Gate-level timing analysis and waveform evaluation

Static timing analysis (STA) is an integral part of modern VLSI chip design. Table lookup based methods are widely used in current industry due to its fast runtime and mature algorithms. Conventional STA algorithms based on table-lookup methods are developed under many assumptions in timing analysis; however, most of those assumptions, such as that input signals and output signals can be accurately modeled as ramp waveforms, are no longer satisfactory to meet the increasing demand of accuracy for new technologies. In this dissertation, we discuss several crucial issues that conventional STA has not taken into consideration, and propose new methods to handle these issues and show that new methods produce accurate results. In logic circuits, gates may have multiple inputs and signals can arrive at these inputs at different times and with different waveforms. Different arrival times and waveforms of signals can cause very different responses. However, multiple-input transition effects are totally overlooked by current STA tools. Using a conventional single-input transition model when multiple-input transition happens can cause significant estimation errors in timing analysis. Previous works on this issue focus on developing a complicated gate model to simulate the behavior of logic gates. These methods have high computational cost and have to make significant changes to the prevailing STA tools, and are thus not feasible in practice. This dissertation proposes a simplified gate model, uses transistor connection structures to capture the behavior of multiple-input transitions and requires no change to the current STA tools. Another issue with table lookup based methods is that the load of each gate in technology libraries is modeled as a single lumped capacitor. But in the real circuit, the Abstract 2 gate connects to its subsequent gates via metal wires. As the feature size of integrated circuit scales down, the interconnection cannot be seen as a simple capacitor since the resistive shielding effect will largely affect the equivalent capacitance seen from the gate. As the interconnection has numerous structures, tabulating the timing data for various interconnection structures is not feasible. In this dissertation, by using the concept of equivalent admittance, we reduce an arbitrary interconnection structure into an equivalent π-model RC circuit. Many previous works have mapped the π-model to an effective capacitor, which makes the table lookup based methods useful again. However, a capacitor cannot be equivalent to a π-model circuit, and will thus result in significant inaccuracy in waveform evaluation. In order to obtain an accurate waveform at gate output, a piecewise waveform evaluation method is proposed in this dissertation. Each part of the piecewise waveform is evaluated according to the gate characteristic and load structures. Another contribution of this dissertation research is a proposed equivalent waveform search method. The signal waveforms can be very complicated in the real circuits because of noises, race hazards, etc. The conventional STA only uses one attribute (i.e., transition time) to describe the waveform shape which can cause significant estimation errors. Our approach is to develop heuristic search functions to find equivalent ramps to approximate input waveforms. Here the transition time of a final ramp can be completely different from that of the original waveform, but we can get higher accuracy on output arrival time and transition time. All of the methods mentioned in this dissertation require no changes to the prevailing STA tools, and have been verified across different process technologies

Repeater insertion to minimise delay in coupled interconnects.

Signalling over long interconnect is a dominant issue in electronic chip design in current technologies, with the device sizes getting smaller and smaller and the circuits becoming ever larger. Repeater insertion is a well established technique to minimise the propagation delay over long resistive interconnect. In deep sub-micron technologies, as the wires are spaced closer and closer together and signal rise and fall times go into the sub-nano second region, the coupling between interconnects assumes great significance. The resulting crosstalk has implications on the data throughput and on signal integrity. Depending on the data correlation on the coupled lines, the delay can either decrease or increase. In this paper we attempt to quantify the effect of worst-case capacitive crosstalk in parallel buses and look at how it affects repeater insertion in particular. We develop analytic expressions for the delay, buffer size and number that are suitable in a-priori timing analyses and signal integrity estimations. All equations are checked against a dynamic circuit simulator (SPECTRE

Compact CMOS active quenching/recharge circuit for SPAD arrays

Avalanche diodes operating in Geiger mode are able to detect single photon events. They can be employed to photon counting and time-of-flight estimation. In order to ensure proper operation of these devices, the avalanche current must be rapidly quenched, and, later on, the initial equilibrium must be restored. In this paper, we present an active quenching/recharge circuit specially designed to be integrated in the form of an array of single-photon avalanche diode (SPAD) detectors. Active quenching and recharge provide benefits like an accurately controllable pulse width and afterpulsing reduction. In addition, this circuit yields one of the lowest reported area occupations and power consumptions. The quenching mechanism employed is based on a positive feedback loop that accelerates quenching right after sensing the avalanche current. We have employed a current starved inverter for the regulation of the hold-off time, which is more compact than other reported controllable delay implementations. This circuit has been fabricated in a standard 0.18 μm complementary metal-oxide-semiconductor (CMOS) technology. The SPAD has a quasi-circular shape of 12 μm diameter active area. The fill factor is about 11%. The measured time resolution of the detector is 187 ps. The photon-detection efficiency (PDE) at 540 nm wavelength is about 5% at an excess voltage of 900 mV. The break-down voltage is 10.3 V. A dark count rate of 19 kHz is measured at room temperature. Worst case post-layout simulations show a 117 ps quenching and 280 ps restoring times. The dead time can be accurately tuned from 5 to 500 ns. The pulse-width jitter is below 1.8 ns when dead time is set to 40 ns.Ministerio de Economía y Competitividad TEC2012-38921-C02, IPT-2011-1625-430000, IPC-20111009 CDTIJunta de Andalucía TIC 2338-2013Office of Naval Research (USA) N00014141035

Modeling of thermally induced skew variations in clock distribution network

Clock distribution network is sensitive to large thermal gradients on the die as the performance of both clock buffers and interconnects are affected by temperature. A robust clock network design relies on the accurate analysis of clock skew subject to temperature variations. In this work, we address the problem of thermally induced clock skew modeling in nanometer CMOS technologies. The complex thermal behavior of both buffers and interconnects are taken into account. In addition, our characterization of the temperature effect on buffers and interconnects provides valuable insight to designers about the potential impact of thermal variations on clock networks. The use of industrial standard data format in the interface allows our tool to be easily integrated into existing design flow

Improvement of a Propagation Delay Model for CMOS Digital Logic Circuits

Propagation delay models, for CMOS Digital Circuits, provide an initial design solution for Integrated Circuits. Resources, both monetary and manpower, constrain the design process, leading to the need for a more accurate entry point further along in the design cycle. By verifying an existing propagation delay method, and its resulting delay model, calibration for any given process technology can be achieved. Literature reviews and detailed analysis of each step in the model development allow for greater understanding of each contributing parameter, and ultimately, adjustments to the model calibration result in a more accurate analytical model. An existing model was verified and improved upon using TSMC 0.18um and IBM 0.13um SPICE decks, and the resulting improvements can be used to further assist individuals needing a method and model for deriving an initial circuit design solution for integrated circuits