CMOS-3D smart imager architectures for feature detection

This paper reports a multi-layered smart image sensor architecture for feature extraction based on detection of interest points. The architecture is conceived for 3-D integrated circuit technologies consisting of two layers (tiers) plus memory. The top tier includes sensing and processing circuitry aimed to perform Gaussian filtering and generate Gaussian pyramids in fully concurrent way. The circuitry in this tier operates in mixed-signal domain. It embeds in-pixel correlated double sampling, a switched-capacitor network for Gaussian pyramid generation, analog memories and a comparator for in-pixel analog-to-digital conversion. This tier can be further split into two for improved resolution; one containing the sensors and another containing a capacitor per sensor plus the mixed-signal processing circuitry. Regarding the bottom tier, it embeds digital circuitry entitled for the calculation of Harris, Hessian, and difference-of-Gaussian detectors. The overall system can hence be configured by the user to detect interest points by using the algorithm out of these three better suited to practical applications. The paper describes the different kind of algorithms featured and the circuitry employed at top and bottom tiers. The Gaussian pyramid is implemented with a switched-capacitor network in less than 50 μs, outperforming more conventional solutions.Xunta de Galicia 10PXIB206037PRMinisterio de Ciencia e Innovación TEC2009-12686, IPT-2011-1625-430000Office of Naval Research N00014111031

A Current-Mode Multi-Channel Integrating Analog-to-Digital Converter

Multi-channel analog to digital converters (ADCs) are required where signals from multiple sensors can be digitized. A lower power per channel for such systems is important in order that when the number of channels is increased the power does not increase drastically. Many applications require signals from current output sensors, such as photosensors and photodiodes to be digitized. Applications for these sensors include spectroscopy and imaging. The ability to digitize current signals without converting currents to voltages saves power, area, and the design time required to implement I-to-V converters. This work describes a novel and unique current-mode multi-channel integrating ADC which processes current signals from sensors and converts it to digital format. The ADC facilitates the processing of current analog signals without the use of transconductors. An attempt has been made also to incorporate voltage-mode techniques into the current-mode design so that the advantages of both techniques can be utilized to augment the performance of the system. Additionally since input signals are in the form of currents, the dynamic range of the ADC is less dependant on the supply voltage. A prototype 4-channel ADC design was fabricated in a 0.5-micron bulk CMOS process. The measurement results for a 10Ksps sampling rate include a DNL, which is less than 0.5 LSB, and a power consumption of less than 2mW per channel

Energy Efficiency in Communications and Networks

The topic of "Energy Efficiency in Communications and Networks" attracts growing attention due to economical and environmental reasons. The amount of power consumed by information and communication technologies (ICT) is rapidly increasing, as well as the energy bill of service providers. According to a number of studies, ICT alone is responsible for a percentage which varies from 2% to 10% of the world power consumption. Thus, driving rising cost and sustainability concerns about the energy footprint of the IT infrastructure. Energy-efficiency is an aspect that until recently was only considered for battery driven devices. Today we see energy-efficiency becoming a pervasive issue that will need to be considered in all technology areas from device technology to systems management. This book is seeking to provide a compilation of novel research contributions on hardware design, architectures, protocols and algorithms that will improve the energy efficiency of communication devices and networks and lead to a more energy proportional technology infrastructure

Mixed-mode cellular array processor realization for analyzing brain electrical activity in epilepsy

This thesis deals with the realization of hardware that is capable of computing algorithms that can be described using the theory of polynomial cellular neural/nonlinear networks (CNNs). The goal is to meet the requirements of an algorithm for predicting the onset of an epileptic seizure. The analysis associated with this application requires extensive computation of data that consists of segments of brain electrical activity. Different types of computer architectures are overviewed. Since the algorithm requires operations in which data is manipulated locally, special emphasis is put on assessing different parallel architectures. An array computer is potentially able to perform local computational tasks effectively and rapidly. Based on the requirements of the algorithm, a mixed-mode CNN is proposed. A mixed-mode CNN combines analog and digital processing so that the couplings and the polynomial terms are implemented with analog blocks, whereas the integrator is digital. A/D and D/A converters are used to interface between the analog blocks and the integrator. Based on the mixed-mode CNN architecture a cellular array processor is realized. In the realized array processor the processing units are coupled with programmable polynomial (linear, quadratic and cubic) first neighborhood feedback terms. A 10 mm2, 1.027 million transistor cellular array processor, with 2×72 processing units and 36 layers of memory in each is manufactured using a 0.25 μm digital CMOS process. The array processor can perform gray-scale Heun's integration of spatial convolutions with linear, quadratic and cubic activation functions for 72×72 data while keeping all I/O operations during processing local. One complete Heun's iteration round takes 166.4 μs, while the power consumption during processing is 192 mW. Experimental results of statistical variations in the multipliers and polynomial circuits are shown. Descriptions regarding improvements in the design are also explained. The results of this thesis can be used to assess the suitability of the mixed-mode approach for implementing an implantable system for predicting epileptic seizures. The results can also be used to assess the suitability of the approach for implementing other applications.reviewe

Programmable CMOS Analog-to-Digital Converter Design and Testability

In this work, a programmable second order oversampling CMOS delta-sigma analog-to-digital converter (ADC) design in 0.5µm n-well CMOS processes is presented for integration in sensor nodes for wireless sensor networks. The digital cascaded integrator comb (CIC) decimation filter is designed to operate at three different oversampling ratios of 16, 32 and 64 to give three different resolutions of 9, 12 and 14 bits, respectively which impact the power consumption of the sensor nodes. Since the major part of power consumed in the CIC decimator is by the integrators, an alternate design is introduced by inserting coder circuits and reusing the same integrators for different resolutions and oversampling ratios to reduce power consumption. The measured peak signal-to-noise ratio (SNR) for the designed second order delta-sigma modulator is 75.6dB at an oversampling ratio of 64, 62.3dB at an oversampling ratio of 32 and 45.3dB at an oversampling ratio of 16. The implementation of a built-in current sensor (BICS) which takes into account the increased background current of defect-free circuits and the effects of process variation on ΔIDDQ testing of CMOS data converters is also presented. The BICS uses frequency as the output for fault detection in CUT. A fault is detected when the output frequency deviates more than ±10% from the reference frequency. The output frequencies of the BICS for various model parameters are simulated to check for the effect of process variation on the frequency deviation. A design for on-chip testability of CMOS ADC by linear ramp histogram technique using synchronous counter as register in code detection unit (CDU) is also presented. A brief overview of the histogram technique, the formulae used to calculate the ADC parameters, the design implemented in 0.5µm n-well CMOS process, the results and effectiveness of the design are described. Registers in this design are replaced by 6T-SRAM cells and a hardware optimized on-chip testability of CMOS ADC by linear ramp histogram technique using 6T-SRAM as register in CDU is presented. The on-chip linear ramp histogram technique can be seamlessly combined with ΔIDDQ technique for improved testability, increased fault coverage and reliable operation

A Novel Frequency Based Current-to-Digital Converter with Programmable Dynamic Range

This work describes a novel frequency based Current to Digital converter, which would be fully realizable on a single chip. Biological systems make use of delay line techniques to compute many things critical to the life of an animal. Seeking to build up such a system, we are adapting the auditory localization circuit found in barn owls to detect and compute the magnitude of an input current. The increasing drive to produce ultra low-power circuits necessitates the use of very small currents. Frequently these currents need to accurately measured, but current solutions typically involve off-chip measurements. These are usually slow, and moving a current off chip increases noise to the system. Moving a system such as this completely on chip will allow for precise measurement and control of bias currents, and it will allow for better compensation of some common transistor mismatch issues. This project affords an extremely low power (100s nW) converter technology that is also very space efficient. The converter is completely asynchronous which yields ultra-low power standby operation [1]

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Method and system for spatial data input, manipulation and distribution via an adaptive wireless transceiver

A method and system for spatial data manipulation input and distribution via an adaptive wireless transceiver. The method and system include a wireless transceiver for automatically and adaptively controlling wireless transmissions using a Waveform-DNA method. The wireless transceiver can operate simultaneously over both the short and long distances. The wireless transceiver is automatically adaptive and wireless devices can send and receive wireless digital and analog data from various sources rapidly in real-time via available networks and network services

Diseño CMOS de un sistema de visión “on-chip” para aplicaciones de muy alta velocidad

Falta palabras claveEsta Tesis presenta arquitecturas, circuitos y chips para el diseño de sensores de visión CMOS con procesamiento paralelo embebido. La Tesis reporta dos chips, en concreto: El chip Q-Eye; El chip Eye-RIS_VSoC.. Y dos sistemas de visión construidos con estos chips y otros sistemas “off-chip” adicionales, como FPGAs, en concreto: El sistema Eye-RIS_v1; El sistema Eye-RIS_v2. Estos chips y sistemas están concebidos para ejecutar tareas de visión a muy alta velocidad y con consumos de potencia moderados. Los sistemas resultantes son, además, compactos y por lo tanto ventajosos en términos del factor SWaP cuando se los compara con arquitecturas convencionales formadas por sensores de imágenes convencionales seguidos de procesadores digitales. La clave de estas ventajas en términos de SWaP y velocidad radica en el uso de sensores-procesadores, en lugar de meros sensores, en la interface de los sistemas de visión. Estos sensores-procesadores embeben procesadores programables de señal-mixta dentro del pixel y son capaces tanto de adquirir imágenes como de pre-procesarlas para extraer características, eliminar información redundante y reducir el número de datos que se transmiten fuera del sensor para su procesamiento ulterior. El núcleo de la tesis es el sensor-procesador Q-Eye, que se usa como interface en los sistemas Eye-RIS. Este sensor-procesador embebe una arquitectura de procesamiento formada por procesadores de señal-mixta distribuidos por pixel. Sus píxeles son por tanto estructuras multi-funcionales complejas. De hecho, son programables, incorporan memorias e interactúan con sus vecinos para realizar una variedad de operaciones, tales como: Convoluciones lineales con máscaras programables; Difusiones controladas por tiempo y nivel de señal, a través de un “grid” resistivo embebido en el plano focal; Aritmética de imágenes; Flujo de programación dependiente de la señal; Conversión entre los dominios de datos: imagen en escala de grises e imagen binaria; Operaciones lógicas en imágenes binarias; Operaciones morfológicas en imágenes binarias. etc. Con respecto a otros píxeles multi-función y sensores-procesadores anteriores, el Q-Eye reporta entre otras las siguientes ventajas: Mayor calidad de la imagen y mejores prestaciones de las funcionalidades embebidas en el chip; Mayor velocidad de operación y mejor gestión de la energía disponible; Mayor versatilidad para integración en sistemas de visión industrial. De hecho, los sistemas Eye-RIS son los primeros sistemas de visión industriales dotados de las siguientes características: Procesamiento paralelo distribuido y progresivo; Procesadores de señal-mixta fiables, robustos y con errores controlados; Programabilidad distribuida. La Tesis incluye descripciones detalladas de la arquitectura y los circuitos usados en el pixel del Q-Eye, del propio chip Q-Eye y de los sistemas de visión construidos en base a este chip. Se incluyen también ejemplos de los distintos chips en operaciónThis Thesis presents architectures, circuits and chips for the implementation of CMOS VISION SENSORS with embedded parallel processing. The Thesis reports two chips, namely: Q-eye chip; Eye-RIS_VSoC chip, and two vision systems realized by using these chips and some additional “off-chip” circuitry, such as FPGAs. These vision systems are: Eye-RIS_v1 system; Eye-RIS_v2 system. The chips and systems reported in the Thesis are conceived to perform vision tasks at very high speed and with moderate power consumption. The proposed vision systems are also compact and advantageous in terms of SWaP factors as compared with conventional architectures consisting of standard image sensor followed by digital processors. The key of these advantages in terms of SWaP and speed lies in the use of sensors-processors, rather than mere sensors, in the front-end interface of vision systems. These sensors-processors embed mixed-signal programmable processors inside the pixel. Therefore, they are able to acquire images and process them to extract the features, removing the redundant information and reducing the data throughput for later processing. The core of the Thesis is the sensor-processor Q-Eye, which is used as front-end in the Eye-RIS systems. This sensor-processor embeds a processing architecture composed by mixed-signal processors distributed per pixel. Then, its pixels are complex multi-functional structures. In fact, they are programmable, incorporate memories and interact with its neighbors in order to carry out a set of operations, including: Linear convolutions with programmable linear masks; Time- and signal-controlled diffusions (by means of an embedded resistive grid); Image arithmetic; Signal-dependent data scheduling; Gray-scale to binary transformation; Logic operation on binary images; Mathematical morphology on binary images, etc. As compared with previous multi-function pixels and sensors-processors, the Q-Eye brings among other the following advantages: Higher image quality and better performances of functionalities embedded on chip; Higher operation speed and better management of energy budget; More versatility for integration in industrial vision systems. In fact, the Eye-RIS systems are the first industrial vision systems equipped with the following characteristics: Parallel distributed and progressive processing; Reliable, robust mixed-signal processors with handled errors; Distributed programmability. This Thesis includes detailed descriptions of architecture and circuits used in the Q-Eye pixel, in the Q-Eye chip itself and in the vision systems developed based on this chip. Also, several examples of chips and systems in operation are presented

Analysis of system capacity and spectral efficiency of fixed-grid network

In this article, the performance of a fixed grid network is examined for various modulation formats to estimate the system's capacity and spectral efficiency. The optical In-phase Quadrature Modulator structure is used to build a fixed grid network modulation, and the homodyne detection approach is used for the receiver. Data multiplexing is accomplished using the Polarization Division Multiplexed technology. 100 Gbps, 150 Gbps, and 200 Gbps data rates are transmitted under these circumstances utilizing various modulation formats. Various pre-processing and signal recovery steps are explained by using modern digital signal processing systems. The achieved spectrum efficiencies for PM-QPSK, PM-8 QAM, and PM-16 QAM, respectively, were 2, 3, and 4 bits/s/Hz. Different modulation like PM-QPSK, PM-8-QAM, and PM-16-QAM each has system capacities of 8-9, 12-13.5, and 16-18 Tbps and it reaches transmission distances of 3000, 1300, and 700 kilometers with acceptable Bit Error Rate less than equal to 2*10-3 respectively. Peak optical power for received signal detection and full width at half maximum is noted for the different modulations under a fixed grind network