A review of data mining applications in semiconductor manufacturing

The authors acknowledge Fundacao para a Ciencia e a Tecnologia (FCT-MCTES) for its financial support via the project UIDB/00667/2020 (UNIDEMI).For decades, industrial companies have been collecting and storing high amounts of data with the aim of better controlling and managing their processes. However, this vast amount of information and hidden knowledge implicit in all of this data could be utilized more efficiently. With the help of data mining techniques unknown relationships can be systematically discovered. The production of semiconductors is a highly complex process, which entails several subprocesses that employ a diverse array of equipment. The size of the semiconductors signifies a high number of units can be produced, which require huge amounts of data in order to be able to control and improve the semiconductor manufacturing process. Therefore, in this paper a structured review is made through a sample of 137 papers of the published articles in the scientific community regarding data mining applications in semiconductor manufacturing. A detailed bibliometric analysis is also made. All data mining applications are classified in function of the application area. The results are then analyzed and conclusions are drawn.publishersversionpublishe

Exploitation dynamique des données de production pour améliorer les méthodes DFM dans l'industrie Microélectronique

La conception pour la fabrication ou DFM (Design for Manufacturing) est une méthode maintenant classique pour assurer lors de la conception des produits simultanément la faisabilité, la qualité et le rendement de la production. Dans l'industrie microélectronique, le Design Rule Manual (DRM) a bien fonctionné jusqu'à la technologie 250nm avec la prise en compte des variations systématiques dans les règles et/ou des modèles basés sur l'analyse des causes profondes, mais au-delà de cette technologie, des limites ont été atteintes en raison de l'incapacité à sasir les corrélations entre variations spatiales. D'autre part, l'évolution rapide des produits et des technologies contraint à une mise à jour dynamique des DRM en fonction des améliorations trouvées dans les fabs. Dans ce contexte les contributions de thèse sont (i) une définition interdisciplinaire des AMDEC et analyse de risques pour contribuer aux défis du DFM dynamique, (ii) un modèle MAM (mapping and alignment model) de localisation spatiale pour les données de tests, (iii) un référentiel de données basé sur une ontologie ROMMII (referential ontology Meta model for information integration) pour effectuer le mapping entre des données hétérogènes issues de sources variées et (iv) un modèle SPM (spatial positioning model) qui vise à intégrer les facteurs spatiaux dans les méthodes DFM de la microélectronique, pour effectuer une analyse précise et la modélisation des variations spatiales basées sur l'exploitation dynamique des données de fabrication avec des volumétries importantes.The DFM (design for manufacturing) methods are used during technology alignment and adoption processes in the semiconductor industry (SI) for manufacturability and yield assessments. These methods have worked well till 250nm technology for the transformation of systematic variations into rules and/or models based on the single-source data analyses, but beyond this technology they have turned into ineffective R&D efforts. The reason for this is our inability to capture newly emerging spatial variations. It has led an exponential increase in technology lead times and costs that must be addressed; hence, objectively in this thesis we are focused on identifying and removing causes associated with the DFM ineffectiveness. The fabless, foundry and traditional integrated device manufacturer (IDM) business models are first analyzed to see coherence against a recent shift in business objectives from time-to-market (T2M) and time-to-volume towards (T2V) towards ramp-up rate. The increasing technology lead times and costs are identified as a big challenge in achieving quick ramp-up rates; hence, an extended IDM (e-IDM) business model is proposed to support quick ramp-up rates which is based on improving the DFM ineffectiveness followed by its smooth integration. We have found (i) single-source analyses and (ii) inability to exploit huge manufacturing data volumes as core limiting factors (failure modes) towards DFM ineffectiveness during technology alignment and adoption efforts within an IDM. The causes for single-source root cause analysis are identified as the (i) varying metrology reference frames and (ii) test structures orientations that require wafer rotation prior to the measurements, resulting in varying metrology coordinates (die/site level mismatches). A generic coordinates mapping and alignment model (MAM) is proposed to remove these die/site level mismatches, however to accurately capture the emerging spatial variations, we have proposed a spatial positioning model (SPM) to perform multi-source parametric correlation based on the shortest distance between respective test structures used to measure the parameters. The (i) unstructured model evolution, (ii) ontology issues and (iii) missing links among production databases are found as causes towards our inability to exploit huge manufacturing data volumes. The ROMMII (referential ontology Meta model for information integration) framework is then proposed to remove these issues and enable the dynamic and efficient multi-source root cause analyses. An interdisciplinary failure mode effect analysis (i-FMEA) methodology is also proposed to find cyclic failure modes and causes across the business functions which require generic solutions rather than operational fixes for improvement. The proposed e-IDM, MAM, SPM, and ROMMII framework results in accurate analysis and modeling of emerging spatial variations based on dynamic exploitation of the huge manufacturing data volumes.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Design and Development of an Optical Chip Interferometer For High Precision On-Line Surface Measurement

Advances in manufacturing and with the demand of achieving faster throughput at a lower cost in any industrial setting have put forward the need for embedded metrology. Embedded metrology is the provision of metrology on the manufacturing platform, enabling measurement without the removal of the workpiece. Providing closer integration of metrology upon the manufacturing platform will improve material processing and reliability of manufacture for high added value products in ultra-high-precision engineering. Currently, almost all available metrology instrumentation is either too bulky, slow, destructive in terms of damaging the surfaces with a contacting stylus or is carried out off-line. One technology that holds promise for improving the current state-of-the-art in the online measurement of surfaces is hybrid photonic integration. This technique provides for the integration of individual optoelectronic components onto silicon daughter boards which are then incorporated on a silica motherboard containing waveguides to produce a complete photonic circuit. This thesis presents first of its kind a novel chip interferometer sensor based on hybrid integration technology for online surface and dimensional metrology applications. The complete metrology sensor system is structured into two parts; hybrid photonic chip and optical probe. The hybrid photonic chip interferometer is based on a silica-on-silicon etched integrated-optic motherboard containing waveguide structures and evanescent couplers. Upon the motherboard, electro-optic components such as photodiodes and a semiconductor gain block are mounted and bonded to provide the required functionality. Optical probe is a separate entity attached to the integrated optic module which serves as optical stylus for surface scanning in two measurement modes a) A single-point for measuring distance and thus form/surface topography through movement of the device or workpiece, b) Profiling (lateral scanning where assessment of 2D surface parameters may be determined in a single shot. Wavelength scanning and phase shifting inteferometry implemented for the retrival of phase information eventually providing the surface height measurement. The signal analysis methodology for the two measurement modes is described as well as a theoretical and experimental appraisal of the metrology capabilities in terms of range and resolution. The incremetal development of various hybrid photonic modules such as wavelength encoder unit, signal detection unit etc. of the chip interferometer are presented. Initial measurement results from various componets of metrology sensor and the surface measurement results in two measurement modes validate the applicability of the described sensor system as a potential metrology tool for online surface measurement applications

Photonic Time-Stretch Enabled High Throughput Microwave and MM-Wave Interferometry Applied to Fibre Grating Sensors and Non-Contact Measurement

The research presented in this thesis is focused towards developing real-time, high-speed applications, employing ultrafast optical microwave generation and characterisation techniques. This thesis presents a series of experiments wherein mode-locked laser pulses are utilised. Photonics-based microwave and MM-Wave generation and detection are explored and employed for applications pertaining to fibre grating sensors and non-contact measurement. The application concepts leverage techniques from optical coherence tomography and non-destructive evaluation of turbid media. In particular, I use the principle of dispersion-induced photonic Time-Stretch to slow down high-speed waveforms to speeds usable by state-of-the-art photo-detectors and digital signal processors. The concept of photonic time-stretch is applied to map instantaneous microwave frequency to the time instant of the signal, which in turn is related to spatial location as established by the space-wavelength-time conversions. The experimental methods applied throughout this thesis is based upon Michelson interferometer architecture. My original contribution to knowledge is the realisation of Photonics-based, single tone, and chirped microwave and MM-Wave pulse generation applied to deciphering physical strain profile along the length of a chirped fibre Bragg grating employed in a Michelson interferometer configuration. This interrogation scheme allows intra-grating high-resolution, high-speed, and temperature independent strain measurement. This concept is further extended to utilise photonic generation of microwave pulses to characterise surface profile information of thin film and thin plate infrared transparent slides of variable thickness setup in a Michelson interferometer architecture. The method basis for photonically generated high-frequency microwave signals utilises the principle of photonic Time-Stretch. The research was conducted in the Photonics Lab at the University of Kent. In addition, the photonically generated microwave/ MM-Wave pulses is utilised as a potential broadband frequency-swept source for non-contact measurement of turbid media. Investigation of the proof-of-concept based on an MM-Wave coherence tomography set-up is implemented at Vrije Universiteit Brussel (VUB), Department of Electronics and Informatics (ETRO)

Earth Abundant Thin Film Technology for Next Generation Photovoltaic Modules

With a cumulative generation capacity of over 100 GW, Photovoltaics (PV) technology is uniquely poised to become increasingly popular in the coming decades. Although, several breakthroughs have propelled PV technology, it accounts for only less than 1% of the energy produced worldwide. This aspect of the PV technology is primarily due to the somewhat high cost per watt, which is dependent on the efficiency of the PV cells as well as the cost of manufacturing and installing them. Currently, the efficiency of the PV conversion process is limited to about 25% for commercial terrestrial cells; improving this efficiency can increase the penetration of PV worldwide rapidly. A critical review of all possibilities pursued in the public domain reveals serious shortcomings and manufacturing issues. To make PV generated power a reality in every home, a Multi-Junction Multi-Terminal (MJMT) PV architecture can be employed combining silicon and another earth abundant material. However, forming electronic grade thin films of earth abundant materials is a non-trivial challenge; without solving this, it is impossible to increase the overall PV efficiency. Deposition of Copper (I) Oxide, an earth abundant semiconducting material, was conducted using an optimized Photo assisted Chemical Vapor Deposition process. X-Ray Diffraction, Ellipsometry, Transmission Electron Microscopy, and Profilometry revealed that the films composed of Cu2O of about 90 nm thickness and the grain size was as large as 600 nm. This result shows an improvement in material properties over previously grown thin films of Cu2O. Measurement of I-V characteristics of a diode structure composed of the Cu2O indicates an increase in On/Off ratio to 17,000 from the previous best value of 800. These results suggest that the electronic quality of the thin films deposited using our optimized process to be better than the results reported elsewhere. Using this optimized thin film forming technique, it is now possible to create a complete MJMT structure to improve the terrestrial commercial PV efficiency

Advanced Process Monitoring for Industry 4.0

This book reports recent advances on Process Monitoring (PM) to cope with the many challenges raised by the new production systems, sensors and “extreme data” conditions that emerged with Industry 4.0. Concepts such as digital-twins and deep learning are brought to the PM arena, pushing forward the capabilities of existing methodologies to handle more complex scenarios. The evolution of classical paradigms such as Latent Variable modeling, Six Sigma and FMEA are also covered. Applications span a wide range of domains such as microelectronics, semiconductors, chemicals, materials, agriculture, as well as the monitoring of rotating equipment, combustion systems and membrane separation processes

Journal of Microelectronic Research - May 2003

https://scholarworks.rit.edu/meec_archive/1012/thumbnail.jp