Synchronous wearable wireless body sensor network composed of autonomous textile nodes

A novel, fully-autonomous, wearable, wireless sensor network is presented, where each flexible textile node performs cooperative synchronous acquisition and distributed event detection. Computationally efficient situational-awareness algorithms are implemented on the low-power microcontroller present on each flexible node. The detected events are wirelessly transmitted to a base station, directly, as well as forwarded by other on-body nodes. For each node, a dual-polarized textile patch antenna serves as a platform for the flexible electronic circuitry. Therefore, the system is particularly suitable for comfortable and unobtrusive integration into garments. In the meantime, polarization diversity can be exploited to improve the reliability and energy-efficiency of the wireless transmission. Extensive experiments in realistic conditions have demonstrated that this new autonomous, body-centric, textile-antenna, wireless sensor network is able to correctly detect different operating conditions of a firefighter during an intervention. By relying on four network nodes integrated into the protective garment, this functionality is implemented locally, on the body, and in real time. In addition, the received sensor data are reliably transferred to a central access point at the command post, for more detailed and more comprehensive real-time visualization. This information provides coordinators and commanders with situational awareness of the entire rescue operation. A statistical analysis of measured on-body node-to-node, as well as off-body person-to-person channels is included, confirming the reliability of the communication system

Communication channel analysis and real time compressed sensing for high density neural recording devices

Next generation neural recording and Brain- Machine Interface (BMI) devices call for high density or distributed systems with more than 1000 recording sites. As the recording site density grows, the device generates data on the scale of several hundred megabits per second (Mbps). Transmitting such large amounts of data induces significant power consumption and heat dissipation for the implanted electronics. Facing these constraints, efficient on-chip compression techniques become essential to the reduction of implanted systems power consumption. This paper analyzes the communication channel constraints for high density neural recording devices. This paper then quantifies the improvement on communication channel using efficient on-chip compression methods. Finally, This paper describes a Compressed Sensing (CS) based system that can reduce the data rate by > 10x times while using power on the order of a few hundred nW per recording channel

Efficient DSP and Circuit Architectures for Massive MIMO: State-of-the-Art and Future Directions

Massive MIMO is a compelling wireless access concept that relies on the use of an excess number of base-station antennas, relative to the number of active terminals. This technology is a main component of 5G New Radio (NR) and addresses all important requirements of future wireless standards: a great capacity increase, the support of many simultaneous users, and improvement in energy efficiency. Massive MIMO requires the simultaneous processing of signals from many antenna chains, and computational operations on large matrices. The complexity of the digital processing has been viewed as a fundamental obstacle to the feasibility of Massive MIMO in the past. Recent advances on system-algorithm-hardware co-design have led to extremely energy-efficient implementations. These exploit opportunities in deeply-scaled silicon technologies and perform partly distributed processing to cope with the bottlenecks encountered in the interconnection of many signals. For example, prototype ASIC implementations have demonstrated zero-forcing precoding in real time at a 55 mW power consumption (20 MHz bandwidth, 128 antennas, multiplexing of 8 terminals). Coarse and even error-prone digital processing in the antenna paths permits a reduction of consumption with a factor of 2 to 5. This article summarizes the fundamental technical contributions to efficient digital signal processing for Massive MIMO. The opportunities and constraints on operating on low-complexity RF and analog hardware chains are clarified. It illustrates how terminals can benefit from improved energy efficiency. The status of technology and real-life prototypes discussed. Open challenges and directions for future research are suggested.Comment: submitted to IEEE transactions on signal processin

Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era

Due to the exceedingly high integration density of VLSI circuits and the resulting high power density, thermal integrity became a major challenge. One way to tackle this problem is Dark silicon. Dark silicon is the amount of circuitry in a chip that is forced to switch off to insure thermal integrity of the system and prevent permanent thermal-related faults. In many-core systems, the presence of Dark Silicon adds new design constraints, in general, and on the communication fabric of such systems, in particular. This is due to the fact that system-level thermal-management systems tend to increase the distance between high activity cores to insure better thermal balancing and integrity. Consequently, a designing dilemma is created where a compromise has to be made between interconnect performance and power consumption. This study proposes a hybrid wire and surface-wave interconnect (SWI) based Network-on-Chip (NoC) to address the dark silicon challenge. Through efficient utilization of one-hop cross the chip communication SWI links, the proposed architecture is able to offer an efficient and scalable communication platform in terms of performance, power, and thermal impact. As a result, evaluations of the proposed architecture compared to baseline architecture under dark silicon scenarios show reduction in maximum temperature by 15°C, average delay up to 73.1%, and energy-saving up to ~3X. This study explores the promising potential of the proposed architecture in extending the utilization wall for current and future many-core systems in dark silicon era

Architecting a One-to-many Traffic-Aware and Secure Millimeter-Wave Wireless Network-in-Package Interconnect for Multichip Systems

With the aggressive scaling of device geometries, the yield of complex Multi Core Single Chip(MCSC) systems with many cores will decrease due to the higher probability of manufacturing defects especially, in dies with a large area. Disintegration of large System-on-Chips(SoCs) into smaller chips called chiplets has shown to improve the yield and cost of complex systems. Therefore, platform-based computing modules such as embedded systems and micro-servers have already adopted Multi Core Multi Chip (MCMC) architectures overMCSC architectures. Due to the scaling of memory intensive parallel applications in such systems, data is more likely to be shared among various cores residing in different chips resulting in a significant increase in chip-to-chip traffic, especially one-to-many traffic. This one-to-many traffic is originated mainly to maintain cache-coherence between many cores residing in multiple chips. Besides, one-to-many traffics are also exploited by many parallel programming models, system-level synchronization mechanisms, and control signals. How-ever, state-of-the-art Network-on-Chip (NoC)-based wired interconnection architectures do not provide enough support as they handle such one-to-many traffic as multiple unicast trafficusing a multi-hop MCMC communication fabric. As a result, even a small portion of such one-to-many traffic can significantly reduce system performance as traditional NoC-basedinterconnect cannot mask the high latency and energy consumption caused by chip-to-chipwired I/Os. Moreover, with the increase in memory intensive applications and scaling of MCMC systems, traditional NoC-based wired interconnects fail to provide a scalable inter-connection solution required to support the increased cache-coherence and synchronization generated one-to-many traffic in future MCMC-based High-Performance Computing (HPC) nodes. Therefore, these computation and memory intensive MCMC systems need an energy-efficient, low latency, and scalable one-to-many (broadcast/multicast) traffic-aware interconnection infrastructure to ensure high-performance. Research in recent years has shown that Wireless Network-in-Package (WiNiP) architectures with CMOS compatible Millimeter-Wave (mm-wave) transceivers can provide a scalable, low latency, and energy-efficient interconnect solution for on and off-chip communication. In this dissertation, a one-to-many traffic-aware WiNiP interconnection architecture with a starvation-free hybrid Medium Access Control (MAC), an asymmetric topology, and a novel flow control has been proposed. The different components of the proposed architecture are individually one-to-many traffic-aware and as a system, they collaborate with each other to provide required support for one-to-many traffic communication in a MCMC environment. It has been shown that such interconnection architecture can reduce energy consumption and average packet latency by 46.96% and 47.08% respectively for MCMC systems. Despite providing performance enhancements, wireless channel, being an unguided medium, is vulnerable to various security attacks such as jamming induced Denial-of-Service (DoS), eavesdropping, and spoofing. Further, to minimize the time-to-market and design costs, modern SoCs often use Third Party IPs (3PIPs) from untrusted organizations. An adversary either at the foundry or at the 3PIP design house can introduce a malicious circuitry, to jeopardize an SoC. Such malicious circuitry is known as a Hardware Trojan (HT). An HTplanted in the WiNiP from a vulnerable design or manufacturing process can compromise a Wireless Interface (WI) to enable illegitimate transmission through the infected WI resulting in a potential DoS attack for other WIs in the MCMC system. Moreover, HTs can be used for various other malicious purposes, including battery exhaustion, functionality subversion, and information leakage. This information when leaked to a malicious external attackercan reveals important information regarding the application suites running on the system, thereby compromising the user profile. To address persistent jamming-based DoS attack in WiNiP, in this dissertation, a secure WiNiP interconnection architecture for MCMC systems has been proposed that re-uses the one-to-many traffic-aware MAC and existing Design for Testability (DFT) hardware along with Machine Learning (ML) approach. Furthermore, a novel Simulated Annealing (SA)-based routing obfuscation mechanism was also proposed toprotect against an HT-assisted novel traffic analysis attack. Simulation results show that,the ML classifiers can achieve an accuracy of 99.87% for DoS attack detection while SA-basedrouting obfuscation could reduce application detection accuracy to only 15% for HT-assistedtraffic analysis attack and hence, secure the WiNiP fabric from age-old and emerging attacks

A Holistic Formulation for System Margining and Jitter Tolerance Optimization in Industrial Post-Silicon Validation

There is an increasingly higher number of mixed-signal circuits within microprocessors and systems on chip (SoC). A significant portion of them corresponds to high-speed input/output (HSIO) links. Post-silicon validation of HSIO links can be critical for making a product release qualification decision under aggressive launch schedules. The optimization of receiver analog circuitry in modern HSIO links is a very time consuming post-silicon validation process. Current industrial practices are based on exhaustive enumeration methods to improve either the system margins or the jitter tolerance compliance test. In this paper, these two requirements are addressed in a holistic optimization-based approach. We propose a novel objective function based on these two metrics. Our method employs Kriging to build a surrogate model based on system margining and jitter tolerance measurements. The proposed method, tested with three different realistic server HSIO links, is able to deliver optimal system margins and guarantee jitter tolerance compliance while substantially decreasing the typical post-silicon validation time.ITESO, A.C

56+ Gb/s serial transmission using duo-binary signaling

In this paper we present duobinary signaling as an alternative for signaling schemes like PAM4 and Ensemble NRZ that are currently being considered as ways to achieve data rates of 56 Gb/s over copper. At the system level, the design includes a custom transceiver ASIC. The transmitter is capable of equalizing 56 Gb/s non-return to zero (NRZ) signals into a duobinary response at the output of the channel. The receiver includes dedicated hardware to decode the duobinary signal. This transceiver is used to demonstrate error-free transmission for different PCB channel lengths including a state-of-the-art Megtron 6 backplane demonstrator