Realization of a single-chip, SiGe:C-based power amplifier for multi-band WiMAX applications

A fully-integrated Multi-Band PA using 0.25 μm SiGe:C process with an output power of above 25 dBm is presented. The behaviour of the amplifier has been optimized for multi-band operation covering, 2.4 GHz, 3.6 GHz and 5.4 GHz (UWB-WiMAX) frequency bands for higher 1-dB compression point and efficiency. Multi-band operation is achieved using multi-stage topology. Parasitic components of active devices are also used as matching components, in turn decreasing the number of matching component. Measurement results of the PA provided the following performance parameters: 1-dB compression point of 20.5 dBm, gain value of 23 dB and efficiency value of %7 operation for the 2.4 GHz band; 1-dB compression point of 25.5 dBm, gain value of 31.5 dB and efficiency value of %17.5 for the 3.6 GHz band; 1-dB compression point of 22.4 dBm, gain value of 24.4 dB and efficiency value of %9.5 for the 5.4 GHz band. Measurement results show that using multi-stage topologies and implementing each parasitic as part of the matching network component has provided a wider-band operation with higher output power levels, above 25 dBm, with SiGe:C process

A 28 GHz 0.18-μm CMOS cascade power amplifier with reverse body bias technique

A 28 GHz power amplifier (PA) using CMOS 0.18 μm Silterra process technology is reported. The cascade configuration has been adopted to obtain high Power Added Efficiency (PAE). To achieve low power consumption, the input stage adopts reverse body bias technique. The simulation results show that the proposed PA consumes 32.03mW and power gain (S21) of 9.51 dB is achieved at 28 GHz. The PA achieves saturated power (Psat) of 11.10 dBm and maximum PAE of 16.55% with output 1-dB compression point (OP1dB) 8.44 dBm. These results demonstrate the proposed power amplifier architecture is suitable for 5G applications

Phased Array Systems in Silicon

Phased array systems, a special case of MIMO systems, take advantage of spatial directivity and array gain to increase spectral efficiency. Implementing a phased array system at high frequency in a commercial silicon process technology presents several challenges. This article focuses on the architectural and circuit-level trade-offs involved in the design of the first silicon-based fully integrated phased array system operating at 24 GHz. The details of some of the important circuit building blocks are also discussed. The measured results demonstrate the feasibility of using integrated phased arrays for wireless communication and vehicular radar applications at 24 GHz

Design architectures of the CMOS power amplifier for 2.4 GHz ISM band applications: An overview

Power amplifiers (PAs) are among the most crucial functional blocks in the radio frequency (RF) frontend for reliable wireless communication. PAs amplify and boost the input signal to the required output power. The signal is amplified to make it sufficiently high for the transmitter to propagate the required distance to the receiver. Attempted advancements of PA have focused on attaining high-performance RF signals for transmitters. Such PAs are expected to require low power consumption while producing a relatively high output power with a high efficiency. However, current PA designs in nanometer and micrometer complementary metal–oxide semiconductor (CMOS) technology present inevitable drawbacks, such as oxide breakdown and hot electron effect. A well-defined architecture, including a linear and simple functional block synthesis, is critical in designing CMOS PA for various applications. This article describes the different state-of-the art design architectures of CMOS PA, including their circuit operations, and analyzes the performance of PAs for 2.4 GHz ISM (industrial, scientific, and medical) band applications

RF to Millimeter-wave Linear Power Amplifiers in Nanoscale CMOS SOI Technology

The low manufacturing cost, integration capability with baseband and digital circuits, and high operating frequency of nanoscale CMOS technologies have propelled their applications into RF and microwave systems. Implementing fully-integrated RF to millimeter-wave (mm-wave) CMOS power amplifiers (PAs), nevertheless, remains challenging due to the low breakdown voltages of CMOS transistors and the loss from on-chip matching networks. These limitations have reduced the design space of CMOS power amplifiers to narrow-band, low linearity metrics often with insufficient gain, output power, and efficiency. A new topology for implementing power amplifiers based on stacking of CMOS SOI transistors is proposed. The input RF power is coupled to the transistors using on-chip transformers, while the gate terminal of teach transistor is dynamically biased from the output node. The output voltages of the stacked transistors are added constructively to increase the total output voltage swing and output power. Moreover, the stack configuration increases the optimum load impedance of the PA to values close to 50 ohm, leading to power, efficiency and bandwidth enhancements. Practical design issues such as limitation in the number of stacked transistors, gate oxide breakdown, stability, effect of parasitic capacitances on the performance of the PA and large chip areas have also been addressed. Fully-integrated RF to mm-wave frequency CMOS SOI PAs are successfully implemented and measured using the proposed topology

Design And Implementation Of An X-Band Passive Rfid Tag

This research presents a novel fully integrated energy harvester, matching network, matching network,matching network, matching network,matching network, matching network, matching network, multi-stage RF-DC rectifier, mode selector, RC oscillator, LC oscillator, and X-band power amplifier implemented in IBM 0.18-µm RF CMOS technology. We investigated different matching schemes, antennas, and rectifiers with focus on the interaction between building blocks. Currently the power amplifier gives the maximum output power of 5.23 dBm at 9.1GHz. The entire RFID tag circuit was designed to operate in low power consumption. Voltage sensor circuit which generates the enable signal was designed to operate in very low current. All the test blocks of the RFID tag were tested. The smaller size and the cost of the RFID tag are critical for widespread adoption of the technology. The cost of the RFID tag can be lowered by implementing an on-chip antenna. We were able to develop, fabricate, and implement a fully integrated RFID tag in a smaller size (3 mm X 1.5 mm) than the existing tags. With further modifications, this could be used as a commercial low cost RFID tag

A 2.4 GHz CMOS class-F power amplifier with reconfigurable load-impedance matching

© 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.A novel reconfigurable CMOS class-F power amplifier (PA) at 2.4 GHz is proposed in this paper. It is able to match the output load variations mainly due to the effect of hand and head on a mobile phone. The effect of load variation on power-added efficiency (PAE), output power, and distortion is compensated by reconfiguring the output network using an impedance tuner. The tuner controls the output matching at fundamental frequency without affecting the class-F harmonic tuning up to 3rd harmonic. To the best of our knowledge, this is the first design of a CMOS class-F PA addressed to compensate the effect of load variation. Measurement results for 50 ohm load impedance show a maximum PAE of 26% and maximum output power of 19.2 dBm. The measured total harmonic distortion is 4.9%. Measurement results for load values other than 50 ohm show that PAE increases from 6.5% (not-tuned PA) up to 19.9% (tuned PA) with the same output power (19.2 dBm). Tuning also reduces the adjacent-channel leakage ratio by 5 dB and the spectral regrowth of a Wi-Fi signal at the PA output. The size of the fabricated chip is 1.6 mm × 1.6 mm.Peer ReviewedPostprint (author's final draft

High frequency of low noise amplifier architecture for WiMAX application: A review

The low noise amplifier (LNA) circuit is exceptionally imperative as it promotes and initializes general execution performance and quality of the mobile communication system. LNA's design in radio frequency (R.F.) circuit requires the trade-off numerous imperative features' including gain, noise figure (N.F.), bandwidth, stability, sensitivity, power consumption, and complexity. Improvements to the LNA's overall performance should be made to fulfil the worldwide interoperability for microwave access (WiMAX) specifications' prerequisites. The development of front-end receiver, particularly the LNA, is genuinely pivotal for long-distance communications up to 50 km for a particular system with particular requirements. The LNA architecture has recently been designed to concentrate on a single transistor, cascode, or cascade constrained in gain, bandwidth, and noise figure

High Efficiency, Good phase linearity 0.18 µm CMOS Power Amplifier for MBAN-UWB Applications

This paper presents the design of 3.1-10.6 GHz class AB power amplifier (PA) suitable for medical body area network (MBAN) Ultra-Wide Band (UWB) applications in TSMC 0.18 µm technology. An optimization technique to simultaneously maximize power added efficiency(PAE) and minimize group delay variation is employed. Source and Load-pull contours are used to design inter and output stage matching circuits. The post-layout simulation results indicated that the designed PA has a maximum PAE of 32 % and an output 1-dB compression of 11 dBm at 4 GHz. In addition, a small group delay variation of ± 50 ps was realized over the whole required frequency band . Moreover, the proposed PA has small signal power gain (S21) of 12.5 dB with ripple less than 1.5 dB over the frequency range between 3.1 GHz to 10.6 GHz, while consuming 36 mW

A -5 dBm 400MHz OOK Transmitter for Wireless Medical Application

A 400 MHz high efficiency transmitter forwireless medical application is presented in this paper. Transmitter architecture with high-energy efficiencies isproposed to achieve high data rate with low powerconsumption. In the on-off keying transmitters, the oscillatorand power amplifier are turned off when the transmittersends 0 data. The proposed class-e power amplifier has highefficiency for low level output power. The proposed on-offkeying transmitter consumes 1.52 mw at -5 dBm output by 40Mbps data rate and energy consumption 38 pJ/bit. Theproposed transmitter has been designed in 0.18µm CMOStechnology