High-speed equalization and transmission in electrical interconnections

The relentless growth of data traffic and increasing digital signal processing capabilities of integrated circuits (IC) are demanding ever faster chip-to-chip / chip-to-module serial electrical interconnects. As data rates increase, the signal quality after transmission over printed circuit board (PCB) interconnections is severely impaired. Frequency-dependent loss and crosstalk noise lead to a reduced eye opening, a reduced signal-to-noise ratio and an increased inter-symbol interference (ISI). This, in turn, requires the use of improved signal processing or PCB materials, in order to overcome the bandwidth (BW) limitations and to improve signal integrity. By applying an optimal combination of equalizer and receiver electronics together with BW-efficient modulation schemes, the transmission rate over serial electrical interconnections can be pushed further. At the start of this research, most industrial backplane connectors, meeting the IEEE and OIF specifications such as manufactured by e.g. FCI or TE connectivity, had operational capabilities of up to 25 Gb/s. This research was mainly performed under the IWT ShortTrack project. The goal of this research was to increase the transmission speed over electrical backplanes up to 100 Gb/s per channel for next-generation telecom systems and data centers. This requirement greatly surpassed the state-ofthe-art reported in previous publications, considering e.g. 25 Gb/s duobinary and 42.8 Gb/s PAM-4 transmission over a low-loss Megtron 6 electrical backplane using off-line processing. The successful implementation of the integrated transmitter (TX) and receiver (RX) (1) , clearly shows the feasibility of single lane interconnections beyond 80 Gb/s and opens the potential of realizing industrial 100 Gb/s links using a recent IC technology process. Besides the advancement of the state-of-the-art in the field of high-speed transceivers and backplane transmission systems, which led to several academic publications, the output of this work also attracts a lot of attention from the industry, showing the potential to commercialize the developed chipset and technologies used in this research for various applications: not only in high-speed electrical transmission links, but also in high-speed opto-electronic communications such as access, active optical cables and optical backplanes. In this dissertation, the background of this research, an overview of this work and the thesis organization are illustrated in Chapter 1. In Chapter 2, a system level analysis is presented, showing that the channel losses are limiting the transmission speed over backplanes. In order to enhance the serial data rate over backplanes and to eliminate the signal degradation, several technologies are discussed, such as signal equalization and modulation techniques. First, a prototype backplane channel, from project partner FCI, implemented with improved backplane connectors is characterized. Second, an integrated transversal filter as a feed-forward equalizer (FFE) is selected to perform the signal equalization, based on a comprehensive consideration of the backplane channel performance, equalization capabilities, implementation complexity and overall power consumption. NRZ, duobinary and PAM-4 are the three most common modulation schemes for ultra-high speed electrical backplane communication. After a system-level simulation and comparison, the duobinary format is selected due to its high BW efficiency and reasonable circuit complexity. Last, different IC technology processes are compared and the ST microelectronics BiCMOS9MW process (featuring a fT value of over 200 GHz) is selected, based on a trade-off between speed and chip cost. Meanwhile it also has a benefit for providing an integrated microstrip model, which is utilized for the delay elements of the FFE. Chapter 3 illustrates the chip design of the high-speed backplane TX, consisting of a multiplexer (MUX) and a 5-tap FFE. The 4:1 MUX combines four lower rate streams into a high-speed differential NRZ signal up to 100 Gb/s as the FFE input. The 5-tap FFE is implemented with a novel topology for improved testability, such that the FFE performance can be individually characterized, in both frequency- and time-domain, which also helps to perform the coefficient optimization of the FFE. Different configurations for the gain cell in the FFE are compared. The gilbert configuration shows most advantages, in both a good high-frequency performance and an easy way to implement positive / negative amplification. The total chip, including the MUX and the FFE, consumes 750mW from a 2.5V supply and occupies an area of 4.4mm × 1.4 mm. In Chapter 4, the TX chip is demonstrated up to 84 Gb/s. First, the FFE performance is characterized in the frequency domain, showing that the FFE is able to work up to 84 Gb/s using duobinary formats. Second, the combination of the MUX and the FFE is tested. The equalized TX outputs are captured after different channels, for both NRZ and duobinary signaling at speeds from 64 Gb/s to 84 Gb/s. Then, by applying the duobinary RX 2, a serial electrical transmission link is demonstrated across a pair of 10 cm coax cables and across a 5 cm FX-2 differential stripline. The 5-tap FFE compensates a total loss between the TX and the RX chips of about 13.5 dB at the Nyquist frequency, while the RX receives the equalized signal and decodes the duobinary signal to 4 quarter rate NRZ streams. This shows a chip-to-chip data link with a bit error rate (BER) lower than 10−11. Last, the electrical data transmission between the TX and the RX over two commercial backplanes is demonstrated. An error-free, serial duobinary transmission across a commercial Megtron 6, 11.5 inch backplane is demonstrated at 48 Gb/s, which indicates that duobinary outperforms NRZ for attaining higher speed or longer reach backplane applications. Later on, using an ExaMAX® backplane demonstrator, duobinary transmission performance is verified and the maximum allowed channel loss at 40 Gb/s transmission is explored. The eye diagram and BER measurements over a backplane channel up to 26.25 inch are performed. The results show that at 40 Gb/s, a total channel loss up to 37 dB at the Nyquist frequency allows for error-free duobinary transmission, while a total channel loss of 42 dB was overcome with a BER below 10−8. An overview of the conclusions is summarized in Chapter 5, along with some suggestions for further research in this field. (1) The duobinary receiver was developed by my colleague Timothy De Keulenaer, as described in his PhD dissertation. (2) Described in the PhD dissertation of Timothy De Keulenaer

Four-element phased-array beamformers and a self-interference canceling full-duplex transciver in 130-nm SiGe for 5G applications at 26 GHz

This thesis is on the design of radio-frequency (RF) integrated front-end circuits for next generation 5G communication systems. The demand for higher data rates and lower latency in 5G networks can only be met using several new technologies including, but not limited to, mm-waves, massive-MIMO, and full-duplex. Use of mm-waves provides more bandwidth that is necessary for high data rates at the cost of increased attenuation in air. Massive-MIMO arrays are required to compensate for this increased path loss by providing beam steering and array gain. Furthermore, full duplex operation is desirable for improved spectrum efficiency and reduced latency. The difficulty of full duplex operation is the self-interference (SI) between transmit (TX) and receive (RX) paths. Conventional methods to suppress this interference utilize either bulky circulators, isolators, couplers or two separate antennas. These methods are not suitable for fully-integrated full-duplex massive-MIMO arrays. This thesis presents circuit and system level solutions to the issues summarized above, in the form of SiGe integrated circuits for 5G applications at 26 GHz. First, a full-duplex RF front-end architecture is proposed that is scalable to massive-MIMO arrays. It is based on blind, RF self-interference cancellation that is applicable to single/shared antenna front-ends. A high resolution RF vector modulator is developed, which is the key building block that empowers the full-duplex frontend architecture by achieving better than state-of-the-art 10-b monotonic phase control. This vector modulator is combined with linear-in-dB variable gain amplifiers and attenuators to realize a precision self-interference cancellation circuitry. Further, adaptive control of this SI canceler is made possible by including an on-chip low-power IQ downconverter. It correlates copies of transmitted and received signals and provides baseband/dc outputs that can be used to adaptively control the SI canceler. The solution comes at the cost of minimal additional circuitry, yet significantly eases linearity requirements of critical receiver blocks at RF/IF such as mixers and ADCs. Second, to complement the proposed full-duplex front-end architecture and to provide a more complete solution, high-performance beamformer ICs with 5-/6- b phase and 3-/4-b amplitude control capabilities are designed. Single-channel, separate transmitter and receiver beamformers are implemented targeting massive- MIMO mode of operation, and their four-channel versions are developed for phasedarray communication systems. Better than state-of-the-art noise performance is obtained in the RX beamformer channel, with a full-channel noise figure of 3.3 d

Transmetteurs photoniques sur silicium pour les transmissions optiques à grande capacité

Les applications exigeant des très nombreuses données (médias sociaux, diffusion vidéo en continu, mégadonnées, etc.) se développent à un rythme rapide, ce qui nécessite de plus en plus de liaisons optiques ultra-rapides. Ceci implique le développment des transmetteurs optiques intégrés et à bas coût et plus particulirement en photonique sur silicium en raison de ses avantages par rapport aux autres technologies (LiNbO3 et InP), tel que la compatibilité avec le procédé de fabrication CMOS. Les modulateurs optoélectronique sont un élément essentiel dans la communication op-tique. Beaucoup de travaux de recherche sont consacrées au développement de dispositifs optiques haut débit efficaces. Cependant, la conception de modulateurs en photonique sur sili-cium (SiP) haut débit est diffcile, principalement en raison de l'absence d'effet électro-optique intrinsèque dans le silicium. De nouvelles approches et de architectures plus performances doivent être développées afin de satisfaire aux critères réliés au système d'une liaison optique aux paramètres de conception au niveau du dispositif integré. En outre, la co-conception de circuits integrés photoniques sur silicium et CMOS est cruciale pour atteindre tout le potentiel de la technologie de photonique sur silicium. Ainsi cette thèse aborde les défits susmentionnés. Dans notre première contribution, nous préesentons pour la première fois un émetteur phononique sur silicium PAM-4 sans utiliser un convertisseur numérique analog (DAC)qui comprend un modulateur Mach Zehnder à électrodes segmentées SiP (LES-MZM) implémenté dans un procédé photonique sur silicium générique avec jonction PN latérale et son conducteur CMOS intégré. Des débits allant jusqu'à 38 Gb/s/chnnel sont obtenus sans utili-ser un convertisseur numérique-analogique externe. Nous présentons également une nouvelle procédure de génération de délai dans le excitateur de MOS complémentaire. Un effet, un délai robuste aussi petit que 7 ps est généré entre les canaux de conduite. Dans notre deuxième contribution, nous présentons pour la première fois un nouveau fac-teur de mérite (FDM) pour les modulateurs SiP qui inclut non seulement la perte optique et l'efficacité (comme les FDMs précédents), mais aussi la bande passante électro-optique du modulateur SiP (BWEO). Ce nouveau FDM peut faire correspondre les paramètres de conception physique du modulateur SiP à ses critères de performance au niveau du système, facilitant à la fois la conception du dispositif optique et l'optimisation du système. Pour la première fois nous définissons et utilisons la pénalité de puissance du modulateur (MPP) induite par le modulateur SiP pour étudier la dégradation des performances au niveau du système induite par le modulateur SiP dans une communication à base de modulation d'amplitude d'impulsion optique. Nous avons développé l'équation pour MPP qui inclut les facteurs de limitation du modulateur (perte optique, taux d'extinction limité et limitation de la bande passante électro-optique). Enfin, dans notre troisième contribution, une nouvelle méthodologie de conception pour les modulateurs en SiP intégré à haute débit est présentée. La nouvelle approche est basée sur la minimisation de la MPP SiP en optimisant l'architecture du modulateur et le point de fonctionnement. Pour ce processus, une conception en longueur unitaire du modulateur Mach Zehnder (MZM) peut être optimisée en suivant les spécifications du procédé de fabrication et les règles de conception. Cependant, la longueur et la tension de biais du d'éphaseur doivent être optimisées ensemble (par exemple selon vitesse de transmission et format de modulation). Pour vérifier l'approche d'optimisation proposée expérimentale mont, a conçu un modulateur photonique sur silicium en phase / quadrature de phase (IQ) ciblant le format de modulation 16-QAM à 60 Gigabaud. Les résultats expérimentaux prouvent la fiabilité de la méthodologie proposée. D'ailleurs, nous avons augmenté la vitesse de transmission jusqu'à 70 Gigabaud pour tester la limite de débit au système. Une transmission de données dos à dos avec des débits binaires de plus de 233 Gigabit/s/channel est observée. Cette méthodologie de conception ouvre ainsi la voie à la conception de la prochaine génération d'émetteurs intégrés à double polarisation 400+ Gigabit/s/channel.Data-hungry applications (social media, video streaming, big data, etc.) are expanding at a fast pace, growing demand for ultra-fast optical links. This driving force reveals need for low-cost, integrated optical transmitters and pushes research in silicon photonics because of its advantages over other platforms (i.e. LiNbO3 and InP), such as compatibility with CMOS fabrication processes, the ability of on-chip polarization manipulation, and cost effciency. Electro-optic modulators are an essential component of optical communication links and immense research is dedicated to developing effcient high-bitrate devices. However, the design of high-capacity Silicon Photonics (SiP) transmitters is challenging, mainly due to lack of inherent electro-optic effect in silicon. New design methodologies and performance merits have to be developed in order to map the system-level criteria of an optical link to the design parameters in device-level. In addition, co-design of silicon photonics and CMOS integrated circuits is crucial to reveal the full potential of silicon photonics. This thesis addresses the aforementioned challenges. In our frst contribution, for the frst time we present a DAC-less PAM-4 silicon photonic transmitter that includes a SiP lumped-element segmented-electrode Mach Zehnder modula-tor (LES-MZM) implemented in a generic silicon photonic process with lateral p-n junction and its co-designed CMOS driver. Using post processing, bitrates up to 38 Gb/s/channel are achieved without using an external digital to analog converter. We also presents a novel delay generation procedure in the CMOS driver. A robust delay as small as 7 ps is generated between the driving channels. In our second contribution, for the frst time we present a new figure of merit (FOM) for SiP modulators that includes not only the optical loss and effciency (like the prior FOMs), but also the SiP modulator electro-optic bandwidth ( BWEO). This new FOM can map SiP modulator physical design parameters to its system-level performance criteria, facilitating both device design and system optimization. For the frst time we define and employ the modulator power penalty (MPP) induced by the SiP modulator to study the system level performance degradation induced by SiP modulator in an optical pulse amplitude modulation link. We develope a closed-form equation for MPP that includes the SiP modulator limiting factors (optical loss, limited extinction ratio and electro-optic bandwidth limitation). Finally in our third contribution, we present a novel design methodology for integrated high capacity SiP modulators. The new approach is based on minimizing the power penalty of a SiP modulator (MPP) by optimizing modulator design and bias point. For the given process, a unit-length design of Mach Zehnder modulator (MZM) can be optimized following the process specifications and design rules. However, the length and the bias voltage of the phase shifter must be optimized together in a system context (e.g., baud rate and modulation format). Moreover, to verify the proposed optimization approach in experiment, we design an in-phase/quadrature-phase (IQ) silicon photonic modulator targeting 16-QAM modulation format at 60 Gbaud. Experimental results proves the reliability of our proposed methodology. We further push the baud rate up to 70 Gbaud to examine the capacity boundary of the device. Back to back data transmission with bitrates more than 233 Gb/s/channel are captured. This design methodology paves the way for designing the next generation of integrated dual- polarization 400+ Gb/s/channel transmitters

Architectures and Circuits Leveraging Injection-Locked Oscillators for Ultra-Low Voltage Clock Synthesis and Reference-less Receivers for Dense Chip-to-Chip Communications

High performance computing is critical for the needs of scientific discovery and economic competitiveness. An extreme-scale computing system at 1000x the performance of today’s petaflop machines will exhibit massive parallelism on multiple vertical fronts, from thousands of computational units on a single processor to thousands of processors in a single data center. To facilitate such a massively-parallel extreme-scale computing, a key challenge is power. The challenge is not power associated with base computation but rather the problem of transporting data from one chip to another at high enough rates. This thesis presents architectures and techniques to achieve low power and area footprint while achieving high data rates in a dense very-short reach (VSR) chip-to-chip (C2C) communication network. High-speed serial communication operating at ultra-low supplies improves the energy-efficiency and lowers the power envelop of a system doing an exaflop of loops. One focus area of this thesis is clock synthesis for such energy-efficient interconnect applications operating at high speeds and ultra-low supplies. A sub-integer clockfrequency synthesizer is presented that incorporates a multi-phase injection-locked ring-oscillator-based prescaler for operation at an ultra-low supply voltage of 0.5V, phase-switching based programmable division for sub-integer clock-frequency synthesis, and automatic calibration to ensure injection lock. A record speed of 9GHz has been demonstrated at 0.5V in 45nm SOI CMOS. It consumes 3.5mW of power at 9.12GHz and 0.052 of area, while showing an output phase noise of -100dBc/Hz at 1MHz offset and RMS jitter of 325fs; it achieves a net of -186.5 in a 45-nm SOI CMOS process. This thesis also describes a receiver with a reference-less clocking architecture for high-density VSR-C2C links. This architecture simplifies clock-tree planning in dense extreme-scaling computing environments and has high-bandwidth CDR to enable SSC for suppressing EMI and to mitigate TX jitter requirements. It features clock-less DFE and a high-bandwidth CDR based on master-slave ILOs for phase generation/rotation. The RX is implemented in 14nm CMOS and characterized at 19Gb/s. It is 1.5x faster that previous reference-less embedded-oscillator based designs with greater than 100MHz jitter tolerance bandwidth and recovers error-free data over VSR-C2C channels. It achieves a power-efficiency of 2.9pJ/b while recovering error-free data (BER 200MHz and the INL of the ILO-based phase-rotator (32- Steps/UI) is <1-LSB. Lastly, this thesis develops a time-domain delay-based modeling of injection locking to describe injection-locking phenomena in nonharmonic oscillators. The model is used to predict the locking bandwidth, and the locking dynamics of the locked oscillator. The model predictions are verified against simulations and measurements of a four-stage differential ring oscillator. The model is further used to predict the injection-locking behavior of a single-ended CMOS inverter based ring oscillator, the lock range of a multi-phase injection-locked ring-oscillator-based prescaler, as well as the dynamics of tracking injection phase perturbations in injection-locked masterslave oscillators; demonstrating its versatility in application to any nonharmonic oscillator

High Performance Local Oscillator Design for Next Generation Wireless Communication

Local Oscillator (LO) is an essential building block in modern wireless radios. In modern wireless radios, LO often serves as a reference of the carrier signal to modulate or demod- ulate the outgoing or incoming data. The LO signal should be a clean and stable source, such that the frequency or timing information of the carrier reference can be well-defined. However, as radio architecture evolves, the importance of LO path design has become much more important than before. Of late, many radio architecture innovations have exploited sophisticated LO generation schemes to meet the ever-increasing demands of wireless radio performances. The focus of this thesis is to address challenges in the LO path design for next-generation high performance wireless radios. These challenges include (1) Congested spectrum at low radio frequency (RF) below 5GHz (2) Continuing miniaturization of integrated wireless radio, and (3) Fiber-fast (>10Gb/s) mm-wave wireless communication. The thesis begins with a brief introduction of the aforementioned challenges followed by a discussion of the opportunities projected to overcome these challenges. To address the challenge of congested spectrum at frequency below 5GHz, novel ra- dio architectures such as cognitive radio, software-defined radio, and full-duplex radio have drawn significant research interest. Cognitive radio is a radio architecture that opportunisti- cally utilize the unused spectrum in an environment to maximize spectrum usage efficiency. Energy-efficient spectrum sensing is the key to implementing cognitive radio. To enable energy-efficient spectrum sensing, a fast-hopping frequency synthesizer is an essential build- ing block to swiftly sweep the carrier frequency of the radio across the available spectrum. Chapter 2 of this thesis further highlights the challenges and trade-offs of the current LO gen- eration scheme for possible use in sweeping LO-based spectrum analysis. It follows by intro- duction of the proposed fast-hopping LO architecture, its implementation and measurement results of the validated prototype. Chapter 3 proposes an embedded phase-shifting LO-path design for wideband RF self-interference cancellation for full-duplex radio. It demonstrates a synergistic design between the LO path and signal to perform self-interference cancellation. To address the challenge of continuing miniaturization of integrated wireless radio, ring oscillator-based frequency synthesizer is an attractive candidate due to its compactness. Chapter 4 discussed the difficulty associated with implementing a Phase-Locked Loop (PLL) with ultra-small form-factor. It further proposes the concept sub-sampling PLL with time- based loop filter to address these challenges. A 65nm CMOS prototype and its measurement result are presented for validation of the concept. In shifting from RF to mm-wave frequencies, the performance of wireless communication links is boosted by significant bandwidth and data-rate expansion. However, the demand for data-rate improvement is out-pacing the innovation of radio architectures. A >10Gb/s mm-wave wireless communication at 60GHz is required by emerging applications such as virtual-reality (VR) headsets, inter-rack data transmission at data center, and Ultra-High- Definition (UHD) TV home entertainment systems. Channel-bonding is considered to be a promising technique for achieving >10Gb/s wireless communication at 60GHz. Chapter 5 discusses the fundamental radio implementation challenges associated with channel-bonding for 60GHz wireless communication and the pros and cons of prior arts that attempted to address these challenges. It is followed by a discussion of the proposed 60GHz channel- bonding receiver, which utilizes only a single PLL and enables both contiguous and non- contiguous channel-bonding schemes. Finally, Chapter 6 presents the conclusion of this thesis

대역폭 증대 기술을 이용한 전력 효율적 고속 송신 시스템 설계

학위논문(박사) -- 서울대학교대학원 : 공과대학 전기·정보공학부, 2022.2. 정덕균.The high-speed interconnect at the datacenter is being more crucial as 400 Gb Ethernet standards are developed. At the high data rate, channel loss re-quires bandwidth extension techniques for transmitters, even for short-reach channels. On the other hand, as the importance of east-to-west connection is rising, the data center architectures are switching to spine-leaf from traditional ones. In this trend, the number of short-reach optical interconnect is expected to be dominant. The vertical-cavity surface-emitting laser (VCSEL) is a com-monly used optical modulator for short-reach interconnect. However, since VCSEL has low bandwidth and nonlinearity, the optical transmitter also needs bandwidth-increasing techniques. Additionally, the power consumption of data centers reaches a point of concern to affect climate change. Therefore, this the-sis focuses on high-speed, power-efficient transmitters for data center applica-tions. Before the presenting circuit design, bandwidth extension techniques such as fractionally-spaced feed-forward equalizer (FFE), on-chip transmission line, inductive peaking, and T-coil are mathematically analyzed for their effec-tiveness. For the first chip, a power and area-efficient pulse-amplitude modulation 4 (PAM-4) transmitter using 3-tap FFE based on a slow-wave transmission line is presented. A passive delay line is adopted for generating an equalizer tap to overcome the high clocking power consumption. The transmission line achieves a high slow-wave factor of 15 with double floating metal shields around the differential coplanar waveguide. The transmitter includes 4:1 multi-plexers (MUXs) and a quadrature clock generator for high-speed data genera-tion in a quarter-rate system. The 4:1 MUX utilizes a 2-UI pulse generator, and the input configuration is determined by qualitative analysis. The chip is fabri-cated in 65 nm CMOS technology and occupies an area of 0.151 mm2. The proposed transmitter system exhibits an energy efficiency of 3.03 pJ/b at the data rate of 48 Gb/s with PAM-4 signaling. The second chip presents a power-efficient PAM-4 VCSEL transmitter using 3-tap FFE and negative-k T-coil. The phase interpolators (PIs) generate frac-tionally-spaced FFE tap and correct quadrature phase error. The PAM-4 com-bining 8:1 MUX is proposed rather than combining at output driver with double 4:1 MUXs to reduce serializing power consumption. T-coils at the internal and output node increase the bandwidth and remove inter-symbol interference (ISI). The negative-k T-coil at the output network increases the bandwidth 1.61 times than without T-coil. The VCSEL driver is placed on the high VSS domain for anode driving and power reduction. The chip is fabricated in 40 nm CMOS technology. The proposed VCSEL transmitter operates up to 48 Gb/s NRZ and 64 Gb/s PAM-4 with the power efficiency of 3.03 pJ/b and 2.09 pJ/b, respec-tively.400Gb 이더넷 표준이 개발됨에 따라 데이터 센터의 고속 상호 연결이 더욱 중요해지고 있다. 높은 데이터 속도에서의 채널 손실에 의해 단거리 채널의 경우에도 송신기에 대한 대역폭 확장 기술이 필요하다. 한편, 데이터 센터 내 동-서 연결의 중요성이 높아지면서 데이터 센터 아키텍처가 기존의 아키텍처에서 스파인-리프로 전환되고 있다. 이러한 추세에서 단거리 광학 인터커넥트의 수가 점차 우세해질 것으로 예상된다. 수직 캐비티 표면 방출 레이저(VCSEL)는 일반적으로 단거리 상호 연결을 위해 사용되는 광학 모듈레이터이다. VCSEL은 낮은 대역폭과 비선형성을 가지고 있기 때문에, 광 송신기도 대역폭 증가 기술을 필요로 한다. 또한, 데이터 센터의 전력 소비는 기후 변화에 영향을 미칠 수 있는 우려 지점에 도달했다. 따라서, 본 논문은 데이터 센터 응용을 위한 고속 전력 효율적인 송신기에 초점을 맞추고 있다. 회로 설계를 제시하기 전에, 부분 간격 피드-포워드 이퀄라이저 (FFE), 온칩 전송선로, 인덕터, T-코일과 같은 대역폭 확장 기술을 수학적으로 분석한다. 첫 번째 칩은 저속파 전송선로를 기반으로 한 3-탭 FFE를 사용하는 전력 및 면적 효율적인 펄스-진폭-변조 4(PAM-4) 송신기를 제시한다. 높은 클럭 전력 소비를 극복하기 위해 이퀄라이저 탭 생성을 위해 수동소자 지연 라인을 채택했다. 전송 라인은 차동 동일평면도파관 주위에 이중 플로팅 금속 차폐를 사용하여 15의 높은 전달속도 감쇠를 달성한다. 송신기에는 4:1 멀티플렉서(MUX)와 4-위상 클럭 생성기가 포함되어 있다. 4:1 MUX는 2-UI 펄스 발생기를 사용하며, 정성 분석에 의해 입력 구성이 결정된다. 이 칩은 65 nm CMOS 기술로 제작되었으며 0.151 mm2의 면적을 차지한다. 제안된 송신기 시스템은 PAM-4 신호와 함께 48 Gb/s의 데이터 속도에서 3.03 pJ/b의 에너지 효율을 보여준다. 두 번째 칩에서는 3-탭 FFE 및 역회전 T-코일을 사용하는 전력 효율적인 PAM-4 VCSEL 송신기를 제시한다. 위상 보간기(PI)는 부분 간격 FFE 탭을 생성하고 4-위상 클럭 오류를 수정하는 데 사용된다. 직렬화 전력 소비를 줄이기 위해 출력 드라이버에서 MSB와 LSB를 두 개의 4:1 MUX를 통해 결합하는 대신 8:1 MUX를 통해 PAM-4로 결합하는 회로가 제안된다. 내부 및 출력 노드에서 T-코일은 대역폭을 증가시키고 기호 간 간섭(ISI)을 제거한다. 출력 네트워크에서 역회전 T-코일은 T-코일이 없는 경우보다 대역폭을 1.61배 증가시킨다. VCSEL 드라이버는 양극 구동 및 전력 감소를 위해 높은 VSS 도메인에 배치된다. 이 칩은 40 nm CMOS 기술로 제작되었다. 제안된 VCSEL 송신기는 각각 3.03pJ/b와 2.09pJ/b의 전력 효율로 최대 48Gb/s NRZ와 64Gb/s PAM-4까지 작동한다.ABSTRACT I CONTENTS III LIST OF FIGURES V LIST OF TABLES IX CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS ORGANIZATION 5 CHAPTER 2 BACKGROUND OF HIGH-SPEED INTERFACE 6 2.1 OVERVIEW 6 2.2 BASIS OF DATA CENTER ARCHITECTURE 9 2.3 SHORT-REACH INTERFACE STANDARDS 12 2.4 ANALYSES OF BANDWIDTH EXTENSION TECHNIQUES 16 2.4.1 FRACTIONALLY-SPACED FFE 16 2.4.2 TRANSMISSION LINE 21 2.4.3 INDUCTOR 24 2.4.4 T-COIL 33 CHAPTER 3 DESIGN OF 48 GB/S PAM-4 ELECTRICAL TRANSMITTER IN 65 NM CMOS 43 3.1 OVERVIEW 43 3.2 FFE BASED ON DOUBLE-SHIELDED COPLANAR WAVEGUIDE 46 3.2.1 BASIC CONCEPT 46 3.2.2 PROPOSED DOUBLE-SHIELDED COPLANAR WAVEGUIDE 47 3.3 DESIGN CONSIDERATION ON 4:1 MUX 50 3.4 PROPOSED PAM-4 ELECTRICAL TRANSMITTER 53 3.5 MEASUREMENT 57 CHAPTER 4 DESIGN OF 64 GB/S PAM-4 OPTICAL TRANSMITTER IN 40 NM CMOS 64 4.1 OVERVIEW 64 4.2 DESIGN CONSIDERATION OF OPTICAL TRANSMITTER 66 4.3 PROPOSED PAM-4 VCSEL TRANSMITTER 69 4.4 MEASUREMENT 82 CHAPTER 5 CONCLUSIONS 88 BIBLIOGRAPHY 90 초 록 101박

고속 시리얼 링크를 위한 고리 발진기를 기반으로 하는 주파수 합성기

학위논문(박사) -- 서울대학교대학원 : 공과대학 전기·정보공학부, 2022. 8. 정덕균.In this dissertation, major concerns in the clocking of modern serial links are discussed. As sub-rate, multi-standard architectures are becoming predominant, the conventional clocking methodology seems to necessitate innovation in terms of low-cost implementation. Frequency synthesis with active, inductor-less oscillators replacing LC counterparts are reviewed, and solutions for two major drawbacks are proposed. Each solution is verified by prototype chip design, giving a possibility that the inductor-less oscillator may become a proper candidate for future high-speed serial links. To mitigate the high flicker noise of a high-frequency ring oscillator (RO), a reference multiplication technique that effectively extends the bandwidth of the following all-digital phase-locked loop (ADPLL) is proposed. The technique avoids any jitter accumulation, generating a clean mid-frequency clock, overall achieving high jitter performance in conjunction with the ADPLL. Timing constraint for the proper reference multiplication is first analyzed to determine the calibration points that may correct the existent phase errors. The weight for each calibration point is updated by the proposed a priori probability-based least-mean-square (LMS) algorithm. To minimize the time required for the calibration, each gain for the weight update is adaptively varied by deducing a posteriori which error source dominates the others. The prototype chip is fabricated in a 40-nm CMOS technology, and its measurement results verify the low-jitter, high-frequency clock generation with fast calibration settling. The presented work achieves an rms jitter of 177/223 fs at 8/16-GHz output, consuming 12.1/17-mW power. As the second embodiment, an RO-based ADPLL with an analog technique that addresses the high supply sensitivity of the RO is presented. Unlike prior arts, the circuit for the proposed technique does not extort the RO voltage headroom, allowing high-frequency oscillation. Further, the performance given from the technique is robust over process, voltage, and temperature (PVT) variations, avoiding the use of additional calibration hardware. Lastly, a comprehensive analysis of phase noise contribution is conducted for the overall ADPLL, followed by circuit optimizations, to retain the low-jitter output. Implemented in a 40-nm CMOS technology, the frequency synthesizer achieves an rms jitter of 289 fs at 8 GHz output without any injected supply noise. Under a 20-mVrms white supply noise, the ADPLL suppresses supply-noise-induced jitter by -23.8 dB.본 논문은 현대 시리얼 링크의 클락킹에 관여되는 주요한 문제들에 대하여 기술한다. 준속도, 다중 표준 구조들이 채택되고 있는 추세에 따라, 기존의 클라킹 방법은 낮은 비용의 구현의 관점에서 새로운 혁신을 필요로 한다. LC 공진기를 대신하여 능동 소자 발진기를 사용한 주파수 합성에 대하여 알아보고, 이에 발생하는 두가지 주요 문제점과 각각에 대한 해결 방안을 탐색한다. 각 제안 방법을 프로토타입 칩을 통해 그 효용성을 검증하고, 이어서 능동 소자 발진기가 미래의 고속 시리얼 링크의 클락킹에 사용될 가능성에 대해 검토한다. 첫번째 시연으로써, 고주파 고리 발진기의 높은 플리커 잡음을 완화시키기 위해 기준 신호를 배수화하여 뒷단의 위상 고정 루프의 대역폭을 효과적으로 극대화 시키는 회로 기술을 제안한다. 본 기술은 지터를 누적 시키지 않으며 따라서 깨끗한 중간 주파수 클락을 생성시켜 위상 고정 루프와 함께 높은 성능의 고주파 클락을 합성한다. 기준 신호를 성공적으로 배수화하기 위한 타이밍 조건들을 먼저 분석하여 타이밍 오류를 제거하기 위한 방법론을 파악한다. 각 교정 중량은 연역적 확률을 기반으로한 LMS 알고리즘을 통해 갱신되도록 설계된다. 교정에 필요한 시간을 최소화 하기 위하여, 각 교정 이득은 타이밍 오류 근원들의 크기를 귀납적으로 추론한 값을 바탕으로 지속적으로 제어된다. 40-nm CMOS 공정으로 구현된 프로토타입 칩의 측정을 통해 저소음, 고주파 클락을 빠른 교정 시간안에 합성해 냄을 확인하였다. 이는 177/223 fs의 rms 지터를 가지는 8/16 GHz의 클락을 출력한다. 두번째 시연으로써, 고리 발진기의 높은 전원 노이즈 의존성을 완화시키는 기술이 포함된 주파수 합성기가 설계되었다. 이는 고리 발진기의 전압 헤드룸을 보존함으로서 고주파 발진을 가능하게 한다. 나아가, 전원 노이즈 감소 성능은 공정, 전압, 온도 변동에 대하여 민감하지 않으며, 따라서 추가적인 교정 회로를 필요로 하지 않는다. 마지막으로, 위상 노이즈에 대한 포괄적 분석과 회로 최적화를 통하여 주파수 합성기의 저잡음 출력을 방해하지 않는 방법을 고안하였다. 해당 프로토타입 칩은 40-nm CMOS 공정으로 구현되었으며, 전원 노이즈가 인가되지 않은 상태에서 289 fs의 rms 지터를 가지는 8 GHz의 클락을 출력한다. 또한, 20 mVrms의 전원 노이즈가 인가되었을 때에 유도되는 지터의 양을 -23.8 dB 만큼 줄이는 것을 확인하였다.1 Introduction 1 1.1 Motivation 3 1.1.1 Clocking in High-Speed Serial Links 4 1.1.2 Multi-Phase, High-Frequency Clock Conversion 8 1.2 Dissertation Objectives 10 2 RO-Based High-Frequency Synthesis 12 2.1 Phase-Locked Loop Fundamentals 12 2.2 Toward All-Digital Regime 15 2.3 RO Design Challenges 21 2.3.1 Oscillator Phase Noise 21 2.3.2 Challenge 1: High Flicker Noise 23 2.3.3 Challenge 2: High Supply Noise Sensitivity 26 3 Filtering RO Noise 28 3.1 Introduction 28 3.2 Proposed Reference Octupler 34 3.2.1 Delay Constraint 34 3.2.2 Phase Error Calibration 38 3.2.3 Circuit Implementation 51 3.3 IL-ADPLL Implementation 55 3.4 Measurement Results 59 3.5 Summary 63 4 RO Supply Noise Compensation 69 4.1 Introduction 69 4.2 Proposed Analog Closed Loop for Supply Noise Compensation 72 4.2.1 Circuit Implementation 73 4.2.2 Frequency-Domain Analysis 76 4.2.3 Circuit Optimization 81 4.3 ADPLL Implementation 87 4.4 Measurement Results 90 4.5 Summary 98 5 Conclusions 99 A Notes on the 8REF 102 B Notes on the ACSC 105박

Low Power Analog Processing for Ultra-High-Speed Receivers with RF Correlation

Ultra-high-speed data communication receivers (Rxs) conventionally require analog digital converters (ADC)s with high sampling rates which have design challenges in terms of adequate resolution and power. This leads to ultra-high-speed Rxs utilising expensive and bulky high-speed oscilloscopes which are extremely inefficient for demodulation, in terms of power and size. Designing energy-efficient mixed-signal and baseband units for ultra-high-speed Rxs requires a paradigm approach detailed in this paper that circumvents the use of power-hungry ADCs by employing low-power analog processing. The low-power analog Rx employs direct-demodulation with RF correlation using low-power comparators. The Rx is able to support multiple modulations with highest modulation of 16-QAM reported so far for direct-demodulation with RF correlation. Simulations using Matlab, Simulink R2020a® indicate sufficient symbol-error rate (SER) performance at a symbol rate of 8 GS/s for the 71 GHz Urban Micro Cell and 140 GHz indoor channels. Power analysis undertaken with current analog, hybrid and digital beamforming approaches requiring ADCs indicates considerable power savings. This novel approach can be adopted for ultra-high-speed Rxs envisaged for beyond fifth generation (B5G)/sixth generation (6G)/ terahertz (THz) communication without the power-hungry ADCs, leading to low-power integrated design solutions