Hybrid NRZ/Multi-Tone Signaling for High-Speed Low-Power Wireline Transceivers

Over the past few decades, incessant growth of Internet networking traffic and High-Performance Computing (HPC) has led to a tremendous demand for data bandwidth. Digital communication technologies combined with advanced integrated circuit scaling trends have enabled the semiconductor and microelectronic industry to dramatically scale the bandwidth of high-loss interfaces such as Ethernet, backplane, and Digital Subscriber Line (DSL). The key to achieving higher bandwidth is to employ equalization technique to compensate the channel impairments such as Inter-Symbol Interference (ISI), crosstalk, and environmental noise. Therefore, todayâs advanced input/outputs (I/Os) has been equipped with sophisticated equalization techniques to push beyond the uncompensated bandwidth of the system. To this end, process scaling has continually increased the data processing capability and improved the I/O performance over the last 15 years. However, since the channel bandwidth has not scaled with the same pace, the required signal processing and equalization circuitry becomes more and more complicated. Thereby, the energy efficiency improvements are largely offset by the energy needed to compensate channel impairments. In this design paradigm, re-thinking about the design strategies in order to not only satisfy the bandwidth performance, but also to improve power-performance becomes an important necessity. It is well known in communication theory that coding and signaling schemes have the potential to provide superior performance over band-limited channels. However, the choice of the optimum data communication algorithm should be considered by accounting for the circuit level power-performance trade-offs. In this thesis we have investigated the application of new algorithm and signaling schemes in wireline communications, especially for communication between microprocessors, memories, and peripherals. A new hybrid NRZ/Multi-Tone (NRZ/MT) signaling method has been developed during the course of this research. The system-level and circuit-level analysis, design, and implementation of the proposed signaling method has been performed in the frame of this work, and the silicon measurement results have proved the efficiency and the robustness of the proposed signaling methodology for wireline interfaces. In the first part of this work, a 7.5 Gb/s hybrid NRZ/MT transceiver (TRX) for multi-drop bus (MDB) memory interfaces is designed and fabricated in 40 nm CMOS technology. Reducing the complexity of the equalization circuitry on the receiver (RX) side, the proposed architecture achieves 1 pJ/bit link efficiency for a MDB channel bearing 45 dB loss at 2.5 GHz. The measurement results of the first prototype confirm that NRZ/MT serial data TRX can offer an energy-efficient solution for MDB memory interfaces. Motivated by the satisfying results of the first prototype, in the second phase of this research we have exploited the properties of multi-tone signaling, especially orthogonality among different sub-bands, to reduce the effect of crosstalk in high-dense wireline interconnects. A four-channel transceiver has been implemented in a standard CMOS 40 nm technology in order to demonstrate the performance of NRZ/MT signaling in presence of high channel loss and strong crosstalk noise. The proposed system achieves 1 pJ/bit power efficiency, while communicating over a MDB memory channel at 36 Gb/s aggregate data rate

Novel Multicarrier Memory Channel Architecture Using Microwave Interconnects: Alleviating the Memory Wall

abstract: The increase in computing power has simultaneously increased the demand for input/output (I/O) bandwidth. Unfortunately, the speed of I/O and memory interconnects have not kept pace. Thus, processor-based systems are I/O and interconnect limited. The memory aggregated bandwidth is not scaling fast enough to keep up with increasing bandwidth demands. The term "memory wall" has been coined to describe this phenomenon. A new memory bus concept that has the potential to push double data rate (DDR) memory speed to 30 Gbit/s is presented. We propose to map the conventional DDR bus to a microwave link using a multicarrier frequency division multiplexing scheme. The memory bus is formed using a microwave signal carried within a waveguide. We call this approach multicarrier memory channel architecture (MCMCA). In MCMCA, each memory signal is modulated onto an RF carrier using 64-QAM format or higher. The carriers are then routed using substrate integrated waveguide (SIW) interconnects. At the receiver, the memory signals are demodulated and then delivered to SDRAM devices. We pioneered the usage of SIW as memory channel interconnects and demonstrated that it alleviates the memory bandwidth bottleneck. We demonstrated SIW performance superiority over conventional transmission line in immunity to cross-talk and electromagnetic interference. We developed a methodology based on design of experiment (DOE) and response surface method techniques that optimizes the design of SIW interconnects and minimizes its performance fluctuations under material and manufacturing variations. Along with using SIW, we implemented a multicarrier architecture which enabled the aggregated DDR bandwidth to reach 30 Gbit/s. We developed an end-to-end system model in Simulink and demonstrated the MCMCA performance for ultra-high throughput memory channel. Experimental characterization of the new channel shows that by using judicious frequency division multiplexing, as few as one SIW interconnect is sufficient to transmit the 64 DDR bits. Overall aggregated bus data rate achieves 240 GBytes/s data transfer with EVM not exceeding 2.26% and phase error of 1.07 degree or less.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Learning-Based Hardware Design for Data Acquisition Systems

This multidisciplinary research work aims to investigate the optimized information extraction from signals or data volumes and to develop tailored hardware implementations that trade-off the complexity of data acquisition with that of data processing, conceptually allowing radically new device designs. The mathematical results in classical Compressive Sampling (CS) support the paradigm of Analog-to-Information Conversion (AIC) as a replacement for conventional ADC technologies. The AICs simultaneously perform data acquisition and compression, seeking to directly sample signals for achieving specific tasks as opposed to acquiring a full signal only at the Nyquist rate to throw most of it away via compression. Our contention is that in order for CS to live up its name, both theory and practice must leverage concepts from learning. This work demonstrates our contention in hardware prototypes, with key trade-offs, for two different fields of application as edge and big-data computing. In the framework of edge-data computing, such as wearable and implantable ecosystems, the power budget is defined by the battery capacity, which generally limits the device performance and usability. This is more evident in very challenging field, such as medical monitoring, where high performance requirements are necessary for the device to process the information with high accuracy. Furthermore, in applications like implantable medical monitoring, the system performances have to merge the small area as well as the low-power requirements, in order to facilitate the implant bio-compatibility, avoiding the rejection from the human body. Based on our new mathematical foundations, we built different prototypes to get a neural signal acquisition chip that not only rigorously trades off its area, energy consumption, and the quality of its signal output, but also significantly outperforms the state-of-the-art in all aspects. In the framework of big-data and high-performance computation, such as in high-end servers application, the RF circuits meant to transmit data from chip-to-chip or chip-to-memory are defined by low power requirements, since the heat generated by the integrated circuits is partially distributed by the chip package. Hence, the overall system power budget is defined by its affordable cooling capacity. For this reason, application specific architectures and innovative techniques are used for low-power implementation. In this work, we have developed a single-ended multi-lane receiver for high speed I/O link in servers application. The receiver operates at 7 Gbps by learning inter-symbol interference and electromagnetic coupling noise in chip-to-chip communication systems. A learning-based approach allows a versatile receiver circuit which not only copes with large channel attenuation but also implements novel crosstalk reduction techniques, to allow single-ended multiple lines transmission, without sacrificing its overall bandwidth for a given area within the interconnect's data-path

Analog and mixed-signal circuitry for system-assisted high-speed I/O links

The state-of-the-art design methodology for high-speed I/O links is to specify component-level design requirements to achieve high-fidelity component-level performance. While designing each component in the link with high fidelity guarantees a reliable link, it does not inherently optimize the link for metrics such as the power, design complexity, or bit error rate performance. Recently, due to the increased demand for data bandwidth in backplane I/O, a system-assisted design methodology has been developed to optimize the system for a given set of metrics. By optimizing on the system level rather than the component level, the performance at the component level can be reduced from high quality to sufficient when the component is deployed within the I/O link. The new system-level design methodology encourages the utilization of novel circuit architectures. In this dissertation, novel analog and mixed-signal circuitry for system-assisted high-speed I/O links is presented. The novel circuitry expands upon traditional analog and mixed-signal circuit architectures in order to achieve system-level design goals and requirements without significant power or area overhead

Design of energy efficient high speed I/O interfaces

Energy efficiency has become a key performance metric for wireline high speed I/O interfaces. Consequently, design of low power I/O interfaces has garnered large interest that has mostly been focused on active power reduction techniques at peak data rate. In practice, most systems exhibit a wide range of data transfer patterns. As a result, low energy per bit operation at peak data rate does not necessarily translate to overall low energy operation. Therefore, I/O interfaces that can scale their power consumption with data rate requirement are desirable. Rapid on-off I/O interfaces have a potential to scale power with data rate requirements without severely affecting either latency or the throughput of the I/O interface. In this work, we explore circuit techniques for designing rapid on-off high speed wireline I/O interfaces and digital fractional-N PLLs. A burst-mode transmitter suitable for rapid on-off I/O interfaces is presented that achieves 6 ns turn-on time by utilizing a fast frequency settling ring oscillator in digital multiplying delay-locked loop and a rapid on-off biasing scheme for current mode output driver. Fabricated in 90 nm CMOS process, the prototype achieves 2.29 mW/Gb/s energy efficiency at peak data rate of 8 Gb/s. A 125X (8 Gb/s to 64 Mb/s) change in effective data rate results in 67X (18.29 mW to 0.27 mW) change in transmitter power consumption corresponding to only 2X (2.29 mW/Gb/s to 4.24 mW/Gb/s) degradation in energy efficiency for 32-byte long data bursts. We also present an analytical bit error rate (BER) computation technique for this transmitter under rapid on-off operation, which uses MDLL settling measurement data in conjunction with always-on transmitter measurements. This technique indicates that the BER bathtub width for 10^(−12) BER is 0.65 UI and 0.72 UI during rapid on-off operation and always-on operation, respectively. Next, a pulse response estimation-based technique is proposed enabling burst-mode operation for baud-rate sampling receivers that operate over high loss channels. Such receivers typically employ discrete time equalization to combat inter-symbol interference. Implementation details are provided for a receiver chip, fabricated in 65nm CMOS technology, that demonstrates efficacy of the proposed technique. A low complexity pulse response estimation technique is also presented for low power receivers that do not employ discrete time equalizers. We also present techniques for implementation of highly digital fractional-N PLL employing a phase interpolator based fractional divider to improve the quantization noise shaping properties of a 1-bit ∆Σ frequency-to-digital converter. Fabricated in 65nm CMOS process, the prototype calibration-free fractional-N Type-II PLL employs the proposed frequency-to-digital converter in place of a high resolution time-to-digital converter and achieves 848 fs rms integrated jitter (1 kHz-30 MHz) and -101 dBc/Hz in-band phase noise while generating 5.054 GHz output from 31.25 MHz input

Network-on-Chip

Limitations of bus-based interconnections related to scalability, latency, bandwidth, and power consumption for supporting the related huge number of on-chip resources result in a communication bottleneck. These challenges can be efficiently addressed with the implementation of a network-on-chip (NoC) system. This book gives a detailed analysis of various on-chip communication architectures and covers different areas of NoCs such as potentials, architecture, technical challenges, optimization, design explorations, and research directions. In addition, it discusses current and future trends that could make an impactful and meaningful contribution to the research and design of on-chip communications and NoC systems

Single-Laser Multi-Terabit/s Systems

Optical communication systems carry the bulk of all data traffic worldwide. This book introduces multi-Terabit/s transmission systems and three key technologies for next generation networks. A software-defined multi-format transmitter, an optical comb source and an optical processing scheme for the fast Fourier transform for Tbit/s signals. Three world records demonstrate the potential: The first single laser 10 Tbit/s and 26 Tbit/s OFDM and the first 32.5 Tbit/s Nyquist WDM experiments

Single-Laser Multi-Terabit/s Systems

Optical communication systems carry the bulk of all data traffic worldwide. This book introduces multi-Terabit/s transmission systems and three key technologies for next generation networks. A software-defined multi-format transmitter, an optical comb source and an optical processing scheme for the fast Fourier transform for Tbit/s signals. Three world records demonstrate the potential: The first single laser 10 Tbit/s and 26 Tbit/s OFDM and the first 32.5 Tbit/s Nyquist WDM experiments

Application of advanced on-board processing concepts to future satellite communications systems

An initial definition of on-board processing requirements for an advanced satellite communications system to service domestic markets in the 1990's is presented. An exemplar system architecture with both RF on-board switching and demodulation/remodulation baseband processing was used to identify important issues related to system implementation, cost, and technology development