Book Review

A Scholarly Review of “Error Control for Network-On-Chip Links” (Authors: Bo Fu and Paul Ampadu, 2012)Fu, B.; and Ampadu, P. 2012. Error Control for Network-On-Chip Links.Springer Science+Business Media, LLC, New York, NY, USA.Available: <http://dx.doi.org/10.1007/978-1-4419-9313-7>

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Low-Power Embedded Design Solutions and Low-Latency On-Chip Interconnect Architecture for System-On-Chip Design

This dissertation presents three design solutions to support several key system-on-chip (SoC) issues to achieve low-power and high performance. These are: 1) joint source and channel decoding (JSCD) schemes for low-power SoCs used in portable multimedia systems, 2) efficient on-chip interconnect architecture for massive multimedia data streaming on multiprocessor SoCs (MPSoCs), and 3) data processing architecture for low-power SoCs in distributed sensor network (DSS) systems and its implementation. The first part includes a low-power embedded low density parity check code (LDPC) - H.264 joint decoding architecture to lower the baseband energy consumption of a channel decoder using joint source decoding and dynamic voltage and frequency scaling (DVFS). A low-power multiple-input multiple-output (MIMO) and H.264 video joint detector/decoder design that minimizes energy for portable, wireless embedded systems is also designed. In the second part, a link-level quality of service (QoS) scheme using unequal error protection (UEP) for low-power network-on-chip (NoC) and low latency on-chip network designs for MPSoCs is proposed. This part contains WaveSync, a low-latency focused network-on-chip architecture for globally-asynchronous locally-synchronous (GALS) designs and a simultaneous dual-path routing (SDPR) scheme utilizing path diversity present in typical mesh topology network-on-chips. SDPR is akin to having a higher link width but without the significant hardware overhead associated with simple bus width scaling. The last part shows data processing unit designs for embedded SoCs. We propose a data processing and control logic design for a new radiation detection sensor system generating data at or above Peta-bits-per-second level. Implementation results show that the intended clock rate is achieved within the power target of less than 200mW. We also present a digital signal processing (DSP) accelerator supporting configurable MAC, FFT, FIR, and 3-D cross product operations for embedded SoCs. It consumes 12.35mW along with 0.167mm2 area at 333MHz

A Novel Encoding Scheme for Cross-Talk Effect Minimization Using Error Detecting and Correcting Codes

Abstract-In this paper a new bus encoding method presented for reducing crosstalk effects, which can avoid crosstalk and provide error-correcting as well. This method find a subset from cross talk avoidance code (CAC) to provide error correction which allows to reduce the crosstalk-induced delay with buses implementing an error detecting/correcting code. Here we propose Fibonacci representation of single error correcting codes using Hamming code to avoid crosstalk induced delay. Extra wires for checking bus are never required in the proposed method and it can also improve bus performance and reduce power dissipation. We give algorithms for obtaining optimal encodings and present a particular class of error free codes. Conversely other bus encoding techniques have been used to prevent crosstalk but don't correct error

Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

Novel Front-end Electronics for Time Projection Chamber Detectors

Este trabajo ha sido realizado en la Organización Europea para la Investigación Nuclear (CERN) y forma parte del proyecto de investigación Europeo para futuros aceleradores lineales (EUDET). En física de partículas existen diferentes categorías de detectores de partículas. El diseño presentado esta centrado en un tipo particular de detector de trayectoria de partículas denominado TPC (Time Projection Chamber) que proporciona una imagen en tres dimensiones de las partículas eléctricamente cargadas que atraviesan su volumen gaseoso. La tesis incluye un estudio de los objetivos para futuros detectores, resumiendo los parámetros que un sistema de adquisición de datos debe cumplir en esos casos. Además, estos requisitos son comparados con los actuales sistemas de lectura utilizados en diferentes detectores TPC. Se concluye que ninguno de los sistemas cumple las restrictivas condiciones. Algunos de los principales objetivos para futuros detectores TPC son un altísimo nivel de integración, incremento del número de canales, electrónica más rápida y muy baja potencia. El principal inconveniente del estado del arte de los sistemas anteriores es la utilización de varios circuitos integrados en la cadena de adquisición. Este hecho hace imposible alcanzar el altísimo nivel de integración requerido para futuros detectores. Además, un aumento del número de canales y frecuencia de muestreo haría incrementar hasta valores no permitidos la potencia utilizada. Y en consecuencia, incrementar la refrigeración necesaria (en caso de ser posible). Una de las novedades presentadas es la integración de toda la cadena de adquisición (filtros analógicos de entrada, conversor analógico-digital (ADC) y procesado de señal digital) en un único circuito integrado en tecnología de 130nm. Este chip es el primero que realiza esta altísima integración para detectores TPC. Por otro lado, se presenta un análisis detallado de los filtros de procesado de señal. Los objetivos más importantes es la reduccióGarcía García, EJ. (2012). Novel Front-end Electronics for Time Projection Chamber Detectors [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/16980Palanci

Overcoming the Challenges for Multichip Integration: A Wireless Interconnect Approach

The physical limitations in the area, power density, and yield restrict the scalability of the single-chip multicore system to a relatively small number of cores. Instead of having a large chip, aggregating multiple smaller chips can overcome these physical limitations. Combining multiple dies can be done either by stacking vertically or by placing side-by-side on the same substrate within a single package. However, in order to be widely accepted, both multichip integration techniques need to overcome significant challenges. In the horizontally integrated multichip system, traditional inter-chip I/O does not scale well with technology scaling due to limitations of the pitch. Moreover, to transfer data between cores or memory components from one chip to another, state-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the target chip over a wireline interconnect fabric. This multi-hop communication increases energy consumption while decreasing data bandwidth in a multichip system. On the other hand, in vertically integrated multichip system, the high power density resulting from the placement of computational components on top of each other aggravates the thermal issues of the chip leading to degraded performance and reduced reliability. Liquid cooling through microfluidic channels can provide cooling capabilities required for effective management of chip temperatures in vertical integration. However, to reduce the mechanical stresses and at the same time, to ensure temperature uniformity and adequate cooling competencies, the height and width of the microchannels need to be increased. This limits the area available to route Through-Silicon-Vias (TSVs) across the cooling layers and make the co-existence and co-design of TSVs and microchannels extreamly challenging. Research in recent years has demonstrated that on-chip and off-chip wireless interconnects are capable of establishing radio communications within as well as between multiple chips. The primary goal of this dissertation is to propose design principals targeting both horizontally and vertically integrated multichip system to provide high bandwidth, low latency, and energy efficient data communication by utilizing mm-wave wireless interconnects. The proposed solution has two parts: the first part proposes design methodology of a seamless hybrid wired and wireless interconnection network for the horizontally integrated multichip system to enable direct chip-to-chip communication between internal cores. Whereas the second part proposes a Wireless Network-on-Chip (WiNoC) architecture for the vertically integrated multichip system to realize data communication across interlayer microfluidic coolers eliminating the need to place and route signal TSVs through the cooling layers. The integration of wireless interconnect will significantly reduce the complexity of the co-design of TSV based interconnects and microchannel based interlayer cooling. Finally, this dissertation presents a combined trade-off evaluation of such wireless integration system in both horizontal and vertical sense and provides future directions for the design of the multichip system

Hardware-Software Integrated Silicon Photonic Systems

Fabrication of integrated photonic devices and circuits in a CMOS-compatible process or foundry is the essence of the silicon photonic platform. Optical devices in this platform are enabled by the high index contrast between silicon and silicon on insulator. These devices offer potential benefits when integrated with existing and emerging high performance microelectronics. Integration of silicon photonics with small footprints and power-efficient and high-bandwidth operation has long been cited as a solution to existing issues in high performance interconnects for telecommunications and data communication. Stemming from this historic application in communications, new applications in sensing arrays, biochemistry, and even entertainment continue to grow. However, for many technologies to successfully adopt silicon photonics and reap the perceived benefits, the silicon photonic platform must extend toward development of a full ecosystem. Such extension includes implementation of low cost and robust electronic-photonic packaging techniques for all applications. In an ecosystem implemented with services ranging from device fabrication all the way to packaged products, ease-of-use and ease-of-deployment in systems that require many hardware and software components becomes possible. With the onset of the Internet of Things (IoT), nearly all technologies—sensors, compute, communication devices, etc.—persist in systems with some level of localized or distributed software interaction. These interactions often require a level of networked communications. For silicon photonics to penetrate technologies comprising IoT, it is advantageous to implement such devices in a hardware-software integrated way. Meaning, all functionalities and interactions related to the silicon photonic devices are well defined in terms of the physicality of the hardware. This hardware is then abstracted into various levels of software as needed in the system. The power of hardware-software integration allows many of the piece-wise demonstrated functionalities of silicon photonics to easily translate to commercial implementation. This work begins by briefly highlighting the challenges and solutions for transforming existing silicon photonic platforms to a full-fledged silicon photonic ecosystem. The highlighted solutions in development consist of tools for fabrication, testing, subsystem packaging, and system validation. Building off the knowledge of a silicon photonic ecosystem in development, this work continues by demonstrating various levels of hardware-software integration. These are primarily focused on silicon photonic interconnects. The first hardware-software integration-focused portion of this work explores silicon microring-based devices as a key building block for greater silicon photonic subsystems. The microring’s sensitivity to thermal fluctuations is identified not as a flaw, but as a tool for functionalization. A logical control system is implemented to mitigate thermal effects that would normally render a microring resonator inoperable. The mechanism to control the microring is extended and abstracted with software programmability to offer wavelength routing as a network primitive. This functionality, available through hardware-software integration, offers the possibility for ubiquitous deployment of such microring devices in future photonic interconnection networks. The second hardware-software integration-focused portion of this work explores dynamic silicon photonic switching devices and circuits. Specifically, interactions with and implications of high-speed data propagation and link layer control are demonstrated. The characteristics of photonic link setup include transients due to physical layer optical effects, latencies involved with initializing burst mode links, and optical link quality. The impacts on the functionalities and performance offered by photonic devices are explored. An optical network interface platform is devised using FPGAs to encapsulate hardware and software for controlling these characteristics using custom hardware description language, firmware, and software. A basic version of a silicon photonic network controller using FPGAs is used as a tool to demonstrate a highly scalable switch architecture using microring resonators. This architecture would not be possible without some semblance of this controller, combined with advanced electronic-photonic packaging. A more advanced deployment of the network interface platform is used to demonstrate a method for accelerating photonic links using out-of-band arbitration. A first demonstration of this platform is performed on a silicon photonic microring router network. A second demonstration is used to further explore the feasibility of full hardware-software integrated photonic device actuation, link layer control, and out-of-band arbitration. The demonstration is performed on a complete silicon photonic network with both spatial switching and wavelength routing functionalities. The aforementioned hardware-software integration mechanisms are rigorously tested for data communications applications. Capabilities are shown for very reliable, low latency, and dynamic high-speed data delivery using silicon photonic devices. Applying these mechanisms to complete electronic-photonic packaged subsystems provides a strong path to commercial manifestations of functional silicon photonic devices

C-MOS array design techniques: SUMC multiprocessor system study

The current capabilities of LSI techniques for speed and reliability, plus the possibilities of assembling large configurations of LSI logic and storage elements, have demanded the study of multiprocessors and multiprocessing techniques, problems, and potentialities. Evaluated are three previous systems studies for a space ultrareliable modular computer multiprocessing system, and a new multiprocessing system is proposed that is flexibly configured with up to four central processors, four 1/0 processors, and 16 main memory units, plus auxiliary memory and peripheral devices. This multiprocessor system features a multilevel interrupt, qualified S/360 compatibility for ground-based generation of programs, virtual memory management of a storage hierarchy through 1/0 processors, and multiport access to multiple and shared memory units