Superfluidity of the BEC at finite temperature

We use the classical fields approximation to study a translational flow of the condensate with respect to the thermal cloud in a weakly interacting Bose gas. We study both, subcritical and supercritical relative velocity cases and analyze in detail a state of stationary flow which is reached in the dynamics. This state corresponds to the thermal equilibrium, which is characterized by the relative velocity of the condensate and the thermal cloud. The superfluidity manifests itself in the existence of many thermal equilibria varying in (the value of this velocity) the relative velocity between the condensate and the thermal cloud. We pay a particular attention to excitation spectra in a phonon as well as in a particle regime. Finally, we introduce a measure of the amount of the superfluid fraction in a weakly interacting Bose gas, allowing for the precise distinction between the superfluid and the condensed fractions in a single and consistent framework.Comment: 8 pages, 5 figure

Multi-objective Layout Optimization of a Generic Hybrid-cooled Data Centre Blade Server

The rapid global increase in energy consumption by data centres requires new improved cooling solutions and techniques to be developed and implemented. In a typical data centre, approximately a third of the total power consumption is needed for the cooling infrastructure, resulting in high power usage effectiveness (PUE) values. The main culprits of raised PUE are legacy air-cooled data centres, exhausting only low grade waste heat for which capture and re-use is challenging. This study investigates numerically the potential for energy recuperation by a server-level internal layout optimization for a hybrid air/liquid-cooled server. The approach combines multi-objective genetic algorithm (MOGA) and entropy generation minimization (EGM) techniques to incorporate the multiple objectives involved in solving this problem, and examines the cooling performance and waste heat recovery potential. In order to evaluate the potential for waste heat recovery, an extra entropy generation term ṠΔT,ext role= presentation style= box-sizing: border-box; margin: 0px; padding: 0px; display: inline-block; line-height: normal; font-size: 16.2px; word-spacing: normal; overflow-wrap: normal; white-space: nowrap; float: none; direction: ltr; max-width: none; max-height: none; min-width: 0px; min-height: 0px; border: 0px; position: relative; \u3eṠΔT,extis introduced, representing an air/liquid heat exchanger at the rear of the server. The effect of modifying the internal component layout on pressure drop and the outlet temperature profile are of primary interest, due to their direct impact on fan power usage and energy recuperation potential. The CFD model of the baseline configuration is validated using experimental pressure measurements conducted on a real blade server. The research demonstrates that a basic server layout optimization such as changing the memory module angles and spacing could enhance both the cooling effectiveness but also improve the potential for waste heat recovery from the air stream. The maximum reduction in entropy generation rate due to server layout optimization is 15%, while the outlet temperature uniformity can be improved by up to 42%

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs incur amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies, alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. In this monograph, we provide an overall survey on the recent advances in temperature-aware 3D MPSoC considerations. We explore the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. Our aim of proposing this survey is to provide a global perspective, highlighting the advancements and drawbacks on the recent state-of-the-ar

Numerical Modelling of Convection‑Driven Cooling, Deformation and Fracturing of Thermo‑Poroelastic Media

Convection-driven cooling in porous media influences thermo-poro-mechanical stresses, thereby causing deformation. These processes are strongly influenced by the presence of fractures, which dominate flow and heat transfer. At the same time, the fractures deform and propagate in response to changes in the stress state. Mathematically, the model governing the physics is tightly coupled and must account for the strong discontinuities introduced by the fractures. Over the last decade, and motivated by a number of porous media applications, research into such coupled models has advanced modelling of processes in porous media substantially. Building on this effort, this work presents a novel model that couples fracture flow and heat transfer and deformation and propagation of fractures with flow, heat transfer and thermo-poroelasticity in the matrix. The model is based on explicit representation of fractures in the porous medium and discretised using multi-point finite volume methods. Frictional contact and non-penetration conditions for the fractures are handled through active set methods, while a propagation criterion based on stress intensity factors governs fracture extension. Considering both forced and natural convection processes, numerical results show the intricate nature of thermo-poromechanical fracture deformation and propagation.publishedVersio

Improving processor efficiency through thermal modeling and runtime management of hybrid cooling strategies

One of the main challenges in building future high performance systems is the ability to maintain safe on-chip temperatures in presence of high power densities. Handling such high power densities necessitates novel cooling solutions that are significantly more efficient than their existing counterparts. A number of advanced cooling methods have been proposed to address the temperature problem in processors. However, tradeoffs exist between performance, cost, and efficiency of those cooling methods, and these tradeoffs depend on the target system properties. Hence, a single cooling solution satisfying optimum conditions for any arbitrary system does not exist. This thesis claims that in order to reach exascale computing, a dramatic improvement in energy efficiency is needed, and achieving this improvement requires a temperature-centric co-design of the cooling and computing subsystems. Such co-design requires detailed system-level thermal modeling, design-time optimization, and runtime management techniques that are aware of the underlying processor architecture and application requirements. To this end, this thesis first proposes compact thermal modeling methods to characterize the complex thermal behavior of cutting-edge cooling solutions, mainly Phase Change Material (PCM)-based cooling, liquid cooling, and thermoelectric cooling (TEC), as well as hybrid designs involving a combination of these. The proposed models are modular and they enable fast and accurate exploration of a large design space. Comparisons against multi-physics simulations and measurements on testbeds validate the accuracy of our models (resulting in less than 1C error on average) and demonstrate significant reductions in simulation time (up to four orders of magnitude shorter simulation times). This thesis then introduces temperature-aware optimization techniques to maximize energy efficiency of a given system as a whole (including computing and cooling energy). The proposed optimization techniques approach the temperature problem from various angles, tackling major sources of inefficiency. One important angle is to understand the application power and performance characteristics and to design management techniques to match them. For workloads that require short bursts of intense parallel computation, we propose using PCM-based cooling in cooperation with a novel Adaptive Sprinting technique. By tracking the PCM state and incorporating this information during runtime decisions, Adaptive Sprinting utilizes the PCM heat storage capability more efficiently, achieving 29\% performance improvement compared to existing sprinting policies. In addition to the application characteristics, high heterogeneity in on-chip heat distribution is an important factor affecting efficiency. Hot spots occur on different locations of the chip with varying intensities; thus, designing a uniform cooling solution to handle worst-case hot spots significantly reduces the cooling efficiency. The hybrid cooling techniques proposed as part of this thesis address this issue by combining the strengths of different cooling methods and localizing the cooling effort over hot spots. Specifically, the thesis introduces LoCool, a cooling system optimizer that minimizes cooling power under temperature constraints for hybrid-cooled systems using TECs and liquid cooling. Finally, the scope of this work is not limited to existing advanced cooling solutions, but it also extends to emerging technologies and their potential benefits and tradeoffs. One such technology is integrated flow cell array, where fuel cells are pumped through microchannels, providing both cooling and on-chip power generation. This thesis explores a broad range of design parameters including maximum chip temperature, leakage power, and generated power for flow cell arrays in order to maximize the benefits of integrating this technology with computing systems. Through thermal modeling and runtime management techniques, and by exploring the design space of emerging cooling solutions, this thesis provides significant improvements in processor energy efficiency.2018-07-09T00:00:00

Aeronautical engineering: A special bibliography with indexes, supplement 80

This bibliography lists 277 reports, articles, and other documents introduced into the NASA scientific and technical information system in January 1977

The MANGO FET-HPC Project: an overview

© 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.In this paper, we provide an overview of the MANGO project and its goal. The MANGO project aims at addressing power, performance and predictability (the PPP space) in future High-Performance Computing systems. It starts from the fundamental intuition that effective techniques for all three goals ultimately rely on customization to adapt the computing resources to reach the desired Quality of Service (QoS). From this starting point, MANGO will explore different but interrelated mechanisms at various architectural levels, as well as at the level of the system software. In particular, to explore a new positioning across the PPP space, MANGO will investigate system-wide, holistic, proactive thermal and power management aimed at extreme-scale energy efficiency.The MANGO project starts in October 2015 and is funded by the European Commission under the Horizon 2020 FET-HPC program. This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 671668.Flich Cardo, J.; Agosta, G.; Ampletzer, P.; Atienza Alonso, D.; Cilardo, A.; Fornaciari, W.; Kovac, M.... (2015). The MANGO FET-HPC Project: an overview. IEEE Computer Society. https://doi.org/10.1109/CSE.2015.57

Application and Benchmark of SPH for Modeling the Impact in Thermal Spraying

The properties of a thermally sprayed coating, such as its durability or thermal conductivity depend on its microstructure, which is in turn directly related to the particle impact process. To simulate this process we present a 3D Smoothed Particle Hydrodynamics (SPH) model, which represents the molten droplet as an incompressible fluid, while a semi-implicit Enthalpy-Porosity method is applied for the mushy zone during solidification. In addition, we present an implicit correction for SPH simulations, based on well known approaches, from which we can observe improved performance and simulation stability. We apply our SPH method to the impact and solidification of Al$_2$O$_3$ droplets onto a free slip substrate and perform a rigorous quantitative comparison of our method with the commercial software Ansys Fluent using the Volume of Fluid (VOF) approach, while taking identical physical effects into consideration. The results are evaluated in depth and we discuss the applicability of either method for the simulation of thermal spray deposition. We show that SPH is an excellent method for solving this free surface problem accurately and efficiently