On Fault Resilient Network-on-Chip for Many Core Systems

Rapid scaling of transistor gate sizes has increased the density of on-chip integration and paved the way for heterogeneous many-core systems-on-chip, significantly improving the speed of on-chip processing. The design of the interconnection network of these complex systems is a challenging one and the network-on-chip (NoC) is now the accepted scalable and bandwidth efficient interconnect for multi-processor systems on-chip (MPSoCs). However, the performance enhancements of technology scaling come at the cost of reliability as on-chip components particularly the network-on-chip become increasingly prone to faults. In this thesis, we focus on approaches to deal with the errors caused by such faults. The results of these approaches are obtained not only via time-consuming cycle-accurate simulations but also by analytical approaches, allowing for faster and accurate evaluations, especially for larger networks. Redundancy is the general approach to deal with faults, the mode of which varies according to the type of fault. For the NoC, there exists a classification of faults into transient, intermittent and permanent faults. Transient faults appear randomly for a few cycles and may be caused by the radiation of particles. Intermittent faults are similar to transient faults, however, differing in the fact that they occur repeatedly at the same location, eventually leading to a permanent fault. Permanent faults by definition are caused by wires and transistors being permanently short or open. Generally, spatial redundancy or the use of redundant components is used for dealing with permanent faults. Temporal redundancy deals with failures by re-execution or by retransmission of data while information redundancy adds redundant information to the data packets allowing for error detection and correction. Temporal and information redundancy methods are useful when dealing with transient and intermittent faults. In this dissertation, we begin with permanent faults in NoC in the form of faulty links and routers. Our approach for spatial redundancy adds redundant links in the diagonal direction to the standard rectangular mesh topology resulting in the hexagonal and octagonal NoCs. In addition to redundant links, adaptive routing must be used to bypass faulty components. We develop novel fault-tolerant deadlock-free adaptive routing algorithms for these topologies based on the turn model without the use of virtual channels. Our results show that the hexagonal and octagonal NoCs can tolerate all 2-router and 3-router faults, respectively, while the mesh has been shown to tolerate all 1-router faults. To simplify the restricted-turn selection process for achieving deadlock freedom, we devised an approach based on the channel dependency matrix instead of the state-of-the-art Duato's method of observing the channel dependency graph for cycles. The approach is general and can be used for the turn selection process for any regular topology. We further use algebraic manipulations of the channel dependency matrix to analytically assess the fault resilience of the adaptive routing algorithms when affected by permanent faults. We present and validate this method for the 2D mesh and hexagonal NoC topologies achieving very high accuracy with a maximum error of 1%. The approach is very general and allows for faster evaluations as compared to the generally used cycle-accurate simulations. In comparison, existing works usually assume a limited number of faults to be able to analytically assess the network reliability. We apply the approach to evaluate the fault resilience of larger NoCs demonstrating the usefulness of the approach especially compared to cycle-accurate simulations. Finally, we concentrate on temporal and information redundancy techniques to deal with transient and intermittent faults in the router resulting in the dropping and hence loss of packets. Temporal redundancy is applied in the form of ARQ and retransmission of lost packets. Information redundancy is applied by the generation and transmission of redundant linear combinations of packets known as random linear network coding. We develop an analytic model for flexible evaluation of these approaches to determine the network performance parameters such as residual error rates and increased network load. The analytic model allows to evaluate larger NoCs and different topologies and to investigate the advantage of network coding compared to uncoded transmissions. We further extend the work with a small insight to the problem of secure communication over the NoC. Assuming large heterogeneous MPSoCs with components from third parties, the communication is subject to active attacks in the form of packet modification and drops in the NoC routers. Devising approaches to resolve these issues, we again formulate analytic models for their flexible and accurate evaluations, with a maximum estimation error of 7%

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

Development and Qualification of an FPGA-Based Multi-Processor System-on-Chip On-Board Computer for LEO Satellites

九州工業大学博士学位論文 学位記番号:工博甲第374号　学位授与年月日:平成26年9月26日Chapter 1: Introduction||Chapter 2: Background and Literature Review||Chapter 3: Multi-Processor System-on-Chip On-Borad Computer Design||Chapter 4: Space and Time Redundancy Trade-offs||Chapter 5: Radiation and Fault Injection Testing||Chapter 6: Thermal Vacuum Testing||Chapter 7: Results and Discussion||Chapter 8: Conclusion and Future Perspectives||ReferencesDeveloping small satellites for scientific and commercial purposes is emerging rapidly in the last decade. The future is still expected to carry more challenging services and designs to fulfill the growing needs for space based services. Nevertheless, there exists a big challenge in developing cost effective and highly efficient small satellites yet with accepted reliability and power consumption that is adequate to the mission capabilities. This challenge mandates the use of the recent developments in digital design techniques and technologies to strike the required balance between the four basic parameters: 1) Cost, 2) Performance, 3) Reliability and 4) Power consumption. This balance becomes even more stringent and harder to reach when the satellite mass reduces significantly. Mass reduction puts strict constraints on the power system in terms of the solar panels and the batteries. That fact creates the need to miniaturize the design of the subsystems as much as possible which can be viewed as the fifth parameter in the design balance dilemma. At Kyuhsu Institute of Technology-Japan we are investigating the use of SRAMbased Field Programmable Gate Arrays (FPGA) in building: 1) High performance, 2)Low cost, 3) Moderate power consumption and 4) Highly reliable Muti-Processor System-on-Chip (MPSoC) On-Board Computers (OBC) for future space missions and applications. This research tries to investigate how commercial grade SRAMbased FPGAs would perform in space and how to mitigate them against the space environment. Our methodology to answer that question depended on following formal design procedure for the OBC according to the space environment requirements then qualifying the design through extensive testing. We developed the MPSoC OBC with 4 complete embedded processor systems. The Inter Processor Communication (IPC) takes place through hardware First-In-First-Out (FIFO) mailboxes. One processor acts as the system master controller which monitors the operation and controls the reset and restore of the system in case of faults and the other three processors form Triple Modular Redundancy (TMR) fault tolerance architecture with each other. We used Dynamic Partial Reconfiguration (DPR) in scrubbing the configuration memory frames and correcting the faults that might exist. The system is implemented using a Virtex-5 LX50 commercial grade FPGA from Xilinx. The research also qualifies the design in the ground-simulated space environment conditions. We tested the implemented MPSoC OBC in Thermal Vacuum Chambers (TVC) at the Center of Nano-Satellite Testing (CeNT) at Kyushu Institute of Technology. Also we irradiated the design with proton accelerated beam at 65 MeV with fluxes of 10e06 and 3e06 particle/cm2/sec at the Takasaki Advanced Radiation Research Institute (TARRI). The TVC test results showed that the FPGA design exceeded the limits of normal operation for the commercial grade package at about 105 C°. Therefore, we mitigated the package using: 1) heat sink, 2) dynamic temperature management through operating frequency reduction from 100 MHz to 50 MHz and 3) reconfiguration to reduce the number of working processors to 2 instead of 4 by replacing the spaceredundancy TMR with time-redundancy TMR during the sunlight section of the orbit. The mitigation proved to be efficient and it even reduced the temperature from 105 C° to about 66 C° when the heat sink, frequency reduction, and reconfiguration techniques were used together. The radiation and the fault injection tests showed that mitigating the FPGA configuration frames through scrubbing are efficient when Single Bit Upsets (SBU) are recorded. Multiple Bit Upsets (MBU) are not well mitigated using the scrubbing with Single Error Correction Double Error Detection (SECDED) technique and the FPGA needs to be totally reset and reloaded when MBUs are detected in its configuration frames. However, as MBUs occurrence in space is very seldom and rare compared to SBUs, we consider that SECDED scrubbing is very efficient in decreasing the soft error rate and increasing the reliability of having error-free bitstreams. The reliability was proven to be at 0.9999 when the scrubbing rate was continuous at a period of 7.1 msec between complete scans of the FPGA bitstream. In the proton radiation tests we managed to develop a new technique to estimate the static cross section using internal scrubbing only without using external monitoring, control and scrubbing device. Fault injection was used to estimate the dynamic cross section in a cost effective alternative for estimating it through radiation test. The research proved through detailed testing that the 65 nm commercial grade SRAM-based FPGA can be used in future space missions. The MPSoC OBC design achieved an adequate balance between the performance, power, mass, and reliability requirements. Extensive testing and applying carefully crafted mitigation techniques were the key points to verify and validate the MPSoC OBC design. In-orbit validation through a scientific demonstration mission would be the next step for the future research

Secure Network-on-Chip Against Black Hole and Tampering Attacks

The Network-on-Chip (NoC) has become the communication heart of Multiprocessors-System-on-Chip (MPSoC). Therefore, it has been subject to a plethora of security threats to degrade the system performance or steal sensitive information. Due to the globalization of the modern semiconductor industry, many different parties take part in the hardware design of the system. As a result, the NoC could be infected with a malicious circuit, known as a Hardware Trojan (HT), to leave a back door for security breach purposes. HTs are smartly designed to be too small to be uncovered by offline circuit-level testing, so the system requires an online monitoring to detect and prevent the HT in runtime. This dissertation focuses on HTs inside the router of a NoC designed by a third party. It explores two HT-based threat models for the MPSoC, where the NoC experiences packet-loss and packet-tampering once the HT in the infected router is activated and is in the attacking state. Extensive experiments for each proposed architecture were conducted using a cycle-accurate simulator to demonstrate its effectiveness on the performance of the NoC-based system. The first threat model is the Black Hole Router (BHR) attack, where it silently discards the packets that are passing through without further announcement. The effect of the BHR is presented and analyzed to show the potency of the attack on a NoC-based system. A countermeasure protocol is proposed to detect the BHR at runtime and counteract the deliberate packet-dropping attack with a 26.9% area overhead, an average 21.31% performance overhead and a 22% energy consumption overhead. The protocol is extended to provide an efficient and power-gated scheme to enhance the NoC throughput and reduce the energy consumption by using end-to-end (e2e) approach. The power-gated e2e technique locates the BHR and avoids it with a 1% performance overhead and a 2% energy consumption overhead. The second threat model is a packet-integrity attack, where the HT tampers with the packet to apply a denial-of-service attack, steal sensitive information, gain unauthorized access, or misroute the packet to an unintended node. An authentic and secure NoC platform is proposed to detect and countermeasure the packet-tampering attack to maintain data-integrity and authenticity while keeping its secrecy with a 24.21% area overhead. The proposed NoC architecture is not only able to detect the attack, but also locates the infected router and isolates it from the network

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

GPU devices for safety-critical systems: a survey

Graphics Processing Unit (GPU) devices and their associated software programming languages and frameworks can deliver the computing performance required to facilitate the development of next-generation high-performance safety-critical systems such as autonomous driving systems. However, the integration of complex, parallel, and computationally demanding software functions with different safety-criticality levels on GPU devices with shared hardware resources contributes to several safety certification challenges. This survey categorizes and provides an overview of research contributions that address GPU devices’ random hardware failures, systematic failures, and independence of execution.This work has been partially supported by the European Research Council with Horizon 2020 (grant agreements No. 772773 and 871465), the Spanish Ministry of Science and Innovation under grant PID2019-107255GB, the HiPEAC Network of Excellence and the Basque Government under grant KK-2019-00035. The Spanish Ministry of Economy and Competitiveness has also partially supported Leonidas Kosmidis with a Juan de la Cierva Incorporación postdoctoral fellowship (FJCI-2020- 045931-I).Peer ReviewedPostprint (author's final draft

Fault-tolerant satellite computing with modern semiconductors

Miniaturized satellites enable a variety space missions which were in the past infeasible, impractical or uneconomical with traditionally-designed heavier spacecraft. Especially CubeSats can be launched and manufactured rapidly at low cost from commercial components, even in academic environments. However, due to their low reliability and brief lifetime, they are usually not considered suitable for life- and safety-critical services, complex multi-phased solar-system-exploration missions, and missions with a longer duration. Commercial electronics are key to satellite miniaturization, but also responsible for their low reliability: Until 2019, there existed no reliable or fault-tolerant computer architectures suitable for very small satellites. To overcome this deficit, a novel on-board-computer architecture is described in this thesis.Robustness is assured without resorting to radiation hardening, but through software measures implemented within a robust-by-design multiprocessor-system-on-chip. This fault-tolerant architecture is component-wise simple and can dynamically adapt to changing performance requirements throughout a mission. It can support graceful aging by exploiting FPGA-reconfiguration and mixed-criticality.  Experimentally, we achieve 1.94W power consumption at 300Mhz with a Xilinx Kintex Ultrascale+ proof-of-concept, which is well within the powerbudget range of current 2U CubeSats. To our knowledge, this is the first COTS-based, reproducible on-board-computer architecture that can offer strong fault coverage even for small CubeSats.European Space AgencyComputer Systems, Imagery and Medi