Novel High Performance Ultra Low Power Static Random Access Memories (SRAMs) Based on Next Generation Technologies

Title from PDF of title page viewed January 27, 2021Dissertation advisor: Masud H. ChowdhuryVitaIncludes bibliographical references (page 107-120)Thesis (Ph.D.)--School of Computing and Engineering. University of Missouri--Kansas City, 2019Next Big Thing Is Surely Small: Nanotechnology Can Bring Revolution. Nanotechnology leads the world towards many new applications in various fields of computing, communication, defense, entertainment, medical, renewable energy and environment. These nanotechnology applications require an energy-efficient memory system to compute and process. Among all the memories, Static Random Access Memories (SRAMs) are high performance memories and occupies more than 50% of any design area. Therefore, it is critical to design high performance and energy-efficient SRAM design. Ultra low power and high speed applications require a new generation memory capable of operating at low power as well as low execution time. In this thesis, a novel 8T SRAM design is proposed that offers significantly faster access time and lowers energy consumption along with better read stability and write ability. The proposed design can be used in the conventional SRAM as well as in computationally intensive applications like neural networks and machine learning classifiers [1]-[4]. Novel 8T SRAM design offers higher energy efficiency, reliability, robustness and performance compared to the standard 6T and other existing 8T and 9T designs. It offers the advantages of a 10T SRAM without the additional area, delay and power overheads of the 10T SRAM. The proposed 8T SRAM would be able to overcome many other limitations of the conventional 6T and other 7T, 8T and 9T designs. The design employs single bitline for the write operation, therefore the number of write drivers are reduced. The defining feature of the proposed 8T SRAM is its hybrid design, which is the combination of two techniques: (i) the utilization of single-ended bitline and (ii) the utilization of virtual ground. The single-ended bitline technique ensures separate read and write operations, which eventually reduces the delay and power consumption during the read and write operations. It's independent read and write paths allow the use of the minimum sized access transistors and aid in a disturb-free read operation. The virtual ground weakens the positive feedback in the SRAM cell and improves its write ability. The virtual ground technique is also used to reduce leakages. The proposed design does not require precharging the bitlines for the read operation, which reduces the area and power overheads of the memory system by eliminating the precharging circuit. The design isolates the storage node from the read path, which improves the read stability. For reliability study, we have investigated the static noise margin (SNM) of the proposed 8T SRAM, for which, we have used two methods – (i) the traditional SNM method with the butterfly curve, (ii) the N-curve method A comparative analysis is performed between the proposed and the existing SRAM designs in terms of area, total power consumption during the read and write operations, and stability and reliability. All these advantages make the proposed 8T SRAM design an ideal candidate for the conventional and computationally intensive applications like machine learning classifier and deep learning neural network. In addition to this, there is need for next generation technologies to design SRAM memory because the conventional CMOS technology is approaching its physical and performance boundaries and as a consequence, becoming incompatible with ultra-low-power applications. Emerging devices such as Tunnel Field Effect Transistor (TFET)) and Graphene Nanoribbon Field Effect Transistor (GNRFET) devices are highly potential candidates to overcome the limitations of MOSFET because of their ability to achieve subthreshold slopes below 60 mV/decade and very low leakage currents [6]-[9]. This research also explores novel TFET and GNRFET based 6T SRAM. The thesis evaluates the standby leakage power in the Tunnel FET (TFET) based 6T SRAM cell for different pull-up, pull-down, and pass-gate transistors ratios (PU: PD: PG) and compared to 10nm FinFET based 6T SRAM designs. It is observed that the 10nm TFET based SRAMs have 107.57%, 163.64%, and 140.44% less standby leakage power compared to the 10nm FinFET based SRAMs when the PU: PD: PG ratios are 1:1:1, 1:5:2 and 2:5:2, respectively. The thesis also presents an analysis of the stability and reliability of sub-10nm TFET based 6T SRAM circuit with a reduced supply voltage of 500mV. The static noise margin (SNM), which is a critical measure of SRAM stability and reliability, is determined for hold, read and write operations of the 6T TFET SRAM cell. The robustness of the optimized TFET based 6T SRAM circuit is also evaluated at different supply voltages. Simulations were done in HSPICE and Cadence tools. From the analysis, it is clear that the main advantage of the TFET based SRAM would be the significant improvement in terms of leakage or standby power consumption. Compared to the FinFET based SRAM the standby leakage power of the T-SRAMs are 107.57%, 163.64%, and 140.44% less for 1:1:1, 1:5:2 and 2:5:2 configurations, respectively. Since leakage/standby power is the primary source of power consumption in the SRAM, and the overall system energy efficiency depends on SRAM power consumption, TFET based SRAM would lead to massive improvement of the energy efficiency of the system. Therefore, T-SRAMs are more suitable for ultra-low power applications. In addition to this, the thesis evaluates the standby leakage power of types of Graphene Nanoribbon FETs based 6T SRAM bitcell and compared to 10nm FinFET based 6T SRAM bitcell. It is observed that the 10nm MOS type GNRFET based SRAMs have 16.43 times less standby leakage power compared to the 10nm FinFET based SRAMs. The double gate SB-GNRFET based SRAM consumes 1.35E+03 times less energy compared to the 10nm FinFET based SRAM during write. However, during read double gate SB-GNRFET based SRAM consume 15 times more energy than FinFET based SRAM. It is also observed that GNRFET based SRAMs are more stable and reliable than FinFET based SRAM.Introduction -- Background -- Novel High Performance Ultra Low Power SRAM Design -- Tunnel FET Based SRAM Design -- Graphene Nanoribbon FET Based SRAM Design -- Double-gate FDSOI Based SRAM Designs -- Novel CNTFET and MEMRISTOR Based Digital Designs -- Conclusio

Imperfection-Aware Design of CNFET Digital VLSI Circuits

Carbon nanotube field-effect transistor (CNFET) is one of the promising candidates as extensions to silicon CMOS devices. The CNFET, which is a 1-D structure with a near-ballistic transport capability, can potentially offer excellent device characteristics and order-of-magnitude better energy-delay product over standard CMOS devices. Significant challenges in CNT synthesis prevent CNFETs today from achieving such ideal benefits. CNT density variation and metallic CNTs are the dominant type of CNT variations/imperfections that cause performance variation, large static power consumption, and yield degradation. We present an imperfection-aware design technique for CNFET digital VLSI circuits by: 1) Analytical models that are developed to analyze and quantify the effects of CNT density variation on device characteristics, gate and system levels delays. The analytical models, which were validated by comparison to real experimental/simulation data, enables us to examine the space of CNFET combinational, sequential and memory cells circuits to minimize delay variations. Using these model, we drive CNFET processing and circuit design guidelines to manage/overcome CNT density variation. 2) Analytical models that are developed to analyze the effects of metallic CNTs on device characteristics, gate and system levels delay and power consumption. Using our presented analytical models, which are again validated by comparison with simulation data, it is shown that the static power dissipation is a more critical issue than the delay and the dynamic power of CNFET circuits in the presence of m-CNTs. 3) CNT density variation and metallic CNTs can result in functional failure of CNFET circuits. The complete and compact model for CNFET probability of failure that consider CNT density variation and m-CNTs is presented. This analytical model is applied to analyze the logical functional failures. The presented model is extended to predict opportunities and limitations of CNFET technology at todays Gigascale integration and beyond.\u2

Variability and reliability analysis of carbon nanotube technology in the presence of manufacturing imperfections

In 1925, Lilienfeld patented the basic principle of field effect transistor (FET). Thirty-four years later, Kahng and Atalla invented the MOSFET. Since that time, it has become the most widely used type of transistor in Integrated Circuits (ICs) and then the most important device in the electronics industry. Progress in the field for at least the last 40 years has followed an exponential behavior in accordance with Moore¿s Law. That is, in order to achieve higher densities and performance at lower power consumption, MOS devices have been scaled down. But this aggressive scaling down of the physical dimensions of MOSFETs has required the introduction of a wide variety of innovative factors to ensure that they could still be properly manufactured. Transistors have expe- rienced an amazing journey in the last 10 years starting with strained channel CMOS transistors at 90nm, carrying on the introduction of the high-k/metal-gate silicon CMOS transistors at 45nm until the use of the multiple-gate transistor architectures at 22nm and at recently achieved 14nm technology node. But, what technology will be able to produce sub-10nm transistors? Different novel materials and devices are being investigated. As an extension and enhancement to current MOSFETs some promising devices are n-type III-V and p-type Germanium FETs, Nanowire and Tunnel FETs, Graphene FETs and Carbon Nanotube FETs. Also, non-conventional FETs and other charge-based information carrier devices and alternative information processing devices are being studied. This thesis is focused on carbon nanotube technology as a possible option for sub-10nm transistors. In recent years, carbon nanotubes (CNTs) have been attracting considerable attention in the field of nanotechnology. They are considered to be a promising substitute for silicon channel because of their small size, unusual geometry (1D structure), and extraordinary electronic properties, including excellent carrier mobility and quasi-ballistic transport. In the same way, carbon nanotube field-effect transistors (CNFETs) could be potential substitutes for MOSFETs. Ideal CNFETs (meaning all CNTs in the transistor behave as semiconductors, have the same diameter and doping level, and are aligned and well-positioned) are predicted to be 5x faster than silicon CMOS, while consuming the same power. However, nowadays CNFETs are also affected by manufacturing variability, and several significant challenges must be overcome before these benefits can be achieved. Certain CNFET manufacturing imperfections, such as CNT diameter and doping variations, mispositioned and misaligned CNTs, high metal-CNT contact resistance, the presence of metallic CNTs (m-CNTs), and CNT density variations, can affect CNFET performance and reliability and must be addressed. The main objective of this thesis is to analyze the impact of the current CNFET manufacturing challenges on multi-channel CNFET performance from the point of view of variability and reliability and at different levels, device and circuit level. Assuming that CNFETs are not ideal or non-homogeneous because of today CNFET manufacturing imperfections, we propose a methodology of analysis that based on a CNFET ideal compact model is able to simulate heterogeneous or non-ideal CNFETs; that is, transistors with different number of tubes that have different diameters, are not uniformly spaced, have different source/drain doping levels, and, most importantly, are made up not only of semiconducting CNTs but also metallic ones. This method will allow us to analyze how CNT-specific variations affect CNFET device characteristics and parameters and CNFET digital circuit performance. Furthermore, we also derive a CNFET failure model and propose an alternative technique based on fault-tolerant architectures to deal with the presence of m-CNTs, one of the main causes of failure in CNFET circuits

Multiple bit error correcting architectures over finite fields

This thesis proposes techniques to mitigate multiple bit errors in GF arithmetic circuits. As GF arithmetic circuits such as multipliers constitute the complex and important functional unit of a crypto-processor, making them fault tolerant will improve the reliability of circuits that are employed in safety applications and the errors may cause catastrophe if not mitigated. Firstly, a thorough literature review has been carried out. The merits of efficient schemes are carefully analyzed to study the space for improvement in error correction, area and power consumption. Proposed error correction schemes include bit parallel ones using optimized BCH codes that are useful in applications where power and area are not prime concerns. The scheme is also extended to dynamically correcting scheme to reduce decoder delay. Other method that suits low power and area applications such as RFIDs and smart cards using cross parity codes is also proposed. The experimental evaluation shows that the proposed techniques can mitigate single and multiple bit errors with wider error coverage compared to existing methods with lesser area and power consumption. The proposed scheme is used to mask the errors appearing at the output of the circuit irrespective of their cause. This thesis also investigates the error mitigation schemes in emerging technologies (QCA, CNTFET) to compare area, power and delay with existing CMOS equivalent. Though the proposed novel multiple error correcting techniques can not ensure 100% error mitigation, inclusion of these techniques to actual design can improve the reliability of the circuits or increase the difficulty in hacking crypto-devices. Proposed schemes can also be extended to non GF digital circuits

Silicon on Ferroelectric Insulator Field Effect Transistor (SOFFET): A Radical Alternative to Overcome the Thermionic Limit

Title from PDF of title page viewed January 3,2018Dissertation advisor: Masud H ChowdhuryVitaIncludes bibliographical references (pages 165-180)Thesis (Ph.D.)--School of Computing and Engineering and Department of Physics and Astronomy. University of Missouri--Kansas City, 2016The path of down-scaling traditional MOSFET is reaching its technological, economic and, most importantly, fundamental physical limits. Before the dead-end of the roadmap, it is imperative to conduct a broad research to find alternative materials and new architectures to the current technology for the MOSFET devices. Beyond silicon electronic materials like group III-V heterostructure, ferroelectric material, carbon nanotubes (CNTs), and other nanowire-based designs are in development to become the core technology for non-classical CMOS structures. Field effect transistors (FETs) in general have made unprecedented progress in the last few decades by down-scaling device dimensions and power supply level leading to extremely high numbers of devices in a single chip. High density integrated circuits are now facing major challenges related to power management and heat dissipation due to excessive leakage, mainly due to subthreshold conduction. Over the years, planar MOSFET dimensional reduction was the only process followed by the semiconductor industry to improve device performance and to reduce the power supply. Further scaling increases short-channel-effect (SCE), and off-state current makes it difficult for the industry to follow the well-known Moore’s Law with bulk devices. Therefore, scaling planar MOSFET is no longer considered as a feasible solution to extend this law. The down-scaling of metal-oxide-semiconductor field effect transistors (MOSFETs) leads to severe short-channel-effects and power leakage at large-scale integrated circuits (LSIs). The device, which is governed by the thermionic emission of the carriers injected from the source to the channel region, has set a limitation of the subthreshold swing (S) of 60 / at room temperature. Devices with ‘S’ below this limit is highly desirable to reduce the power consumption and maintaining a high / current ratio. Therefore, the future of semiconductor industry hangs on new architectures, new materials or even new physics to govern the flow of carriers in new switches. As the subthreshold swing is increasing at every technology node, new structures using SOI, multi-gate, nanowire approach, and new channel materials such as III–V semiconductor have not satisfied the targeted values of subthreshold swing. Moreover, the ultra-low-power (ULP) design required a subthreshold slope lower than the thermionic emission limit of 60 /. This value was unbreakable by the new structure (SOI FinFET). On the other hand, most of the preview proposals show the ability to go beyond this limit. However, those pre-mentioned schemes have publicized very complicated physics, design difficulties, and process non-compatibility. The objective of this research is to discuss various emerging nano-devices proposed for sub-60 mV/decade designs and their possibilities to replace the silicon devices as the core technology in the future integrated circuit. This dissertation also proposes a novel design that exploits the concept of negative capacitance. The new field-effect-transistor (FET) based on ferroelectric insulator named Silicon-On-Ferroelectric Insulator Field effect-transistor (SOFFET). This proposal is a promising methodology for future ultra low-power applications because it demonstrates the ability to replace the silicon-bulk based MOSFET, and offers a subthreshold swing significantly lower than 60 / and reduced threshold voltage to form a conducting channel. The proposed SOFFET design, which utilizes the negative capacitance of a ferroelectric insulator in the body-stack, is completely different from the FeFET and NCFET designs. In addition to having the NC effect, the proposed device will have all the advantages of an SOI device. Body-stack that we are intending in this research has many advantages over the gate-stack. First, it is more compatible with the existing processes. Second, the gate and the working area of the proposed SOFFET is like the planar MOSFET. Third, the complexity and ferroelectric material interferences are shifted to the body of the device from the gate and the working area. The proposed structure offers better scalability and superior constructability because of the high-dielectric buried insulator. Here we are providing a very simplified model for the structure. Silicon-on-ferroelectric leads to several advantages including low off-state current and shift in the threshold voltage with the decrease of the ferroelectric material thickness. Moreover, having an insulator in the body of the device increases the controllability over the channel, which leads to the reduction in the short-channel-effect (SCE). The proposed SOFFET offers low value of subthreshold swing (S) leading to better performance in the on-state. The off-state current is directly related to S. So, the off-state current is also minimum in the proposed structure.Introduction -- Subthreshold swing -- Multi-gate devices -- Tunneling field effect transistors -- I-mos & FET transistors -- Ferroelectric based field effect transistors -- An analytical model to approximate the subthreshold swing for SOI-FINFET -- Multichannel tunneling carbon nanotube FET -- Partially depleted silicon-on-Ferroelectric insulator FET -- Fully depleted silicon-on-ferroelectric insulator FET -- Advantages, manufacturing process, and future work of the proposed devices -- Appendix A. Estimation of the body factor (n) [eta] of SOI FinFET -- Appendix B. Solution for the Poisson Equation of MT-CNTFE

Multiple-Independent-Gate Field-Effect Transistors for High Computational Density and Low Power Consumption

Transistors are the fundamental elements in Integrated Circuits (IC). The development of transistors significantly improves the circuit performance. Numerous technology innovations have been adopted to maintain the continuous scaling down of transistors. With all these innovations and efforts, the transistor size is approaching the natural limitations of materials in the near future. The circuits are expected to compute in a more efficient way. From this perspective, new device concepts are desirable to exploit additional functionality. On the other hand, with the continuously increased device density on the chips, reducing the power consumption has become a key concern in IC design. To overcome the limitations of Complementary Metal-Oxide-Semiconductor (CMOS) technology in computing efficiency and power reduction, this thesis introduces the multiple- independent-gate Field-Effect Transistors (FETs) with silicon nanowires and FinFET structures. The device not only has the capability of polarity control, but also provides dual-threshold- voltage and steep-subthreshold-slope operations for power reduction in circuit design. By independently modulating the Schottky junctions between metallic source/drain and semiconductor channel, the dual-threshold-voltage characteristics with controllable polarity are achieved in a single device. This property is demonstrated in both experiments and simulations. Thanks to the compact implementation of logic functions, circuit-level benchmarking shows promising performance with a configurable dual-threshold-voltage physical design, which is suitable for low-power applications. This thesis also experimentally demonstrates the steep-subthreshold-slope operation in the multiple-independent-gate FETs. Based on a positive feedback induced by weak impact ionization, the measured characteristics of the device achieve a steep subthreshold slope of 6 mV/dec over 5 decades of current. High Ion/Ioff ratio and low leakage current are also simultaneously obtained with a good reliability. Based on a physical analysis of the device operation, feasible improvements are suggested to further enhance the performance. A physics-based surface potential and drain current model is also derived for the polarity-controllable Silicon Nanowire FETs (SiNWFETs). By solving the carrier transport at Schottky junctions and in the channel, the core model captures the operation with independent gate control. It can serve as the core framework for developing a complete compact model by integrating advanced physical effects. To summarize, multiple-independent-gate SiNWFETs and FinFETs are extensively studied in terms of fabrication, modeling, and simulation. The proposed device concept expands the family of polarity-controllable FETs. In addition to the enhanced logic functionality, the polarity-controllable SiNWFETs and FinFETs with the dual-threshold-voltage and steep-subthreshold-slope operation can be promising candidates for future IC design towards low-power applications

Dense implementations of binary cellular nonlinear networks : from CMOS to nanotechnology

This thesis deals with the design and hardware realization of the cellular neural/nonlinear network (CNN)-type processors operating on data in the form of black and white (B/W) images. The ultimate goal is to achieve a very compact yet versatile cell structure that would allow for building a network with a very large spatial resolution. It is very important to be able to implement an array with a great number of cells on a single die. Not only it improves the computational power of the processor, but it might be the enabling factor for new applications as well. Larger resolution can be achieved in two ways. First, the cell functionality and operating principles can be tailored to improve the layout compactness. The other option is to use more advanced fabrication technology – either a newer, further downscaled CMOS process or one of the emerging nanotechnologies. It can be beneficial to realize an array processor as two separate parts – one dedicated for gray-scale and the other for B/W image processing, as their designs can be optimized. For instance, an implementation of a CNN dedicated for B/W image processing can be significantly simplified. When working with binary images only, all coefficients in the template matrix can also be reduced to binary values. In this thesis, such a binary programming scheme is presented as a means to reduce the cell size as well as to provide the circuits composed of emerging nanodevices with an efficient programmability. Digital programming can be very fast and robust, and leads to very compact coefficient circuits. A test structure of a binary-programmable CNN has been designed and implemented with standard 0.18 µm CMOS technology. A single cell occupies only 155 µm2, which corresponds to a cell density of 6451 cells per square millimeter. A variety of templates have been tested and the measured chip performance is discussed. Since the minimum feature size of modern CMOS devices has already entered the nanometer scale, and the limitations of further scaling are projected to be reached within the next decade or so, more and more interest and research activity is attracted by nanotechnology. Investigation of the quantum physics phenomena and development of new devices and circuit concepts, which would allow to overcome the CMOS limitations, is becoming an increasingly important science. A single-electron tunneling (SET) transistor is one of the most attractive nanodevices. While relying on the Coulomb interactions, these devices can be connected directly with a wire or through a coupling capacitance. To develop suitable structures for implementing the binary programming scheme with capacitive couplings, the CNN cell based on the floating gate MOSFET (FG-MOSFET) has been designed. This approach can be considered as a step towards a programmable cell implementation with nanodevices. Capacitively coupled CNN has been simulated and the presented results confirm the proper operation. Therefore, the same circuit strategies have also been applied to the CNN cell designed for SET technology. The cell has been simulated to work well with the binary programming scheme applied. This versatile structure can be implemented either as a pure SET design or as a SET-FET hybrid. In addition to the designs mentioned above, a number of promising nanodevices and emerging circuit architectures are introduced.reviewe

Nano-intrinsic security primitives for internet of everything

With the advent of Internet-enabled electronic devices and mobile computer systems, maintaining data security is one of the most important challenges in modern civilization. The innovation of physically unclonable functions (PUFs) shows great potential for enabling low-cost low-power authentication, anti-counterfeiting and beyond on the semiconductor chips. This is because secrets in a PUF are hidden in the randomness of the physical properties of desirably identical devices, making it extremely difficult, if not impossible, to extract them. Hence, the basic idea of PUF is to take advantage of inevitable non-idealities in the physical domain to create a system that can provide an innovative way to secure device identities, sensitive information, and their communications. While the physical variation exists everywhere, various materials, systems, and technologies have been considered as the source of unpredictable physical device variation in large scales for generating security primitives. The purpose of this project is to develop emerging solid-state memory-based security primitives and examine their robustness as well as feasibility. Firstly, the author gives an extensive overview of PUFs. The rationality, classification, and application of PUF are discussed. To objectively compare the quality of PUFs, the author formulates important PUF properties and evaluation metrics. By reviewing previously proposed constructions ranging from conventional standard complementary metal-oxide-semiconductor (CMOS) components to emerging non-volatile memories, the quality of different PUFs classes are discussed and summarized. Through a comparative analysis, emerging non-volatile redox-based resistor memories (ReRAMs) have shown the potential as promising candidates for the next generation of low-cost, low-power, compact in size, and secure PUF. Next, the author presents novel approaches to build a PUF by utilizing concatenated two layers of ReRAM crossbar arrays. Upon concatenate two layers, the nonlinear structure is introduced, and this results in the improved uniformity and the avalanche characteristic of the proposed PUF. A group of cell readout method is employed, and it supports a massive pool of challenge-response pairs of the nonlinear ReRAM-based PUF. The non-linear PUF construction is experimentally assessed using the evaluation metrics, and the quality of randomness is verified using predictive analysis. Last but not least, random telegraph noise (RTN) is studied as a source of entropy for a true random number generation (TRNG). RTN is usually considered a disadvantageous feature in the conventional CMOS designs. However, in combination with appropriate readout scheme, RTN in ReRAM can be used as a novel technique to generate quality random numbers. The proposed differential readout-based design can maintain the quality of output by reducing the effect of the undesired noise from the whole system, while the controlling difficulty of the conventional readout method can be significantly reduced. This is advantageous as the differential readout circuit can embrace the resistance variation features of ReRAMs without extensive pre-calibration. The study in this thesis has the potential to enable the development of cost-efficient and lightweight security primitives that can be integrated into modern computer mobile systems and devices for providing a high level of security

Deposição de filmes do diamante para dispositivos electrónicos

This PhD thesis presents details about the usage of diamond in electronics. It presents a review of the properties of diamond and the mechanisms of its growth using hot filament chemical vapour deposition (HFCVD). Presented in the thesis are the experimental details and discussions that follow from it about the optimization of the deposition technique and the growth of diamond on various electronically relevant substrates. The discussions present an analysis of the parameters typically involved in the HFCVD, particularly the pre-treatment that the substrates receive- namely, the novel nucleation procedure (NNP), as well as growth temperatures and plasma chemistry and how they affect the characteristics of the thus-grown films. Extensive morphological and spectroscopic analysis has been made in order to characterise these films.Este trabalho discute a utilização de diamante em aplicações electrónicas. É apresentada uma revisão detalhada das propriedades de diamante e dos respectivos mecanismos de crescimento utilizando deposição química a partir da fase vapor com filament quente (hot filament chemical vapour deposition - HFCVD). Os detalhes experimentais relativos à otimização desta técnica tendo em vista o crescimento de diamante em vários substratos com relevância em eletrónica são apresentados e discutidos com detalhe. A discussão inclui a análise dos parâmetros tipicamente envolvidos em HFCVD, em particular do pré-tratamento que o substrato recebe e que é conhecido na literatura como "novel nucleation procedure" (NNP), assim como das temperaturas de crescimento e da química do plasma, bem como a influência de todos estes parâmetros nas características finais dos filmes. A caracterização morfológica dos filmes envolveu técnicas de microscopia e espetroscopia.Programa Doutoral em Engenharia Eletrotécnic