Stochastic macromodeling of nonlinear systems via polynomial chaos expansion and transfer function trajectories

A novel approach is presented to perform stochastic variability analysis of nonlinear systems. The versatility of the method makes it suitable for the analysis of complex nonlinear electronic systems. The proposed technique is a variation-aware extension of the Transfer Function Trajectory method by means of the Polynomial Chaos expansion. The accuracy with respect to the classical Monte Carlo analysis is verified by means of a relevant numerical example showing a simulation speedup of 1777 X

A fast and retargetable framework for logic-IP-internal electromigration assessment comprehending advanced waveform effects

A new methodology for system-on-chip-level logic-IP-internal electromigration verification is presented in this paper, which significantly improves accuracy by comprehending the impact of the parasitic RC loading and voltage-dependent pin capacitance in the library model. It additionally provides an on-the-fly retargeting capability for reliability constraints by allowing arbitrary specifications of lifetimes, temperatures, voltages, and failure rates, as well as interoperability of the IPs across foundries. The characterization part of the methodology is expedited through the intelligent IP-response modeling. The ultimate benefit of the proposed approach is demonstrated on a 28-nm design by providing an on-the-fly specification of retargeted reliability constraints. The results show a high correlation with SPICE and were obtained with an order of magnitude reduction in the verification runtime.Peer ReviewedPostprint (author's final draft

Autonomous Volterra algorithm for steady-state analysis of nonlinear circuits

published_or_final_versio

Algorithms and methodologies for interconnect reliability analysis of integrated circuits

The phenomenal progress of computing devices has been largely made possible by the sustained efforts of semiconductor industry in innovating techniques for extremely large-scale integration. Indeed, gigantically integrated circuits today contain multi-billion interconnects which enable the transistors to talk to each other -all in a space of few mm2. Such aggressively downscaled components (transistors and interconnects) silently suffer from increasing electric fields and impurities/defects during manufacturing. Compounded by the Gigahertz switching, the challenges of reliability and design integrity remains very much alive for chip designers, with Electro migration (EM) being the foremost interconnect reliability challenge. Traditionally, EM containment revolves around EM guidelines, generated at single-component level, whose non-compliance means that the component fails. Failure usually refers to deformation due to EM -manifested in form of resistance increase, which is unacceptable from circuit performance point of view. Subsequent aspects deal with correct-by-construct design of the chip followed by the signoff-verification of EM reliability. Interestingly, chip designs today have reached a dilemma point of reduced margin between the actual and reliably allowed current densities, versus, comparatively scarce system-failures. Consequently, this research is focused on improved algorithms and methodologies for interconnect reliability analysis enabling accurate and design-specific interpretation of EM events. In the first part, we present a new methodology for logic-IP (cell) internal EM verification: an inadequately attended area in the literature. Our SPICE-correlated model helps in evaluating the cell lifetime under any arbitrary reliability speciation, without generating additional data - unlike the traditional approaches. The model is apt for today's fab less eco-system, where there is a) increasing reuse of standard cells optimized for one market condition to another (e.g., wireless to automotive), as well as b) increasing 3rd party content on the chip requiring a rigorous sign-off. We present results from a 28nm production setup, demonstrating significant violations relaxation and flexibility to allow runtime level reliability retargeting. Subsequently, we focus on an important aspect of connecting the individual component-level failures to that of the system failure. We note that existing EM methodologies are based on serial reliability assumption, which deems the entire system to fail as soon as the first component in the system fails. With a highly redundant circuit topology, that of a clock grid, in perspective, we present algorithms for EM assessment, which allow us to incorporate and quantify the benefit from system redundancies. With the skew metric of clock-grid as a failure criterion, we demonstrate that unless such incorporations are done, chip lifetimes are underestimated by over 2x. This component-to-system reliability bridge is further extended through an extreme order statistics based approach, wherein, we demonstrate that system failures can be approximated by an asymptotic kth-component failure model, otherwise requiring costly Monte Carlo simulations. Using such approach, we can efficiently predict a system-criterion based time to failure within existing EDA frameworks. The last part of the research is related to incorporating the impact of global/local process variation on current densities as well as fundamental physical factors on EM. Through Hermite polynomial chaos based approach, we arrive at novel variations-aware current density models, which demonstrate significant margins (> 30 %) in EM lifetime when compared with the traditional worst case approach. The above research problems have been motivated by the decade-long work experience of the author dealing with reliability issues in industrial SoCs, first at Texas Instruments and later at Qualcomm.L'espectacular progrés dels dispositius de càlcul ha estat possible en gran part als esforços de la indústria dels semiconductors en proposar tècniques innovadores per circuits d'una alta escala d'integració. Els circuits integrats contenen milers de milions d'interconnexions que permeten connectar transistors dins d'un espai de pocs mm2. Tots aquests components estan afectats per camps elèctrics, impureses i defectes durant la seva fabricació. Degut a l’activitat a nivell de Gigahertzs, la fiabilitat i integritat són reptes importants pels dissenyadors de xips, on la Electromigració (EM) és un dels problemes més importants. Tradicionalment, el control de la EM ha girat entorn a directrius a nivell de component. L'incompliment d’alguna de les directrius implica un alt risc de falla. Per falla s'entén la degradació deguda a la EM, que es manifesta en forma d'augment de la resistència, la qual cosa és inacceptable des del punt de vista del rendiment del circuit. Altres aspectes tenen a veure amb la correcta construcció del xip i la verificació de fiabilitat abans d’enviar el xip a fabricar. Avui en dia, el disseny s’enfronta a dilemes importants a l’hora de definir els marges de fiabilitat dels xips. És un compromís entre eficiència i fiabilitat. La recerca en aquesta tesi se centra en la proposta d’algorismes i metodologies per a l'anàlisi de la fiabilitat d'interconnexió que permeten una interpretació precisa i específica d'esdeveniments d'EM. A la primera part de la tesi es presenta una nova metodologia pel disseny correcte-per-construcció i verificació d’EM a l’interior de les cel·les lògiques. Es presenta un model SPICE correlat que ajuda a avaluar el temps de vida de les cel·les segons qualsevol especificació arbitrària de fiabilitat i sense generar cap dada addicional, al contrari del que fan altres tècniques. El model és apte per l'ecosistema d'empreses de disseny quan hi ha a) una reutilització creixent de cel·les estàndard optimitzades per unes condicions de mercat i utilitzades en un altre (p.ex. de wireless a automoció), o b) la utilització de components del xip provinents de terceres parts i que necessiten una verificació rigorosa. Es presenten resultats en una tecnologia de 28nm, demostrant relaxacions significatives de les regles de fiabilitat i flexibilitat per permetre la reavaluació de la fiabilitat en temps d'execució. A continuació, el treball tracta un aspecte important sobre la relació entre les falles dels components i les falles del sistema. S'observa que les tècniques existents es basen en la suposició de fiabilitat en sèrie, que porta el sistema a fallar tant aviat hi ha un component que falla. Pensant en topologies redundants, com la de les graelles de rellotge, es proposen algorismes per l'anàlisi d'EM que permeten quantificar els beneficis de la redundància en el sistema. Utilitzant com a mètrica l’esbiaixi del senyal de rellotge, es demostra que la vida dels xips pot arribar a ser infravalorada per un factor de 2x. Aquest pont de fiabilitat entre component i sistema es perfecciona a través d'una tècnica basada en estadístics d'ordre extrem on es demostra que les falles poden ser aproximades amb un model asimptòtic de fallada de l'ièssim component, evitant així simulacions de Monte Carlo costoses. Amb aquesta tècnica, es pot predir eficientment el temps de fallada a nivell de sistema utilitzant eines industrials. La darrera part de la recerca està relacionada amb avaluar l'impacte de les variacions de procés en les densitats de corrent i factors físics de la EM. Mitjançant una tècnica basada en polinomis d'Hermite s'han obtingut uns nous models de densitat de corrent que mostren millores importants (>30%) en l'estimació de la vida del sistema comprades amb les tècniques basades en el cas pitjor. La recerca d'aquesta tesi ha estat motivada pel treball de l'autor durant més d'una dècada tractant temes de fiabilitat en sistemes, primer a Texas Instruments i després a Qualcomm.Postprint (published version

Otimização e melhoria da modulação comportamental para os interfaces de E/S analógica e de sinal misto de alta velocidade

Doutoramento em Engenharia ElectrotécnicaA integridade do sinal em sistemas digitais interligados de alta velocidade, e avaliada através da simulação de modelos físicos (de nível de transístor) é custosa de ponto vista computacional (por exemplo, em tempo de execução de CPU e armazenamento de memória), e exige a disponibilização de detalhes físicos da estrutura interna do dispositivo. Esse cenário aumenta o interesse pela alternativa de modelação comportamental que descreve as características de operação do equipamento a partir da observação dos sinais eléctrico de entrada/saída (E/S). Os interfaces de E/S em chips de memória, que mais contribuem em carga computacional, desempenham funções complexas e incluem, por isso, um elevado número de pinos. Particularmente, os buffers de saída são obrigados a distorcer os sinais devido à sua dinâmica e não linearidade. Portanto, constituem o ponto crítico nos de circuitos integrados (CI) para a garantia da transmissão confiável em comunicações digitais de alta velocidade. Neste trabalho de doutoramento, os efeitos dinâmicos não-lineares anteriormente negligenciados do buffer de saída são estudados e modulados de forma eficiente para reduzir a complexidade da modelação do tipo caixa-negra paramétrica, melhorando assim o modelo standard IBIS. Isto é conseguido seguindo a abordagem semi-física que combina as características de formulação do modelo caixa-negra, a análise dos sinais eléctricos observados na E/S e propriedades na estrutura física do buffer em condições de operação práticas. Esta abordagem leva a um processo de construção do modelo comportamental fisicamente inspirado que supera os problemas das abordagens anteriores, optimizando os recursos utilizados em diferentes etapas de geração do modelo (ou seja, caracterização, formulação, extracção e implementação) para simular o comportamento dinâmico não-linear do buffer. Em consequência, contributo mais significativo desta tese é o desenvolvimento de um novo modelo comportamental analógico de duas portas adequado à simulação em overclocking que reveste de um particular interesse nas mais recentes usos de interfaces de E/S para memória de elevadas taxas de transmissão. A eficácia e a precisão dos modelos comportamentais desenvolvidos e implementados são qualitativa e quantitativamente avaliados comparando os resultados numéricos de extracção das suas funções e de simulação transitória com o correspondente modelo de referência do estado-da-arte, IBIS.Signal integrity (SI) simulation of high-speed digital interconnected system via transistor level models is computational expensive (e.g. CPU time and memory storage), and requires the availability of physical details information of device’s internal structure. This scenario raises the interest for a behavioral modeling alternative which describes the device’s operation characteristics based on the observed input/output (I/O) electrical signal. I/O buffers that interface memory’s interconnects have major share in the computational load containing a very active complex functional part and high numbers of pins. Particularly, output buffers/drivers are forced to distort the I/O signals due to their nonlinear dynamics. In this concern, they constitute the integrated circuit (IC) bottleneck of ensuring reliable data transmission in the high-speed digital communication link. In this PhD work, the previously neglected driver’s nonlinear dynamic effects are efficiently captured to significantly reduce the state of the art black-box parametric modeling complexities and enhance the input/output buffers information specifications (IBIS). This is achieved by following the gray-box approach that merges the features of the black-box model’s formulation, the analysis of the observed I/O electrical signals and the buffer’s physical structure properties under practical operation conditions. This approach leads to physically inspired behavioral model’s construction procedure that overcomes the issues of the previous modeling approaches by optimizing the resources used at different model’s generation steps (i.e. characterization, formulation, extraction, and implementation) to mimic the driver’s nonlinear dynamic behavior. Moreover, the most important achievement is the development of a new two-port analog behavioral model for overclocking simulation that copes with the recent trends in I/O memory interfaces characterized by higher data rate transmission. The effectiveness and the accuracy of the developed and implemented behavioral models are qualitatively and quantitatively assessed by comparing the numerical results of their functions extraction and transient simulation to the ones simulated and extracted with transistor level models and the state of the art IBIS in order to validate their predictive and the generalization capabilities

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc