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Fiscal Year 1995
The mission of the Engineering Research, Development, and Technology Program at Lawrence Livermore National Laboratory (LLNL) is to develop the knowledge base, process technologies, specialized equipment, tools and facilities to support current and future LLNL programs. Engineering`s efforts are guided by a strategy that results in dual benefit: first, in support of Department of Energy missions, such as national security through nuclear deterrence; and second, in enhancing the nation`s economic competitiveness through their collaboration with US industry in pursuit of the most cost-effective engineering solutions to LLNL programs. To accomplish this mission, the Engineering Research, Development, and Technology Program has two important goals: (1) identify key technologies relevant to LLNL programs where they can establish unique competencies, and (2) conduct high-quality research and development to enhance their capabilities and establish themselves as the world leaders in these technologies. To focus Engineering`s efforts, technology thrust areas are identified and technical leaders are selected for each area. The thrust areas are comprised of integrated engineering activities, staffed by personnel from the nine electronics and mechanical engineering divisions, and from other LLNL organizations. This annual report, organized by thrust area, describes Engineering`s activities for fiscal year 1995. The report provides timely summaries of objectives methods, and key results from eight thrust areas: computational electronics and electromagnetics; computational mechanics; microtechnology; manufacturing technology; materials science and engineering; power conversion technologies; nondestructive evaluation; and information engineering
Index to 1981 NASA Tech Briefs, volume 6, numbers 1-4
Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1981 Tech Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences
Magnetoelectric Coupling in BaTiO3-BiFeO3 Multilayers: Growth Optimization and Characterization
The presented thesis explores the magnetoelectric (ME) coupling in multiferroic thin film multilayers of BaTiO3 (BTO) and BiFeO3 (BFO). Multiferroics possess more than one ferroic order parameter, in this case ferroelectricity and anti-ferromagnetism. Cross-coupling between these otherwise separate order parameters promises great advantages in the fields of multistate memory, spintronics and even medical applications. The first major challenge in this field of study is the rarity of multiferroics. Second, most known multiferroics, both intrinsic and extrinsic in nature, possess very low ME coupling coefficients. In previous studies conducted
by our group, BTO-BFO multilayers deposited by pulsed laser deposition (PLD) showed a ME coupling coefficient αME enhanced by one order of magnitude, when compared to single-layers of the intrinsic multiferroic BFO. However, the mechanism of ME coupling in such heterostructures is poorly understood until now. In this thesis, we used a selection of structural, chemical, electrical and magnetic measurements to maximize the αME-coefficient and shed light on the origin of this enhanced ME effect.
The comparison of BTO-BFO multilayers over single-layers revealed not only enhanced ME-coupling, but also reduced mosaicity, roughness and leakage current density in multilayers. Following a parametric sample optimization, we achieved an atomically smooth interface roughness and vast improvements in the ferroelectric properties by introducing a shadow mask in the PLD process. We measured the highest αME-value so far of 480 Vcm-1Oe-1 for a multilayer with a double-layer thickness of only 4.6 nm, two orders of magnitude larger than the coefficient of 4 Vcm-1Oe-1 measured for BFO single-layers. The αME-coefficient in these multilayers stands in an inverse correlation with the double-layer thickness ddl. The influence of oxygen pressure during growth and BTO-BFO ratio on αME was shown to be neglible in comparison to that of ddl. From the characteristic dependencies of αME on magnetic bias field, temperature and ddl, we concluded the existence of an interface-driven coupling mechanism in BTO-BFO multilayers.:1 Introduction
2 Theory of Multiferroic Magnetoelectrics
2.1 Primary Ferroic Properties
2.2 Magnetoelectric Coupling
3 Materials
3.1 The General Structure of Perovskites ABX3
3.2 Strontium Titanate SrTiO3
3.3 Barium Titanate BaTiO3
3.4 Bismuth Ferrite BiFeO3
3.5 Heterostructures Based on BiFeO3
4 Experimental Section
4.1 Thin Film Fabrication
4.2 X–Ray Diffraction
4.3 Microscopic Techniques
4.4 Chemical Analysis Techniques
4.5 Ferroelectric Characterization
4.6 Magnetic Property Measurements
4.7 Measurement of the Magnetoelectric Coupling Coefficient
5 BaTiO3–BiFeO3 Heterostructures
5.1 General Properties of Single-Layers and Multilayers of BTO and BFO
5.2 PLD–Growth of BaTiO3–BiFeO3 Multilayers
5.3 Manipulation of Multilayer Properties through Design
5.4 Effectiveness of Eclipse–PLD
5.5 Enhanced ME Effect in BaTiO3–BiFeO3 Multilayers
6 Summary and Outlook
A Magnetoelectric Measurement Setup
B Magnetic Background Measurements
C Polarized Neutron Reflectometry
Literature
Own and Contributed Work
Acknowledgement
Erratu
Microstructural, mechanical and electrical characterisation of piezoelectric particulate composites with dielectric modelling
EThOS - Electronic Theses Online ServiceGBUnited Kingdo
Fiscal year 1973 scientific and technical reports, articles, papers, and presentations
Formal NASA technical reports, papers published in technical journals, and presentations by MSFC personnel in FY73 are presented. Papers of MSFC contractors are also included
The design and implementation of a flexible manufacturing system for a surface mounting production line
A project report submitted to the Faculty of Engineering,
University of the Witwatersrand, Johannesburg, in partial
fulfillment of the requirements for the degree of Master of
Science in Engineering.The viability of introducing a Surface Mount
production line is chiefly determined by the
reliability characteristics of the components being
used. Surface Mount Technology (SMT) is entirely new
and although related to traditional through-hole
processes, requires different components, assembly
techniques and design methods. The purpose of the
literature survey is primarily to determine whether
surface mount components meet today's industrial
requirements with respect to their manufacturing
reliability and availability. A brief review of the
evolution of SMT is also presented. This study finds
that the implementation of SMT should be given highest
priority by manufacturing companies in order to
maintain their share of the marketplace.
Surface Mount Technology embodies a totally new
automated circuit assembly process, using a new
generation of electronic comporents: surface mounted
devices (SMDs). Smaller than conventional components,
SMDs are placed onto the surface of the substrate.
From this, the fundamental difference between SMD
assembly and convencional through-hole component
assembly arises; SMD component positioning is
relative, not absolute.
When a through-hole component is inserted into a pcb,
either the leads go through the hales or they don't.
An SMD, however, is placed onto the substrate surface,
it's position only relative to the solder lands, and
placement accuracy is therefore influenced by
variations in the substrate track pattern, component
size, and placement machine accuracy.
Other factors influence the layout of SMD substrates.
For example, will the board be a mixed-print ( a
combination of through-hole components and SMDs) or an
all-SMD design? Will SMDs be placed on one side of the
substrate or both? And there are process
considerations like what type of machine will place
the components and how will they be soldered?
This project describes in detail the processes
involved in setting up an SMT facility. A simulation
program was developed to verify the viability of these
processes. The simulation program was also applied to
an existing SMT facility and together with developed
optimization software, attempted to identify and
resolve some of the major problems. All this was
achieved, and the extent to which simulation could be
used as an efficient production tool, was highlighted.AC201
Structural, Electrical and Magnetic Properties of CoFe2O4 and BaTiO3 Layered Nanostructures on Conductive Metal Oxides
Multiferroic materials exhibit simultaneously, magnetic and electric order. In a magnetoelectric
composite structure, a coupling is induced via an interfacial elastic interaction between
magnetostrictive and piezoelectric materials enabling the control of the magnetisation by applying
an electric field and vice versa. However, despite the potential of such coupling, experimental limits
of theoretical models were observed. This work sheds some light on these limits by focusing the
research on the chemistry of nanocomposite CoFe2O4 and BaTiO3, particularly at the interfaces
where the coupling predominates.
A comparison of the most common conductive oxides, Nb doped SrTiO3 and SrRuO3, was made for
the bottom electrode application. The variation of conductive properties in Nb-SrTiO3 thin films at
high temperature has been quantified when artificially strained and 60 nm SrRuO3 film was found to
be the best bottom electrode choice for room temperature use.
Epitaxial growth of magnetic CoFe2O4 was achieved on various metal oxide substrates despite large
lattice mismatches. Crystallographic properties and strain evaluation were investigated and a
Stranski-Krastanov growth mechanism, arising from the PLD deposition, was predominant. A notable
drop of magnetisation was observed depending on the growth template, particularly on BaTiO3
substrates, the piezoelectric counterpart of the magnetoelectric structures. However, an
encouraging magnetoelectric coupling induced by thermal phase transition of BaTiO3 was revealed.
For BaTiO3, a control of the growth direction was realised by varying the deposition pressure, and
the existence of both 180° and 90° ferroelectric domains was observed for films up to 300 nm in
thickness. However, both the ferroelectric and piezoelectric properties were reduced in the thin
films due to the clamping effect of the substrate.
Finally, highly crystalline multilayers of CoFe2O4 and BaTiO3 were prepared on SrRuO3 buffered
SrTiO3 substrates. It was found that the degradation of both magnetic and ferroelectric properties
was proportional to the increase in the number of interfaces. A thorough microscopic study revealed
interdiffusion and chemical instability occurring between CoFe2O4 and BaTiO3 at the interface. This
undesired effect was partially recovered by the insertion of an ultra thin layer of SrTiO3, acting as a
barrier layer at every interface. This research shows how interfacial chemistry need to be
understood to achieve high magnetoelectric coupling in these types of epitaxial engineered
structures
Correlating Nanoscale Grain Boundary Composition with Electrical Conductivity in Ceria
abstract: Because of their favorable ionic and/or electronic conductivity, non-stoichiometric oxides are utilized for energy storage, energy conversion, sensing, catalysis, gas separation, and information technologies, both potential and commercialized. Charge transport in these materials is influenced strongly by grain boundaries, which exhibit fluctuations in composition, chemistry and atomic structure within Ă…ngstroms or nanometers. Here, studies are presented that elucidate the interplay between macroscopic electrical conductivity, microscopic character, and local composition and electronic structure of grain boundaries in polycrystalline ceria-based (CeO2) solid solutions. AC impedance spectroscopy is employed to measure macroscopic electrical conductivity of grain boundaries, and electron energy-loss spectroscopy (EELS) in the aberration-correction scanning transmission electron microscope (AC-STEM) is used to quantify local composition and electronic structure. Electron diffraction orientation imaging microscopy is employed to assess microscopic grain boundary character, and links these macro- and nanoscopic techniques across length scales.
A model system, CaxCe1-xO2-x-δ, is used to systematically investigate relationships between nominal Ca2+ concentration, grain boundary ionic conductivity, microscale character, and local solute concentration. Grain boundary conductivity varied by several orders of magnitude over the composition range, and assessment of grain boundary character highlighted the critical influence of local composition on conductivity. Ceria containing Gd3+ and Pr3+/4+ was also investigated following previous theoretical work predicting superior ionic conductivity relative to state-of-the-art GdxCe1-xO2-x/2-δ. The grain boundary conductivity was nearly 100 times greater than expected and a factor four enrichment of Pr concentration was observed at the grain boundary, which suggested electronic conduction that was cited as the origin of the enhanced conductivity. This finding inspired the development of two EELS-based experimental approaches to elucidate the effect of Pr enrichment on grain boundary conductivity. One employed ultra-high energy resolution (~10 meV) monochromated EELS to characterize Pr inter-bandgap electronic states. Alternatively, STEM nanodiffraction orientation imaging coupled with AC-STEM EELS was employed to estimate the composition of the entire grain boundary population in a polycrystalline material. These compositional data were the input to a thermodynamic model used to predict electrical properties of the grain boundary population. These results suggest improved DC ionic conduction and enhanced electronic conduction under AC conditions.Dissertation/ThesisDoctoral Dissertation Materials Science and Engineering 201
Automating Fault Detection and Quality Control in PCBs: A Machine Learning Approach to Handle Imbalanced Data
Printed Circuit Boards (PCBs) are fundamental to the operation of a wide array of electronic devices, from consumer electronics to sophisticated industrial machinery. Given this pivotal role, quality control and fault detection are especially significant, as they are essential for ensuring the devices' long-term reliability and efficiency. To address this, the thesis explores advancements in fault detection and quality control methods for PCBs, with a focus on Machine Learning (ML) and Deep Learning (DL) techniques. The study begins with an in-depth review of traditional approaches like visual and X-ray inspections, then delves into modern, data-driven methods, such as automated anomaly detection in PCB manufacturing using tabular datasets. The core of the thesis is divided into three specific tasks: firstly, applying ML and DL models for anomaly detection in PCBs, particularly focusing on solder-pasting issues and the challenges posed by imbalanced datasets; secondly, predicting human inspection labels through specially designed tabular models like TabNet; and thirdly, implementing multi-classification methods to automate repair labeling on PCBs. The study is structured to offer a comprehensive view, beginning with background information, followed by the methodology and results of each task, and concluding with a summary and directions for future research. Through this systematic approach, the research not only provides new insights into the capabilities and limitations of existing fault detection techniques but also sets the stage for more intelligent and efficient systems in PCB manufacturing and quality control
2D nanocrystal heterostructures - novel production methods and device applications
This thesis primarily investigates an approach to realise a variety of functional heterostructures based on van der Waals (vdW) nanocrystalline lms produced through the mechanical abrasion of bulk powders. This novel production technique represents the next step in the evolution of scalable production routes which can take advantage of vdW materials and their heterostructures whilst preserving the high electronic and optical quality of the individual crystals. To demonstrate the e cacy of this method, a slew of di erent device architectures are developed, including photovoltaics, triboelectric nanogenerators, strain sensors, capacitive pressure sensors and thermistors. All exhibit either superior or comparable performance to analogous systems within the literature, and show great potential for future optimised vdW heterostructure devices. The secondary focus of this thesis is the incorporation of talc dielectrics as a potentially clean and atomically at alternative substrate to hexagonal boron nitride (hBN) for few-layer transition metal dichalcogenide (TMDC) eld-e ect transistors (FETs) and for excitonic TMDC monolayers. It is found that talc-based TMDC FETs show small hysteresis which does not strongly depend on back gate sweep rate as well as have negligible leakage current for the dielectric thicknesses studied. Furthermore, it is found that photoluminescent (PL) emission from monolayer TMDC materials using talc as a substrate have narrow linewidths reduced to as little as 10 meV which, in addition to the high intensity PL emission, suggests that talc can be used to preserve the intrinsic excitonic properties of the TMDC. Additionally, the spontaneous doping properties of talc allow for the room-temperature observation of trions in all of the TMDC/talc devices studied
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