Course grained low power design flow using UPF

Increased system complexity has led to the substitution of the traditional bottom-up design flow by systematic hierarchical design flow. The main motivation behind the evolution of such an approach is the increasing difficulty in hardware realization of complex systems. With decreasing channel lengths, few key problems such as timing closure, design sign-off, routing complexity, signal integrity, and power dissipation arise in the design flows. Specifically, minimizing power dissipation is critical in several high-end processors. In high-end processors, the design complexity contributes to the overall dynamic power while the decreasing transistor size results in static power dissipation. This research aims at optimizing the design flow for power and timing using the unified power format (UPF). UPF provides a strategic format to specify power-aware design information at every stage in the flow. The low power reduction techniques enforced in this research are multi-voltage, multi-threshold voltage (Vth), and power gating with state retention. An inherent design challenge addressed in this research is the choice of power optimization techniques as the flow advances from synthesis to physical design. A top-down digital design flow for a 32 bit MIPS RISC processor has been implemented with and without UPF synthesis flow for 65nm technology. The UPF synthesis is implemented with two voltages, 1.08V and 0.864V (Multi-VDD). Area, power and timing metrics are analyzed for the flows developed. Power savings of about 20 % are achieved in the design flow with \u27multi-threshold\u27 power technique compared to that of the design flow with no low power techniques employed. Similarly, 30 % power savings are achieved in the design flow with the UPF implemented when compared to that of the design flow with \u27multi-threshold\u27 power technique employed. Thus, a cumulative power savings of 42% has been achieved in a complete power efficient design flow (UPF) compared to that of the generic top-down standard flow with no power saving techniques employed. This is substantiated by the low voltage operation of modules in the design, reduction in clock switching power by gating clocks in the design and extensive use of HVT and LVT standard cells for implementation. The UPF synthesis flow saw the worst timing slack and more area when compared to those of the `multi-threshold\u27 or the generic flow. Percentage increase in the area with UPF is approximately 15%; a significant source for this increase being the additional power controlling logic added

Practical Techniques for Improving Performance and Evaluating Security on Circuit Designs

As the modern semiconductor technology approaches to nanometer era, integrated circuits (ICs) are facing more and more challenges in meeting performance demand and security. With the expansion of markets in mobile and consumer electronics, the increasing demands require much faster delivery of reliable and secure IC products. In order to improve the performance and evaluate the security of emerging circuits, we present three practical techniques on approximate computing, split manufacturing and analog layout automation. Approximate computing is a promising approach for low-power IC design. Although a few accuracy-configurable adder (ACA) designs have been developed in the past, these designs tend to incur large area overheads as they rely on either redundant computing or complicated carry prediction. We investigate a simple ACA design that contains no redundancy or error detection/correction circuitry and uses very simple carry prediction. The simulation results show that our design dominates the latest previous work on accuracy-delay-power tradeoff while using 39% less area. One variant of this design provides finer-grained and larger tunability than that of the previous works. Moreover, we propose a delay-adaptive self-configuration technique to further improve the accuracy-delay-power tradeoff. Split manufacturing prevents attacks from an untrusted foundry. The untrusted foundry has front-end-of-line (FEOL) layout and the original circuit netlist and attempts to identify critical components on the layout for Trojan insertion. Although defense methods for this scenario have been developed, the corresponding attack technique is not well explored. Hence, the defense methods are mostly evaluated with the k-security metric without actual attacks. We develop a new attack technique based on structural pattern matching. Experimental comparison with existing attack shows that the new attack technique achieves about the same success rate with much faster speed for cases without the k-security defense, and has a much better success rate at the same runtime for cases with the k-security defense. The results offer an alternative and practical interpretation for k-security in split manufacturing. Analog layout automation is still far behind its digital counterpart. We develop the layout automation framework for analog/mixed-signal ICs. A hierarchical layout synthesis flow which works in bottom-up manner is presented. To ensure the qualified layouts for better circuit performance, we use the constraint-driven placement and routing methodology which employs the expert knowledge via design constraints. The constraint-driven placement uses simulated annealing process to find the optimal solution. The packing represented by sequence pairs and constraint graphs can simultaneously handle different kinds of placement constraints. The constraint-driven routing consists of two stages, integer linear programming (ILP) based global routing and sequential detailed routing. The experiment results demonstrate that our flow can handle complicated hierarchical designs with multiple design constraints. Furthermore, the placement performance can be further improved by using mixed-size block placement which works on large blocks in priority

Bus-driven floorplanning.

Law Hoi Ying.Thesis (M.Phil.)--Chinese University of Hong Kong, 2005.Includes bibliographical references (leaves 101-106).Abstracts in English and Chinese.Chapter 1 --- Introduction --- p.1Chapter 1.1 --- VLSI Design Cycle --- p.2Chapter 1.2 --- Physical Design Cycle --- p.6Chapter 1.3 --- Floorplanning --- p.10Chapter 1.3.1 --- Floorplanning Objectives --- p.11Chapter 1.3.2 --- Common Approaches --- p.12Chapter 1.3.3 --- Interconnect-Driven Floorplanning --- p.14Chapter 1.4 --- Motivations and Contributions --- p.15Chapter 1.5 --- Organization of the Thesis --- p.17Chapter 2 --- Literature Review on 2D Floorplan Representations --- p.18Chapter 2.1 --- Types of Floorplans --- p.18Chapter 2.2 --- Floorplan Representations --- p.20Chapter 2.2.1 --- Slicing Floorplan --- p.21Chapter 2.2.2 --- Non-slicing Floorplan --- p.22Chapter 2.2.3 --- Mosaic Floorplan --- p.30Chapter 2.3 --- Summary --- p.35Chapter 3 --- Literature Review on 3D Floorplan Representations --- p.37Chapter 3.1 --- Introduction --- p.37Chapter 3.2 --- Problem Formulation --- p.38Chapter 3.3 --- Previous Work --- p.38Chapter 3.4 --- Summary --- p.42Chapter 4 --- Literature Review on Bus-Driven Floorplanning --- p.44Chapter 4.1 --- Problem Formulation --- p.44Chapter 4.2 --- Previous Work --- p.45Chapter 4.2.1 --- Abutment Constraint --- p.45Chapter 4.2.2 --- Alignment Constraint --- p.49Chapter 4.2.3 --- Bus-Driven Floorplanning --- p.52Chapter 4.3 --- Summary --- p.53Chapter 5 --- Multi-Bend Bus-Driven Floorplanning --- p.55Chapter 5.1 --- Introduction --- p.55Chapter 5.2 --- Problem Formulation --- p.56Chapter 5.3 --- Methodology --- p.57Chapter 5.3.1 --- Shape Validation --- p.58Chapter 5.3.2 --- Bus Ordering --- p.65Chapter 5.3.3 --- Floorplan Realization --- p.72Chapter 5.3.4 --- Simulated Annealing --- p.73Chapter 5.3.5 --- Soft Block Adjustment --- p.75Chapter 5.4 --- Experimental Results --- p.75Chapter 5.5 --- Summary --- p.77Chapter 6 --- Bus-Driven Floorplanning for 3D Chips --- p.80Chapter 6.1 --- Introduction --- p.80Chapter 6.2 --- Problem Formulation --- p.81Chapter 6.3 --- The Representation --- p.82Chapter 6.3.1 --- Overview --- p.82Chapter 6.3.2 --- Review of TCG --- p.83Chapter 6.3.3 --- Layered Transitive Closure Graph (LTCG) --- p.84Chapter 6.3.4 --- Aligning Blocks --- p.85Chapter 6.3.5 --- Solution Perturbation --- p.87Chapter 6.4 --- Simulated Annealing --- p.92Chapter 6.5 --- Soft Block Adjustment --- p.92Chapter 6.6 --- Experimental Results --- p.93Chapter 6.7 --- Summary --- p.94Chapter 6.8 --- Acknowledgement --- p.95Chapter 7 --- Conclusion --- p.99Bibliography --- p.10

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

A Modular Approach to Adaptive Reactive Streaming Systems

The latest generations of FPGA devices offer large resource counts that provide the headroom to implement large-scale and complex systems. However, there are increasing challenges for the designer, not just because of pure size and complexity, but also in harnessing effectively the flexibility and programmability of the FPGA. A central issue is the need to integrate modules from diverse sources to promote modular design and reuse. Further, the capability to perform dynamic partial reconfiguration (DPR) of FPGA devices means that implemented systems can be made reconfigurable, allowing components to be changed during operation. However, use of DPR typically requires low-level planning of the system implementation, adding to the design challenge. This dissertation presents ReShape: a high-level approach for designing systems by interconnecting modules, which gives a ‘plug and play’ look and feel to the designer, is supported by tools that carry out implementation and verification functions, and is carried through to support system reconfiguration during operation. The emphasis is on the inter-module connections and abstracting the communication patterns that are typical between modules – for example, the streaming of data that is common in many FPGA-based systems, or the reading and writing of data to and from memory modules. ShapeUp is also presented as the static precursor to ReShape. In both, the details of wiring and signaling are hidden from view, via metadata associated with individual modules. ReShape allows system reconfiguration at the module level, by supporting type checking of replacement modules and by managing the overall system implementation, via metadata associated with its FPGA floorplan. The methodology and tools have been implemented in a prototype for a broad domain-specific setting – networking systems – and have been validated on real telecommunications design projects

Floorplan-Aware High Performance NoC Design

Las actuales arquitecturas de m�ltiples n�cleos como los chip multiprocesadores (CMP) y soluciones multiprocesador para sistemas dentro del chip (MPSoCs) han adoptado a las redes dentro del chip (NoC) como elemento -ptimo para la inter-conexi-n de los diversos elementos de dichos sistemas. En este sentido, fabricantes de CMPs y MPSoCs han adoptado NoCs sencillas, generalmente con una topolog'a en malla o anillo, ya que son suficientes para satisfacer las necesidades de los sistemas actuales. Sin embargo a medida que los requerimientos del sistema -- baja latencia y alto rendimiento -- se hacen m�s exigentes, estas redes tan simples dejan de ser una soluci-n real. As', la comunidad investigadora ha propuesto y analizado NoCs m�s complejas. No obstante, estas soluciones son m�s dif'ciles de implementar -- especialmente los enlaces largos -- haciendo que este tipo de topolog'as complejas sean demasiado costosas o incluso inviables. En esta tesis, presentamos una metodolog'a de dise-o que minimiza la p�rdida de prestaciones de la red debido a su implementaci-n real. Los principales problemas que se encuentran al implementar una NoC son los conmutadores y los enlaces largos. En esta tesis, el conmutador se ha hecho modular, es decir, formado como uni-n de m-dulos m�s peque-os. En nuestro caso, los m-dulos son id�nticos, donde cada m-dulo es capaz de arbitrar, conmutar, y almacenar los mensajes que le llegan. Posteriormente, flexibilizamos la colocaci-n de estos m-dulos en el chip, permitiendo que m-dulos de un mismo conmutador est�n distribuidos por el chip. Esta metodolog'a de dise-o la hemos aplicado a diferentes escenarios. Primeramente, hemos introducido nuestro conmutador modular en NoCs con topolog'as conocidas como la malla 2D. Los resultados muestran como la modularidad y la distribuci-n del conmutador reducen la latencia y el consumo de potencia de la red. En segundo lugar, hemos utilizado nuestra metodolog'a de dise-o para implementar un crossbar distribuidRoca Pérez, A. (2012). Floorplan-Aware High Performance NoC Design [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/17844Palanci

Practical Techniques for Improving Performance and Evaluating Security on Circuit Designs

As the modern semiconductor technology approaches to nanometer era, integrated circuits (ICs) are facing more and more challenges in meeting performance demand and security. With the expansion of markets in mobile and consumer electronics, the increasing demands require much faster delivery of reliable and secure IC products. In order to improve the performance and evaluate the security of emerging circuits, we present three practical techniques on approximate computing, split manufacturing and analog layout automation. Approximate computing is a promising approach for low-power IC design. Although a few accuracy-configurable adder (ACA) designs have been developed in the past, these designs tend to incur large area overheads as they rely on either redundant computing or complicated carry prediction. We investigate a simple ACA design that contains no redundancy or error detection/correction circuitry and uses very simple carry prediction. The simulation results show that our design dominates the latest previous work on accuracy-delay-power tradeoff while using 39% less area. One variant of this design provides finer-grained and larger tunability than that of the previous works. Moreover, we propose a delay-adaptive self-configuration technique to further improve the accuracy-delay-power tradeoff. Split manufacturing prevents attacks from an untrusted foundry. The untrusted foundry has front-end-of-line (FEOL) layout and the original circuit netlist and attempts to identify critical components on the layout for Trojan insertion. Although defense methods for this scenario have been developed, the corresponding attack technique is not well explored. Hence, the defense methods are mostly evaluated with the k-security metric without actual attacks. We develop a new attack technique based on structural pattern matching. Experimental comparison with existing attack shows that the new attack technique achieves about the same success rate with much faster speed for cases without the k-security defense, and has a much better success rate at the same runtime for cases with the k-security defense. The results offer an alternative and practical interpretation for k-security in split manufacturing. Analog layout automation is still far behind its digital counterpart. We develop the layout automation framework for analog/mixed-signal ICs. A hierarchical layout synthesis flow which works in bottom-up manner is presented. To ensure the qualified layouts for better circuit performance, we use the constraint-driven placement and routing methodology which employs the expert knowledge via design constraints. The constraint-driven placement uses simulated annealing process to find the optimal solution. The packing represented by sequence pairs and constraint graphs can simultaneously handle different kinds of placement constraints. The constraint-driven routing consists of two stages, integer linear programming (ILP) based global routing and sequential detailed routing. The experiment results demonstrate that our flow can handle complicated hierarchical designs with multiple design constraints. Furthermore, the placement performance can be further improved by using mixed-size block placement which works on large blocks in priority