A Hardware Security Solution against Scan-Based Attacks

Scan based Design for Test (DfT) schemes have been widely used to achieve high fault coverage for integrated circuits. The scan technique provides full access to the internal nodes of the device-under-test to control them or observe their response to input test vectors. While such comprehensive access is highly desirable for testing, it is not acceptable for secure chips as it is subject to exploitation by various attacks. In this work, new methods are presented to protect the security of critical information against scan-based attacks. In the proposed methods, access to the circuit containing secret information via the scan chain has been severely limited in order to reduce the risk of a security breach. To ensure the testability of the circuit, a built-in self-test which utilizes an LFSR as the test pattern generator (TPG) is proposed. The proposed schemes can be used as a countermeasure against side channel attacks with a low area overhead as compared to the existing solutions in literature

Boundary scan system design

Given the strong competition in digital design on the national and international levels, boundary scan devices are rapidly becoming a necessary as opposed to a convenient feature on integrated circuits. This thesis serves a dual purpose. First, it demonstrates how boundary scan devices can be used to increase the testability of a circuit and it presents several factors used to quantify the cost associated with the addition of boundary scan compatibility to digital designs. Cost tradeoffs are often the most intimidating hurdle for engineers to cross when deciding if boundary scan compatibility is worth the effort. Second, it demonstrates the use of the Tektronix LV500 (logic verifier) as a general testing tool, using boundary scan designs as examples. These examples provide an understanding of the function of boundary scan cells and the JTAG/1 149. 1 standard. The LV500, which is used by students in the Department of Computer Engineering and Microelectronic Engineering at RIT, is an indispensable tool for making critical timing measurements. It also allows a user to evaluate and step through simple as well as more complicated designs. It is my hope that this thesis and the tutorial provided will facilitate the use of the LV500 in future testing work performed in RIT\u27s center for Microelectronic and Computer Engineering clean room facilities. Upon following the example circuits described, one should become familiar with boundary scan terminology as well as the methodology used in designing such a system

Built-In Self Test (BIST) for Realistic Delay Defects

Testing of delay defects is necessary in deep submicron (DSM) technologies. High coverage delay tests produced by automatic test pattern generation (ATPG) can be applied during wafer and package tests, but are difficult to apply during the board test, due to limited chip access. Delay testing at the board level is increasingly important to diagnose failures caused by supply noise or temperature in the board environment. An alternative to ATPG is the built-in self test (BIST). In combination with the insertion of test points, BIST is able to achieve high coverage of stuck-at and transition faults. The quality of BIST patterns on small delay defects is an open question. In this work we analyze the application of BIST to small delay defects using resistive short and open models in order to estimate the coverage and correlate the coverage to traditional delay fault models

Block-level test scheduling under power dissipation constraints

As dcvicc technologies such as VLSI and Multichip Module (MCM) become mature, and larger and denser memory ICs arc implemented for high-performancc digital systems, power dissipation becomes a critical factor and can no longer be ignored cither in normal operation of the system or under test conditions. One of the major considerations in test scheduling is the fact that heat dissipated during test application is significantly higher than during normal operation (sometimes 100 - 200% higher). Therefore, this is one of the recent major considerations in test scheduling. Test scheduling is strongly related to test concurrency. Test concurrency is a design property which strongly impacts testability and power dissipation. To satisfy high fault coverage goals with reduced test application time under certain power dissipation constraints, the testing of all components on the system should be performed m parallel to the greatest extent possible. Some theoretical analysis of this problem has been carried out, but only at IC level. The problem was basically described as a compatible test clustering, where the compatibility among tests was given by test resource and power dissipation conflicts at the same time. From an implementation point of view this problem was identified as an Non-Polynomial (NP) complete problem In this thesis, an efficient scheme for overlaying the block-tcsts, called the extended tree growing technique, is proposed together with classical scheduling algorithms to search for power-constrained blocktest scheduling (PTS) profiles m a polynomial time Classical algorithms like listbased scheduling and distribution-graph based scheduling arc employed to tackle at high level the PTS problem. This approach exploits test parallelism under power constraints. This is achieved by overlaying the block-tcst intervals of compatible subcircuits to test as many of them as possible concurrently so that the maximum accumulated power dissipation is balanced and does not exceed the given limit. The test scheduling discipline assumed here is the partitioned testing with run to completion. A constant additive model is employed for power dissipation analysis and estimation throughout the algorithm

Embedding deterministic patterns in partial pseudo-exhaustive test

The topic of this thesis is related to testing of very large scale integration circuits. The thesis presents the idea of optimizing mixed-mode built-in self-test (BIST) scheme. Mixed-mode BIST consists of two phases. The first phase is pseudo-random testing or partial pseudo-exhaustive testing (P-PET). For the faults not detected by the first phase, deterministic test patterns are generated and applied in the second phase. Hence, the defect coverage of the first phase influences the number of patterns to be generated and stored. The advantages of P-PET in comparison with usual pseudo-random test are in obtaining higher fault coverage and reducing the number of deterministic patterns in the second phase of mixed-mode BIST. Test pattern generation for P-PET is achieved by selecting characteristic polynomials of multiple-polynomial linear feedback shift register (MP-LFSR). In this thesis, the mixed-mode BIST scheme with P-PET in the first phase is further improved in terms of the fault coverage of the first phase. This is achieved by optimization of polynomial selection of P-PET. In usual mixed-mode BIST, the set of undetected by the first phase faults is handled in the second phase by generating deterministic test patterns for them. The method in the thesis is based on consideration of these patterns during polynomial selection. In other words, we are embedding deterministic test patterns in P-PET. In order to solve the problem, the algorithm for the selection of characteristic polynomials covering the pre-generated patterns is developed. The advantages of the proposed approach in terms of the defect coverage and the number of faults left after the first phase are presented using contemporary industrial circuits. A comparison with usual pseudo-random testing is also performed. The results prove the benefits of P-PET with embedded test patterns in terms of the fault coverage, while maintaining comparable test length and time

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

REDUCING POWER DURING MANUFACTURING TEST USING DIFFERENT ARCHITECTURES

Power during manufacturing test can be several times higher than power consumption in functional mode. Excessive power during test can cause IR drop, over-heating, and early aging of the chips. In this dissertation, three different architectures have been introduced to reduce test power in general cases as well as in certain scenarios, including field test. In the first architecture, scan chains are divided into several segments. Every segment needs a control bit to enable capture in a segment when new faults are detectable on that segment for that pattern. Otherwise, the segment should be disabled to reduce capture power. We group the control bits together into one or more control chains. To address the extra pin(s) required to shift data into the control chain(s) and significant post processing in the first architecture, we explored a second architecture. The second architecture stitches the control bits into the chains they control as EECBs (embedded enable capture bits) in between the segments. This allows an ATPG software tool to automatically generate the appropriate EECB values for each pattern to maintain the fault coverage. This also works in the presence of an on-chip decompressor. The last architecture focuses primarily on the self-test of a device in a 3D stacked IC when an existing FPGA in the stack can be programmed as a tester. We show that the energy expended during test is significantly less than would be required using low power patterns fed by an on-chip decompressor for the same very short scan chains