Reliability in the face of variability in nanometer embedded memories

In this thesis, we have investigated the impact of parametric variations on the behaviour of one performance-critical processor structure - embedded memories. As variations manifest as a spread in power and performance, as a first step, we propose a novel modeling methodology that helps evaluate the impact of circuit-level optimizations on architecture-level design choices. Choices made at the design-stage ensure conflicting requirements from higher-levels are decoupled. We then complement such design-time optimizations with a runtime mechanism that takes advantage of adaptive body-biasing to lower power whilst improving performance in the presence of variability. Our proposal uses a novel fully-digital variation tracking hardware using embedded DRAM (eDRAM) cells to monitor run-time changes in cache latency and leakage. A special fine-grain body-bias generator uses the measurements to generate an optimal body-bias that is needed to meet the required yield targets. A novel variation-tolerant and soft-error hardened eDRAM cell is also proposed as an alternate candidate for replacing existing SRAM-based designs in latency critical memory structures. In the ultra low-power domain where reliable operation is limited by the minimum voltage of operation (Vddmin), we analyse the impact of failures on cache functional margin and functional yield. Towards this end, we have developed a fully automated tool (INFORMER) capable of estimating memory-wide metrics such as power, performance and yield accurately and rapidly. Using the developed tool, we then evaluate the #effectiveness of a new class of hybrid techniques in improving cache yield through failure prevention and correction. Having a holistic perspective of memory-wide metrics helps us arrive at design-choices optimized simultaneously for multiple metrics needed for maintaining lifetime requirements

Design of robust spin-transfer torque magnetic random access memories for ultralow power high performance on-chip cache applications

Spin-transfer torque magnetic random access memories (STT-MRAMs) based on magnetic tunnel junction (MTJ) has become the leading candidate for future universal memory technology due to its potential for low power, non-volatile, high speed and extremely good endurance. However, conflicting read and write requirements exist in STT-MRAM technology because the current path during read and write operations are the same. Read and write failures of STT-MRAMs are degraded further under process variations. The focus of this dissertation is to optimize the yield of STT- MRAMs under process variations by employing device-circuit-architecture co-design techniques. A devices-to-systems simulation framework was developed to evaluate the effectiveness of the techniques proposed in this dissertation. An optimization methodology for minimizing the failure probability of 1T-1MTJ STT-MRAM bit-cell by proper selection of bit-cell configuration and access transistor sizing is also proposed. A failure mitigation technique using assistsin 1T-1MTJ STT-MRAM bit-cells is also proposed and discussed. Assist techniques proposed in this dissertation to mitigate write failures either increase the amount of current available to switch the MTJ during write or decrease the required current to switch the MTJ. These techniques achieve significant reduction in bit-cell area and write power with minimal impact on bit-cell failure probability and read power. However, the proposed write assist techniques may be less effective in scaled STT-MRAM bit-cells. Furthermore, read failures need to be overcome and hence, read assist techniques are required. It has been experimentally demonstrated that a class of materials called multiferroics can enable manipulation of magnetization using electric fields via magnetoelectric effects. A read assist technique using an MTJ structure incorporating multiferroic materials is proposed and analyzed. It was found that it is very difficult to overcome the fundamental design issues with 1T-1MTJ STT-MRAM due to the two-terminal nature of the MTJ. Hence, multi-terminal MTJ structures consisting of complementary polarized pinned layers are proposed. Analysis of the proposed MTJ structures shows significant improvement in bit-cell failures. Finally, this dissertation explores two system-level applications enabled by STT-MRAMs, and shows that device-circuit-architecture co-design of STT-MRAMs is required to fully exploit its benefits

ULTRALOW-POWER, LOW-VOLTAGE DIGITAL CIRCUITS FOR BIOMEDICAL SENSOR NODES

Ph.DDOCTOR OF PHILOSOPH

Statistical analysis and design of subthreshold operation memories

This thesis presents novel methods based on a combination of well-known statistical techniques for faster estimation of memory yield and their application in the design of energy-efficient subthreshold memories. The emergence of size-constrained Internet-of-Things (IoT) devices and proliferation of the wearable market has brought forward the challenge of achieving the maximum energy efficiency per operation in these battery operated devices. Achieving this sought-after minimum energy operation is possible under sub-threshold operation of the circuit. However, reliable memory operation is currently unattainable at these ultra-low operating voltages because of the memory circuit's vanishing noise margins which shrink further in the presence of random process variations. The statistical methods, presented in this thesis, make the yield optimization of the sub-threshold memories computationally feasible by reducing the SPICE simulation overhead. We present novel modifications to statistical sampling techniques that reduce the SPICE simulation overhead in estimating memory failure probability. These sampling scheme provides 40x reduction in finding most probable failure point and 10x reduction in estimating failure probability using the SPICE simulations compared to the existing proposals. We then provide a novel method to create surrogate models of the memory margins with better extrapolation capability than the traditional regression methods. These models, based on Gaussian process regression, encode the sensitivity of the memory margins with respect to each individual threshold variation source in a one-dimensional kernel. We find that our proposed additive kernel based models have 32% smaller out-of-sample error (that is, better extrapolation capability outside training set) than using the six-dimensional universal kernel like Radial Basis Function (RBF). The thesis also explores the topological modifications to the SRAM bitcell to achieve faster read operation at the sub-threshold operating voltages. We present a ten-transistor SRAM bitcell that achieves 2x faster read operation than the existing ten-transistor sub-threshold SRAM bitcells, while ensuring similar noise margins. The SRAM bitcell provides 70% reduction in dynamic energy at the cost of 42% increase in the leakage energy per read operation. Finally, we investigate the energy efficiency of the eDRAM gain-cells as an alternative to the SRAM bitcells in the size-constrained IoT devices. We find that reducing their write path leakage current is the only way to reduce the read energy at Minimum Energy operation Point (MEP). Further, we study the effect of transistor up-sizing under the presence of threshold voltage variations on the mean MEP read energy by performing statistical analysis based on the ANOVA test of the full-factorial experimental design.Esta tesis presenta nuevos métodos basados en una combinación de técnicas estadísticas conocidas para la estimación rápida del rendimiento de la memoria y su aplicación en el diseño de memorias de energia eficiente de sub-umbral. La aparición de los dispositivos para el Internet de las cosas (IOT) y la proliferación del mercado portátil ha presentado el reto de lograr la máxima eficiencia energética por operación de estos dispositivos operados con baterias. La eficiencia de energía es posible si se considera la operacion por debajo del umbral de los circuitos. Sin embargo, la operación confiable de memoria es actualmente inalcanzable en estos bajos niveles de voltaje debido a márgenes de ruido de fuga del circuito de memoria, los cuales se pueden reducir aún más en presencia de variaciones randomicas de procesos. Los métodos estadísticos, que se presentan en esta tesis, hacen que la optimización del rendimiento de las memorias por debajo del umbral computacionalmente factible mediante la simulación SPICE. Presentamos nuevas modificaciones a las técnicas de muestreo estadístico que reducen la sobrecarga de simulación SPICE en la estimación de la probabilidad de fallo de memoria. Estos esquemas de muestreo proporciona una reducción de 40 veces en la búsqueda de puntos de fallo más probable, y 10 veces la reducción en la estimación de la probabilidad de fallo mediante las simulaciones SPICE en comparación con otras propuestas existentes. A continuación, se proporciona un método novedoso para crear modelos sustitutos de los márgenes de memoria con una mejor capacidad de extrapolación que los métodos tradicionales de regresión. Estos modelos, basados en el proceso de regresión Gaussiano, codifican la sensibilidad de los márgenes de memoria con respecto a cada fuente de variación de umbral individual en un núcleo de una sola dimensión. Los modelos propuestos, basados en kernel aditivos, tienen un error 32% menor que el error out-of-sample (es decir, mejor capacidad de extrapolación fuera del conjunto de entrenamiento) en comparacion con el núcleo universal de seis dimensiones como la función de base radial (RBF). La tesis también explora las modificaciones topológicas a la celda binaria SRAM para alcanzar velocidades de lectura mas rapidas dentro en el contexto de operaciones en el umbral de tensiones de funcionamiento. Presentamos una celda binaria SRAM de diez transistores que consigue aumentar en 2 veces la operación de lectura en comparacion con las celdas sub-umbral de SRAM de diez transistores existentes, garantizando al mismo tiempo los márgenes de ruido similares. La celda binaria SRAM proporciona una reducción del 70% en energía dinámica a costa del aumento del 42% en la energía de fuga por las operaciones de lectura. Por último, se investiga la eficiencia energética de las células de ganancia eDRAM como una alternativa a los bitcells SRAM en los dispositivos de tamaño limitado IOT. Encontramos que la reducción de la corriente de fuga en el path de escritura es la única manera de reducir la energía de lectura en el Punto Mínimo de Energía (MEP). Además, se estudia el efecto del transistor de dimensionamiento en virtud de la presencia de variaciones de voltaje de umbral en la media de energia de lecture MEP mediante el análisis estadístico basado en la prueba de ANOVA del diseño experimental factorial completo.Postprint (published version

Robust low-power digital circuit design in nano-CMOS technologies

Device scaling has resulted in large scale integrated, high performance, low-power, and low cost systems. However the move towards sub-100 nm technology nodes has increased variability in device characteristics due to large process variations. Variability has severe implications on digital circuit design by causing timing uncertainties in combinational circuits, degrading yield and reliability of memory elements, and increasing power density due to slow scaling of supply voltage. Conventional design methods add large pessimistic safety margins to mitigate increased variability, however, they incur large power and performance loss as the combination of worst cases occurs very rarely. In-situ monitoring of timing failures provides an opportunity to dynamically tune safety margins in proportion to on-chip variability that can significantly minimize power and performance losses. We demonstrated by simulations two delay sensor designs to detect timing failures in advance that can be coupled with different compensation techniques such as voltage scaling, body biasing, or frequency scaling to avoid actual timing failures. Our simulation results using 45 nm and 32 nm technology BSIM4 models indicate significant reduction in total power consumption under temperature and statistical variations. Future work involves using dual sensing to avoid useless voltage scaling that incurs a speed loss. SRAM cache is the first victim of increased process variations that requires handcrafted design to meet area, power, and performance requirements. We have proposed novel 6 transistors (6T), 7 transistors (7T), and 8 transistors (8T)-SRAM cells that enable variability tolerant and low-power SRAM cache designs. Increased sense-amplifier offset voltage due to device mismatch arising from high variability increases delay and power consumption of SRAM design. We have proposed two novel design techniques to reduce offset voltage dependent delays providing a high speed low-power SRAM design. Increasing leakage currents in nano-CMOS technologies pose a major challenge to a low-power reliable design. We have investigated novel segmented supply voltage architecture to reduce leakage power of the SRAM caches since they occupy bulk of the total chip area and power. Future work involves developing leakage reduction methods for the combination logic designs including SRAM peripherals

Circuits and Systems Advances in Near Threshold Computing

Modern society is witnessing a sea change in ubiquitous computing, in which people have embraced computing systems as an indispensable part of day-to-day existence. Computation, storage, and communication abilities of smartphones, for example, have undergone monumental changes over the past decade. However, global emphasis on creating and sustaining green environments is leading to a rapid and ongoing proliferation of edge computing systems and applications. As a broad spectrum of healthcare, home, and transport applications shift to the edge of the network, near-threshold computing (NTC) is emerging as one of the promising low-power computing platforms. An NTC device sets its supply voltage close to its threshold voltage, dramatically reducing the energy consumption. Despite showing substantial promise in terms of energy efficiency, NTC is yet to see widescale commercial adoption. This is because circuits and systems operating with NTC suffer from several problems, including increased sensitivity to process variation, reliability problems, performance degradation, and security vulnerabilities, to name a few. To realize its potential, we need designs, techniques, and solutions to overcome these challenges associated with NTC circuits and systems. The readers of this book will be able to familiarize themselves with recent advances in electronics systems, focusing on near-threshold computing

Low-power and application-specific SRAM design for energy-efficient motion estimation

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.Cataloged from PDF version of thesis.Includes bibliographical references (p. 181-189).Video content is expected to account for 70% of total mobile data traffic in 2015. High efficiency video coding, in this context, is crucial for lowering the transmission and storage costs for portable electronics. However, modern video coding standards impose a large hardware complexity. Hence, energy-efficiency of these hardware blocks is becoming more critical than ever before for mobile devices. SRAMs are critical components in almost all SoCs affecting the overall energy-efficiency. This thesis focuses on algorithm and architecture development as well as low-power and application-specific SRAM design targeting motion estimation. First, a motion estimation design is considered for the next generation video standard, HEVC. Hardware cost and coding efficiency trade-offs are quantified and an optimum design choice between hardware complexity and coding efficiency is proposed. Hardware-efficient search algorithm, shared search range across CU engines and pixel pre-fetching algorithms provide 4.3x area, 56x on-chip bandwidth and 151 x off-chip bandwidth reduction. Second, a highly-parallel motion estimation design targeting ultra-low voltage operation and supporting AVC/H.264 and VC-1 standards are considered. Hardware reconfigurability along with frame and macro-block parallel processing are implemented for this engine to maximize hardware sharing between multiple standards and to meet throughput constraints. Third, in the context of low-power SRAMs, a 6T and an 8T SRAM are designed in 28nm and 45nm CMOS technologies targeting low voltage operation. The 6T design achieves operation down to 0.6V and the 8T design achieves operation down to 0.5V providing ~ 2.8x and ~ 4.8x reduction in energy/access respectively. Finally, an application-specific SRAM design targeted for motion estimation is developed. Utilizing the correlation of pixel data to reduce bit-line switching activity, this SRAM achieves up to 1.9x energy savings compared to a similar conventional 8T design. These savings demonstrate that application-specific SRAM design can introduce a new dimension and can be combined with voltage scaling to maximize energy-efficiency.by Mahmut Ersin Sinangil.Ph.D

A survey of cross-layer power-reliability tradeoffs in multi and many core systems-on-chip

As systems-on-chip increase in complexity, the underlying technology presents us with significant challenges due to increased power consumption as well as decreased reliability. Today, designers must consider building systems that achieve the requisite functionality and performance using components that may be unreliable. In order to do so, it is crucial to understand the close interplay between the different layers of a system: technology, platform, and application. This will enable the most general tradeoff exploration, reaping the most benefits in power, performance and reliability. This paper surveys various cross layer techniques and approaches for power, performance, and reliability tradeoffs are technology, circuit, architecture and application layers. © 2013 Elsevier B.V. All rights reserved

Design techniques for dense embedded memory in advanced CMOS technologies

University of Minnesota Ph.D. dissertation. February 2012. Major: Electrical Engineering. Advisor: Chris H. Kim. 1 computer file (PDF); viii, 116 pages.On-die cache memory is a key component in advanced processors since it can boost micro-architectural level performance at a moderate power penalty. Demand for denser memories only going to increase as the number of cores in a microprocessor goes up with technology scaling. A commensurate increase in the amount of cache memory is needed to fully utilize the larger and more powerful processing units. 6T SRAMs have been the embedded memory of choice for modern microprocessors due to their logic compatibility, high speed, and refresh-free operation. However, the relatively large cell size and conflicting requirements for read and write make aggressive scaling of 6T SRAMs challenging in sub-22 nm. In this dissertation, circuit techniques and simulation methodologies are presented to demonstrate the potential of alternative options such as gain cell eDRAMs and spin-torque-transfer magnetic RAMs (STT-MRAMs) for high density embedded memories.Three unique test chip designs are presented to enhance the retention time and access speed of gain cell eDRAMs. Proposed bit-cells utilize preferential boostings, beneficial couplings, and aggregated cell leakages for expanding signal window between data `1' and `0'. The design space of power-delay product can be further enhanced with various assist schemes that harness the innate properties of gain cell eDRAMs. Experimental results from the test chips demonstrate that the proposed gain cell eDRAMs achieve overall faster system performances and lower static power dissipations than SRAMs in a generic 65 nm low-power (LP) CMOS process. A magnetic tunnel junction (MTJ) scaling scenario and an efficient HSPICE simulation methodology are proposed for exploring the scalability of STT-MRAMs under variation effects from 65 nm to 8 nm. A constant JC0*RA/VDD scaling method is adopted to achieve optimal read and write performances of STT-MRAMs and thermal stabilities for a 10 year retention are achieved by adjusting free layer thicknesses as well as projecting crystalline anisotropy improvements. Studies based on the proposed methodology show that in-plane STT-MRAM will outperform SRAM from 15 nm node, while its perpendicular counterpart requires further innovations in MTJ material properties in order to overcome the poor write performance from 22 nm node