Synthesis for circuit reliability

textElectrical and Computer Engineerin

On Fault Tolerance Methods for Networks-on-Chip

Technology scaling has proceeded into dimensions in which the reliability of manufactured devices is becoming endangered. The reliability decrease is a consequence of physical limitations, relative increase of variations, and decreasing noise margins, among others. A promising solution for bringing the reliability of circuits back to a desired level is the use of design methods which introduce tolerance against possible faults in an integrated circuit. This thesis studies and presents fault tolerance methods for network-onchip (NoC) which is a design paradigm targeted for very large systems-onchip. In a NoC resources, such as processors and memories, are connected to a communication network; comparable to the Internet. Fault tolerance in such a system can be achieved at many abstraction levels. The thesis studies the origin of faults in modern technologies and explains the classification to transient, intermittent and permanent faults. A survey of fault tolerance methods is presented to demonstrate the diversity of available methods. Networks-on-chip are approached by exploring their main design choices: the selection of a topology, routing protocol, and flow control method. Fault tolerance methods for NoCs are studied at different layers of the OSI reference model. The data link layer provides a reliable communication link over a physical channel. Error control coding is an efficient fault tolerance method especially against transient faults at this abstraction level. Error control coding methods suitable for on-chip communication are studied and their implementations presented. Error control coding loses its effectiveness in the presence of intermittent and permanent faults. Therefore, other solutions against them are presented. The introduction of spare wires and split transmissions are shown to provide good tolerance against intermittent and permanent errors and their combination to error control coding is illustrated. At the network layer positioned above the data link layer, fault tolerance can be achieved with the design of fault tolerant network topologies and routing algorithms. Both of these approaches are presented in the thesis together with realizations in the both categories. The thesis concludes that an optimal fault tolerance solution contains carefully co-designed elements from different abstraction levelsSiirretty Doriast

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Architecting a One-to-many Traffic-Aware and Secure Millimeter-Wave Wireless Network-in-Package Interconnect for Multichip Systems

With the aggressive scaling of device geometries, the yield of complex Multi Core Single Chip(MCSC) systems with many cores will decrease due to the higher probability of manufacturing defects especially, in dies with a large area. Disintegration of large System-on-Chips(SoCs) into smaller chips called chiplets has shown to improve the yield and cost of complex systems. Therefore, platform-based computing modules such as embedded systems and micro-servers have already adopted Multi Core Multi Chip (MCMC) architectures overMCSC architectures. Due to the scaling of memory intensive parallel applications in such systems, data is more likely to be shared among various cores residing in different chips resulting in a significant increase in chip-to-chip traffic, especially one-to-many traffic. This one-to-many traffic is originated mainly to maintain cache-coherence between many cores residing in multiple chips. Besides, one-to-many traffics are also exploited by many parallel programming models, system-level synchronization mechanisms, and control signals. How-ever, state-of-the-art Network-on-Chip (NoC)-based wired interconnection architectures do not provide enough support as they handle such one-to-many traffic as multiple unicast trafficusing a multi-hop MCMC communication fabric. As a result, even a small portion of such one-to-many traffic can significantly reduce system performance as traditional NoC-basedinterconnect cannot mask the high latency and energy consumption caused by chip-to-chipwired I/Os. Moreover, with the increase in memory intensive applications and scaling of MCMC systems, traditional NoC-based wired interconnects fail to provide a scalable inter-connection solution required to support the increased cache-coherence and synchronization generated one-to-many traffic in future MCMC-based High-Performance Computing (HPC) nodes. Therefore, these computation and memory intensive MCMC systems need an energy-efficient, low latency, and scalable one-to-many (broadcast/multicast) traffic-aware interconnection infrastructure to ensure high-performance. Research in recent years has shown that Wireless Network-in-Package (WiNiP) architectures with CMOS compatible Millimeter-Wave (mm-wave) transceivers can provide a scalable, low latency, and energy-efficient interconnect solution for on and off-chip communication. In this dissertation, a one-to-many traffic-aware WiNiP interconnection architecture with a starvation-free hybrid Medium Access Control (MAC), an asymmetric topology, and a novel flow control has been proposed. The different components of the proposed architecture are individually one-to-many traffic-aware and as a system, they collaborate with each other to provide required support for one-to-many traffic communication in a MCMC environment. It has been shown that such interconnection architecture can reduce energy consumption and average packet latency by 46.96% and 47.08% respectively for MCMC systems. Despite providing performance enhancements, wireless channel, being an unguided medium, is vulnerable to various security attacks such as jamming induced Denial-of-Service (DoS), eavesdropping, and spoofing. Further, to minimize the time-to-market and design costs, modern SoCs often use Third Party IPs (3PIPs) from untrusted organizations. An adversary either at the foundry or at the 3PIP design house can introduce a malicious circuitry, to jeopardize an SoC. Such malicious circuitry is known as a Hardware Trojan (HT). An HTplanted in the WiNiP from a vulnerable design or manufacturing process can compromise a Wireless Interface (WI) to enable illegitimate transmission through the infected WI resulting in a potential DoS attack for other WIs in the MCMC system. Moreover, HTs can be used for various other malicious purposes, including battery exhaustion, functionality subversion, and information leakage. This information when leaked to a malicious external attackercan reveals important information regarding the application suites running on the system, thereby compromising the user profile. To address persistent jamming-based DoS attack in WiNiP, in this dissertation, a secure WiNiP interconnection architecture for MCMC systems has been proposed that re-uses the one-to-many traffic-aware MAC and existing Design for Testability (DFT) hardware along with Machine Learning (ML) approach. Furthermore, a novel Simulated Annealing (SA)-based routing obfuscation mechanism was also proposed toprotect against an HT-assisted novel traffic analysis attack. Simulation results show that,the ML classifiers can achieve an accuracy of 99.87% for DoS attack detection while SA-basedrouting obfuscation could reduce application detection accuracy to only 15% for HT-assistedtraffic analysis attack and hence, secure the WiNiP fabric from age-old and emerging attacks

On Fault Resilient Network-on-Chip for Many Core Systems

Rapid scaling of transistor gate sizes has increased the density of on-chip integration and paved the way for heterogeneous many-core systems-on-chip, significantly improving the speed of on-chip processing. The design of the interconnection network of these complex systems is a challenging one and the network-on-chip (NoC) is now the accepted scalable and bandwidth efficient interconnect for multi-processor systems on-chip (MPSoCs). However, the performance enhancements of technology scaling come at the cost of reliability as on-chip components particularly the network-on-chip become increasingly prone to faults. In this thesis, we focus on approaches to deal with the errors caused by such faults. The results of these approaches are obtained not only via time-consuming cycle-accurate simulations but also by analytical approaches, allowing for faster and accurate evaluations, especially for larger networks. Redundancy is the general approach to deal with faults, the mode of which varies according to the type of fault. For the NoC, there exists a classification of faults into transient, intermittent and permanent faults. Transient faults appear randomly for a few cycles and may be caused by the radiation of particles. Intermittent faults are similar to transient faults, however, differing in the fact that they occur repeatedly at the same location, eventually leading to a permanent fault. Permanent faults by definition are caused by wires and transistors being permanently short or open. Generally, spatial redundancy or the use of redundant components is used for dealing with permanent faults. Temporal redundancy deals with failures by re-execution or by retransmission of data while information redundancy adds redundant information to the data packets allowing for error detection and correction. Temporal and information redundancy methods are useful when dealing with transient and intermittent faults. In this dissertation, we begin with permanent faults in NoC in the form of faulty links and routers. Our approach for spatial redundancy adds redundant links in the diagonal direction to the standard rectangular mesh topology resulting in the hexagonal and octagonal NoCs. In addition to redundant links, adaptive routing must be used to bypass faulty components. We develop novel fault-tolerant deadlock-free adaptive routing algorithms for these topologies based on the turn model without the use of virtual channels. Our results show that the hexagonal and octagonal NoCs can tolerate all 2-router and 3-router faults, respectively, while the mesh has been shown to tolerate all 1-router faults. To simplify the restricted-turn selection process for achieving deadlock freedom, we devised an approach based on the channel dependency matrix instead of the state-of-the-art Duato's method of observing the channel dependency graph for cycles. The approach is general and can be used for the turn selection process for any regular topology. We further use algebraic manipulations of the channel dependency matrix to analytically assess the fault resilience of the adaptive routing algorithms when affected by permanent faults. We present and validate this method for the 2D mesh and hexagonal NoC topologies achieving very high accuracy with a maximum error of 1%. The approach is very general and allows for faster evaluations as compared to the generally used cycle-accurate simulations. In comparison, existing works usually assume a limited number of faults to be able to analytically assess the network reliability. We apply the approach to evaluate the fault resilience of larger NoCs demonstrating the usefulness of the approach especially compared to cycle-accurate simulations. Finally, we concentrate on temporal and information redundancy techniques to deal with transient and intermittent faults in the router resulting in the dropping and hence loss of packets. Temporal redundancy is applied in the form of ARQ and retransmission of lost packets. Information redundancy is applied by the generation and transmission of redundant linear combinations of packets known as random linear network coding. We develop an analytic model for flexible evaluation of these approaches to determine the network performance parameters such as residual error rates and increased network load. The analytic model allows to evaluate larger NoCs and different topologies and to investigate the advantage of network coding compared to uncoded transmissions. We further extend the work with a small insight to the problem of secure communication over the NoC. Assuming large heterogeneous MPSoCs with components from third parties, the communication is subject to active attacks in the form of packet modification and drops in the NoC routers. Devising approaches to resolve these issues, we again formulate analytic models for their flexible and accurate evaluations, with a maximum estimation error of 7%

High-level services for networks-on-chip

Future technology trends envision that next-generation Multiprocessors Systems-on- Chip (MPSoCs) will be composed of a combination of a large number of processing and storage elements interconnected by complex communication architectures. Communication and interconnection between these basic blocks play a role of crucial importance when the number of these elements increases. Enabling reliable communication channels between cores becomes therefore a challenge for system designers. Networks-on-Chip (NoCs) appeared as a strategy for connecting and managing the communication between several design elements and IP blocks, as required in complex Systems-on-Chip (SoCs). The topic can be considered as a multidisciplinary synthesis of multiprocessing, parallel computing, networking, and on- chip communication domains. Networks-on-Chip, in addition to standard communication services, can be employed for providing support for the implementation of system-level services. This dissertation will demonstrate how high-level services can be added to an MPSoC platform by embedding appropriate hardware/software support in the network interfaces (NIs) of the NoC. In this dissertation, the implementation of innovative modules acting in parallel with protocol translation and data transmission in NIs is proposed and evaluated. The modules can support the execution of the high-level services in the NoC at a relatively low cost in terms of area and energy consumption. Three types of services will be addressed and discussed: security, monitoring, and fault tolerance. With respect to the security aspect, this dissertation will discuss the implementation of an innovative data protection mechanism for detecting and preventing illegal accesses to protected memory blocks and/or memory mapped peripherals. The second aspect will be addressed by proposing the implementation of a monitoring system based on programmable multipurpose monitoring probes aimed at detecting NoC internal events and run-time characteristics. As last topic, new architectural solutions for the design of fault tolerant network interfaces will be presented and discussed

Methodologies and Toolflows for the Predictable Design of Reliable and Low-Power NoCs

There is today the unmistakable need to evolve design methodologies and tool ows for Network-on-Chip based embedded systems. In particular, the quest for low-power requirements is nowadays a more-than-ever urgent dilemma. Modern circuits feature billion of transistors, and neither power management techniques nor batteries capacity are able to endure the increasingly higher integration capability of digital devices. Besides, power concerns come together with modern nanoscale silicon technology design issues. On one hand, system failure rates are expected to increase exponentially at every technology node when integrated circuit wear-out failure mechanisms are not compensated for. However, error detection and/or correction mechanisms have a non-negligible impact on the network power. On the other hand, to meet the stringent time-to-market deadlines, the design cycle of such a distributed and heterogeneous architecture must not be prolonged by unnecessary design iterations. Overall, there is a clear need to better discriminate reliability strategies and interconnect topology solutions upfront, by ranking designs based on power metric. In this thesis, we tackle this challenge by proposing power-aware design technologies. Finally, we take into account the most aggressive and disruptive methodology for embedded systems with ultra-low power constraints, by migrating NoC basic building blocks to asynchronous (or clockless) design style. We deal with this challenge delivering a standard cell design methodology and mainstream CAD tool ows, in this way partially relaxing the requirement of using asynchronous blocks only as hard macros