1,597 research outputs found

    Random access memory testing : theory and practice : the gains of fault modelling

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    Chip level simulation of fault tolerant computers

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    Chip level modeling techniques, functional fault simulation, simulation software development, a more efficient, high level version of GSP, and a parallel architecture for functional simulation are discussed

    Cost modelling and concurrent engineering for testable design

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    This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices. Testability has to be considered during the design of complex electronic systems, and automatic test systems have to be used in order to facilitate the test. This fact is now widely accepted in industry. Both design for testability and the usage of automatic test systems aim at reducing the cost of production testing or, sometimes, making it possible at all. Many design for testability methods and test systems are available which can be configured into a production test strategy, in order to achieve high quality of the final product. The designer has to select from the various options for creating a test strategy, by maximising the quality and minimising the total cost for the electronic system. This thesis presents a methodology for test strategy generation which is based on consideration of the economics during the life cycle of the electronic system. This methodology is a concurrent engineering approach which takes into account all effects of a test strategy on the electronic system during its life cycle by evaluating its related cost. This objective methodology is used in an original test strategy planning advisory system, which allows for test strategy planning for VLSI circuits as well as for digital electronic systems. The cost models which are used for evaluating the economics of test strategies are described in detail and the test strategy planning system is presented. A methodology for making decisions which are based on estimated costing data is presented. Results of using the cost models and the test strategy planning system for evaluating the economics of test strategies for selected industrial designs are presented

    Defect-tolerance and testing for configurable nano-crossbars

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    Moore\u27s Law speculated a trend in computation technology in terms of number of transistors per unit area that would double roughly every two years. Even after 40 years of this prediction, current technologies have been following it successfully. There are however, certain physical limitations of current CMOS that would result in fundamental obstructions to continuation of Moore\u27s Law. Although there is a debate amongst experts on how much time it would take for this to happen, it is certain that some entirely new paradigms for semiconductor electronics would be needed to replace CMOS and to delay the end of Moore\u27s Law. Silicon nanowires (SiNW) and Carbon nanotubes (CNT) possess significant promise to replace current CMOS --Abstract, page iv

    The effectiveness of different test sets for PLAs

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    It has been theoretically demonstrated that the single stuck-at fault model for a PLA does not cover as many faults as the single crosspoint model. What has not been demonstrated is the real relative effectiveness of test sets generated using these models. This paper presents the results of a study involving presenting a number of test sets to fabricated PLAs to determine their effectiveness. The test sets included weighted random patterns, of particular interest owing to PLAs being random resistant. Details are given of a method to generate weights, taking into account a PLA's structure

    The Automatic Synthesis of Fault Tolerant and Fault Secure VLSI Systems

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    This thesis investigates the design of fault tolerant and fault secure (FTFS) systems within the framework of silicon compilation. Automatic design modification is used to introduce FTFS characteristics into a design. A taxonomy of FTFS techniques is introduced and is used to identify a number of features which an "automatic design for FTFS" system should exhibit. A silicon compilation system, Chip Churn 2 (CC2), has been implemented and has been used to demonstrate the feasibility of automatic design of FTFS systems. The CC2 system provides a design language, simulation facilities and a back-end able to produce CMOS VLSI designs. A number of FTFS design methods have been implemented within the CC2 environment; these methods range from triple modular redundancy to concurrent parity code checking. The FTFS design methods can be applied automatically to general designs in order to realise them as FTFS systems. A number of example designs are presented; these are used to illustrate the FTFS modification techniques which have been implemented. Area results for CMOS devices are presented; this allows the modification methods to be compared. A number of problems arising from the methods are highlighted and some solutions suggested

    An Integrated Test Plan for an Advanced Very Large Scale Integrated Circuit Design Group

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    VLSI testing poses a number of problems which includes the selection of test techniques, the determination of acceptable fault coverage levels, and test vector generation. Available device test techniques are examined and compared. Design rules should be employed to assure the design is testable. Logic simulation systems and available test utilities are compared. The various methods of test vector generation are also examined. The selection criteria for test techniques are identified. A table of proposed design rules is included. Testability measurement utilities can be used to statistically predict the test generation effort. Field reject rates and fault coverage are statistically related. Acceptable field reject rates can be achieved with less than full test vector fault coverage. The methods and techniques which are examined form the basis of the recommended integrated test plan. The methods of automatic test vector generation are relatively primitive but are improving

    Testability and redundancy techniques for improved yield and reliability of CMOS VLSI circuits

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    The research presented in this thesis is concerned with the design of fault-tolerant integrated circuits as a contribution to the design of fault-tolerant systems. The economical manufacture of very large area ICs will necessitate the incorporation of fault-tolerance features which are routinely employed in current high density dynamic random access memories. Furthermore, the growing use of ICs in safety-critical applications and/or hostile environments in addition to the prospect of single-chip systems will mandate the use of fault-tolerance for improved reliability. A fault-tolerant IC must be able to detect and correct all possible faults that may affect its operation. The ability of a chip to detect its own faults is not only necessary for fault-tolerance, but it is also regarded as the ultimate solution to the problem of testing. Off-line periodic testing is selected for this research because it achieves better coverage of physical faults and it requires less extra hardware than on-line error detection techniques. Tests for CMOS stuck-open faults are shown to detect all other faults. Simple test sequence generation procedures for the detection of all faults are derived. The test sequences generated by these procedures produce a trivial output, thereby, greatly simplifying the task of test response analysis. A further advantage of the proposed test generation procedures is that they do not require the enumeration of faults. The implementation of built-in self-test is considered and it is shown that the hardware overhead is comparable to that associated with pseudo-random and pseudo-exhaustive techniques while achieving a much higher fault coverage through-the use of the proposed test generation procedures. The consideration of the problem of testing the test circuitry led to the conclusion that complete test coverage may be achieved if separate chips cooperate in testing each other's untested parts. An alternative approach towards complete test coverage would be to design the test circuitry so that it is as distributed as possible and so that it is tested as it performs its function. Fault correction relies on the provision of spare units and a means of reconfiguring the circuit so that the faulty units are discarded. This raises the question of what is the optimum size of a unit? A mathematical model, linking yield and reliability is therefore developed to answer such a question and also to study the effects of such parameters as the amount of redundancy, the size of the additional circuitry required for testing and reconfiguration, and the effect of periodic testing on reliability. The stringent requirement on the size of the reconfiguration logic is illustrated by the application of the model to a typical example. Another important result concerns the effect of periodic testing on reliability. It is shown that periodic off-line testing can achieve approximately the same level of reliability as on-line testing, even when the time between tests is many hundreds of hours
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