706 research outputs found
Optical scanning tests of complex CMOS microcircuits
The new test method was based on the use of a raster-scanned optical stimulus in combination with special electrical test procedures. The raster-scanned optical stimulus was provided by an optical spot scanner, an instrument that combines a scanning optical microscope with electronic instrumentation to process and display the electric photoresponse signal induced in a device that is being tested
Digital implementation of the cellular sensor-computers
Two different kinds of cellular sensor-processor architectures are used nowadays in various
applications. The first is the traditional sensor-processor architecture, where the sensor and the
processor arrays are mapped into each other. The second is the foveal architecture, in which a
small active fovea is navigating in a large sensor array. This second architecture is introduced
and compared here. Both of these architectures can be implemented with analog and digital
processor arrays. The efficiency of the different implementation types, depending on the used
CMOS technology, is analyzed. It turned out, that the finer the technology is, the better to use
digital implementation rather than analog
Rapid mapping of digital integrated circuit logic gates via multi-spectral backside imaging
Modern semiconductor integrated circuits are increasingly fabricated at
untrusted third party foundries. There now exist myriad security threats of
malicious tampering at the hardware level and hence a clear and pressing need
for new tools that enable rapid, robust and low-cost validation of circuit
layouts. Optical backside imaging offers an attractive platform, but its
limited resolution and throughput cannot cope with the nanoscale sizes of
modern circuitry and the need to image over a large area. We propose and
demonstrate a multi-spectral imaging approach to overcome these obstacles by
identifying key circuit elements on the basis of their spectral response. This
obviates the need to directly image the nanoscale components that define them,
thereby relaxing resolution and spatial sampling requirements by 1 and 2 - 4
orders of magnitude respectively. Our results directly address critical
security needs in the integrated circuit supply chain and highlight the
potential of spectroscopic techniques to address fundamental resolution
obstacles caused by the need to image ever shrinking feature sizes in
semiconductor integrated circuits
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