eV have been derived for Al2O3 and MgO on GaN respectively, using XPS and Kraut’s method; the corresponding CBOs are 2.0 eV and 2.8 eV respectively, taking into account the band gaps of Al2O3 (6.5 eV) and MgO (7.4 eV) determined from XPS O 1s electron energy spectra. The lowest leakage currents were obtained for devices with Al2O3 and MgO, i.e. 5.3 ×10-6 A/cm2 and 3.2 ×10-6 A/cm2 at 1 V, respectively in agreement with high band offsets (> 1 eV). Furthermore, the effect of different surface treatments (HCl, O2 plasma and 1-Octadecanethiol (ODT)) prior to atomic layer deposition of Al2O3 on the GaN/AlGaN/GaN heterostructure has been investigated. The MIS-HEMTs fabricated using the low-cost ODT GaN surface treatment have been found to exhibit superior performance for power switching applications such as a low threshold voltage, VT of -12.3 V, hysteresis of 0.12 V, a small subthreshold voltage slope (SS) of 73 mV/dec, and a low density of interface states, Dit of 3.0 x10^12 cm-2eV-1. A comprehensive novel study of HfO2/InGaAs and Al2O3/InGaSb interfaces have also been conducted for use in III-V based MOSFETs. The addition of the plasma H2/TMA/H2 pre-cleaning has been found to be very effective in recovering etch damage on InGaAs, especially for (110) orientation, and led to the improvement of electrical characteristics. Furthermore, the combination of H2 plasma exposure and forming gas anneal yielded significantly improved metrics for Al2O3/InGaSb over the control HCltreated sample, with the 150 W plasma treatment giving both the highest capacitance and the lowest stretch out