Automation of Determination of Optimal Intra-Compute Node Parallelism

Maximizing the productivity of modern multicore and manycore chips requires optimizing parallelism at the compute node level. This is, however, a complex multi-step process. It is an iterative method requiring determining optimal degrees of parallel scalability and optimizing memory access behavior. Further, there are multiple cases to be considered, programs which use only MPI or OpenMP and hybrid (MPI +OpenMP) programs. This paper presents a set of three coordinated workflows for determining the optimal parallelism at the program level for MPI programs and at the loop level for hybrid (MPI+OpenMP) cases. The paper also details mostly automated implementations of these workflows using the PerfExpert infrastructure. Finally the paper presents case studies demonstrating both the applicability and the effectiveness of optimizing parallelism at the compute node level. The results shown in the paper will provide valuable information to further advance in the full automation of the workflows. The software implementing the parallelism scalability optimization is open source and available for download.Texas Advanced Computing Center (TACC)Computer Science

Power efficient job scheduling by predicting the impact of processor manufacturing variability

Modern CPUs suffer from performance and power consumption variability due to the manufacturing process. As a result, systems that do not consider such variability caused by manufacturing issues lead to performance degradations and wasted power. In order to avoid such negative impact, users and system administrators must actively counteract any manufacturing variability. In this work we show that parallel systems benefit from taking into account the consequences of manufacturing variability when making scheduling decisions at the job scheduler level. We also show that it is possible to predict the impact of this variability on specific applications by using variability-aware power prediction models. Based on these power models, we propose two job scheduling policies that consider the effects of manufacturing variability for each application and that ensure that power consumption stays under a system-wide power budget. We evaluate our policies under different power budgets and traffic scenarios, consisting of both single- and multi-node parallel applications, utilizing up to 4096 cores in total. We demonstrate that they decrease job turnaround time, compared to contemporary scheduling policies used on production clusters, up to 31% while saving up to 5.5% energy.Postprint (author's final draft

Automated Hardware Prototyping for 3D Network on Chips

Vor mehr als 50 Jahren stellte Intel® Mitbegründer Gordon Moore eine Prognose zum Entwicklungsprozess der Transistortechnologie auf. Er prognostizierte, dass sich die Zahl der Transistoren in integrierten Schaltungen alle zwei Jahre verdoppeln wird. Seine Aussage ist immer noch gültig, aber ein Ende von Moores Gesetz ist in Sicht. Mit dem Ende von Moore’s Gesetz müssen neue Aspekte untersucht werden, um weiterhin die Leistung von integrierten Schaltungen zu steigern. Zwei mögliche Ansätze für "More than Moore” sind 3D-Integrationsverfahren und heterogene Systeme. Gleichzeitig entwickelt sich ein Trend hin zu Multi-Core Prozessoren, basierend auf Networks on chips (NoCs). Neben dem Ende des Mooreschen Gesetzes ergeben sich bei immer kleiner werdenden Technologiegrößen, vor allem jenseits der 60 nm, neue Herausforderungen. Eine Schwierigkeit ist die Wärmeableitung in großskalierten integrierten Schaltkreisen und die daraus resultierende Überhitzung des Chips. Um diesem Problem in modernen Multi-Core Architekturen zu begegnen, muss auch die Verlustleistung der Netzwerkressourcen stark reduziert werden. Diese Arbeit umfasst eine durch Hardware gesteuerte Kombination aus Frequenzskalierung und Power Gating für 3D On-Chip Netzwerke, einschließlich eines FPGA Prototypen. Dafür wurde ein Takt-synchrones 2D Netzwerk auf ein dreidimensionales asynchrones Netzwerk mit mehreren Frequenzbereichen erweitert. Zusätzlich wurde ein skalierbares Online-Power-Management System mit geringem Ressourcenaufwand entwickelt. Die Verifikation neuer Hardwarekomponenten ist einer der zeitaufwendigsten Schritte im Entwicklungsprozess hochintegrierter digitaler Schaltkreise. Um diese Aufgabe zu beschleunigen und um eine parallele Softwareentwicklung zu ermöglichen, wurde im Rahmen dieser Arbeit ein automatisiertes und benutzerfreundliches Tool für den Entwurf neuer Hardware Projekte entwickelt. Eine grafische Benutzeroberfläche zum Erstellen des gesamten Designablaufs, vom Erstellen der Architektur, Parameter Deklaration, Simulation, Synthese und Test ist Teil dieses Werkzeugs. Zudem stellt die Größe der Architektur für die Erstellung eines Prototypen eine besondere Herausforderung dar. Frühere Arbeiten haben es versäumt, eine schnelles und unkompliziertes Prototyping, insbesondere von Architekturen mit mehr als 50 Prozessorkernen, zu realisieren. Diese Arbeit umfasst eine Design Space Exploration und FPGA-basierte Prototypen von verschiedenen 3D-NoC Implementierungen mit mehr als 80 Prozessoren

Deep Space Network information system architecture study

The purpose of this article is to describe an architecture for the Deep Space Network (DSN) information system in the years 2000-2010 and to provide guidelines for its evolution during the 1990s. The study scope is defined to be from the front-end areas at the antennas to the end users (spacecraft teams, principal investigators, archival storage systems, and non-NASA partners). The architectural vision provides guidance for major DSN implementation efforts during the next decade. A strong motivation for the study is an expected dramatic improvement in information-systems technologies, such as the following: computer processing, automation technology (including knowledge-based systems), networking and data transport, software and hardware engineering, and human-interface technology. The proposed Ground Information System has the following major features: unified architecture from the front-end area to the end user; open-systems standards to achieve interoperability; DSN production of level 0 data; delivery of level 0 data from the Deep Space Communications Complex, if desired; dedicated telemetry processors for each receiver; security against unauthorized access and errors; and highly automated monitor and control

TechNews digests: Jan - Mar 2010

TechNews is a technology, news and analysis service aimed at anyone in the education sector keen to stay informed about technology developments, trends and issues. TechNews focuses on emerging technologies and other technology news. TechNews service : digests september 2004 till May 2010 Analysis pieces and News combined publish every 2 to 3 month

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5 D, and 3D Processor-Memory Systems

Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation, memory access remains a significant problem for processors. Therefore, processor thermal management continues to be an active research topic. Most thermal management research takes place using simulations, given the challenges of measuring temperature in real processors. Since core and memory are fabricated on separate packages in most existing processors, with the memory having lower power densities, thermal management research in processors has primarily focused on the cores. Memory bandwidth limitations associated with 2D processors lead to high-density 2.5D and 3D packaging technology. 2.5D packaging places cores and memory on the same package. 3D packaging technology takes it further by stacking layers of memory on the top of cores themselves. Such packagings significantly increase the power density, making processors prone to heating. Therefore, mitigating thermal issues in high-density processors (packaged with stacked memory) becomes an even more pressing problem. However, given the lack of thermal modeling for memories in existing interval thermal simulation toolchains, they are unsuitable for studying thermal management for high-density processors. To address this issue, we present CoMeT, the first integrated Core and Memory interval Thermal simulation toolchain. CoMeT comprehensively supports thermal simulation of high- and low-density processors corresponding to four different core-memory configurations - off-chip DDR memory, off-chip 3D memory, 2.5D, and 3D. CoMeT supports several novel features that facilitate overlying system research. Compared to an equivalent state-of-the-art core-only toolchain, CoMeT adds only a ~5% simulation-time overhead. The source code of CoMeT has been made open for public use under the MIT license.Comment: https://github.com/marg-tools/CoMe