Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications

Large scale data centers (DC) and high performance computing (HPC) systems require more and more computing power at higher energy efficiency. They are already consuming megawatts of power, and a linear extrapolation of trends reveals that they may eventually lead to unrealistic power consumption scenarios in order to satisfy future requirements (e.g., Exascale computing). Conventional complementary metal oxide semiconductor (CMOS)-based electronic interconnects are not expected to keep up with the envisioned future board-to-board and chip-to-chip (within multi-chip-modules) interconnect requirements because of bandwidth-density and power-consumption limitations. However, low-power and high-speed optics-based interconnects are emerging as alternatives for DC and HPC communications; they offer unique opportunities for continued energy-efficiency and bandwidth-density improvements, although cost is a challenge at the shortest length scales. Plasmonics-based interconnects on the other hand, due to their extremely small size, offer another interesting solution for further scaling operational speed and energy efficiency. At the device-level, CMOS compatibility is also an important issue, since ultimately photonics or plasmonics will have to be co-integrated with electronics. In this paper, we survey the available literature and compare the aforementioned interconnect technologies, with respect to their suitability for high-speed and energy-efficient on-chip and offchip communications. This paper refers to relatively short links with potential applications in the following interconnect distance hierarchy: local group of racks, board to board, module to module, chip to chip, and on chip connections. We compare different interconnect device modules, including low-energy output devices (such as lasers, modulators, and LEDs), photodetectors, passive devices (i.e., waveguides and couplers) and electrical circuitry (such as laserdiode drivers, modulator drivers, transimpedance, and limiting amplifiers). We show that photonic technologies have the potential to meet the requirements for selected HPC and DC applications in a shorter term. We also present that plasmonic interconnect modules could offer ultra-compact active areas, leading to high integration bandwidth densities, and low device capacitances allowing for ultra-high bandwidth operation that would satisfy the application requirements further into the future

National Energy Research Scientific Computing Center 2007 Annual Report

This report presents highlights of the research conducted on NERSC computers in a variety of scientific disciplines during the year 2007. It also reports on changes and upgrades to NERSC's systems and services aswell as activities of NERSC staff

The computational and energy cost of simulation and storage for climate science: lessons from CMIP6

The Coupled Model Intercomparison Project (CMIP) is one of the biggest international efforts aimed at better understanding the past, present, and future of climate changes in a multi-model context. A total of 21 model intercomparison projects (MIPs) were endorsed in its sixth phase (CMIP6), which included 190 different experiments that were used to simulate 40 000 years and produced around 40 PB of data in total. This paper presents the main findings obtained from the CPMIP (the Computational Performance Model Intercomparison Project), a collection of a common set of metrics, specifically designed for assessing climate model performance. These metrics were exclusively collected from the production runs of experiments used in CMIP6 and primarily from institutions within the IS-ENES3 consortium. The document presents the full set of CPMIP metrics per institution and experiment, including a detailed analysis and discussion of each of the measurements. During the analysis, we found a positive correlation between the core hours needed, the complexity of the models, and the resolution used. Likewise, we show that between 5 %–15 % of the execution cost is spent in the coupling between independent components, and it only gets worse by increasing the number of resources. From the data, it is clear that queue times have a great impact on the actual speed achieved and have a huge variability across different institutions, ranging from none to up to 78 % execution overhead. Furthermore, our evaluation shows that the estimated carbon footprint of running such big simulations within the IS-ENES3 consortium is 1692 t of CO2 equivalent. As a result of the collection, we contribute to the creation of a comprehensive database for future community reference, establishing a benchmark for evaluation and facilitating the multi-model, multi-platform comparisons crucial for understanding climate modelling performance. Given the diverse range of applications, configurations, and hardware utilised, further work is required for the standardisation and formulation of general rules. The paper concludes with recommendations for future exercises aimed at addressing the encountered challenges which will facilitate more collections of a similar nature

XSEDE: eXtreme Science and Engineering Discovery Environment Third Quarter 2012 Report

The Extreme Science and Engineering Discovery Environment (XSEDE) is the most advanced, powerful, and robust collection of integrated digital resources and services in the world. It is an integrated cyberinfrastructure ecosystem with singular interfaces for allocations, support, and other key services that researchers can use to interactively share computing resources, data, and expertise.This a report of project activities and highlights from the third quarter of 2012.National Science Foundation, OCI-105357

Understanding Quantum Technologies 2022

Understanding Quantum Technologies 2022 is a creative-commons ebook that provides a unique 360 degrees overview of quantum technologies from science and technology to geopolitical and societal issues. It covers quantum physics history, quantum physics 101, gate-based quantum computing, quantum computing engineering (including quantum error corrections and quantum computing energetics), quantum computing hardware (all qubit types, including quantum annealing and quantum simulation paradigms, history, science, research, implementation and vendors), quantum enabling technologies (cryogenics, control electronics, photonics, components fabs, raw materials), quantum computing algorithms, software development tools and use cases, unconventional computing (potential alternatives to quantum and classical computing), quantum telecommunications and cryptography, quantum sensing, quantum technologies around the world, quantum technologies societal impact and even quantum fake sciences. The main audience are computer science engineers, developers and IT specialists as well as quantum scientists and students who want to acquire a global view of how quantum technologies work, and particularly quantum computing. This version is an extensive update to the 2021 edition published in October 2021.Comment: 1132 pages, 920 figures, Letter forma