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    ๋Œ€์—ญํญ ์ฆ๋Œ€ ๊ธฐ์ˆ ์„ ์ด์šฉํ•œ ์ „๋ ฅ ํšจ์œจ์  ๊ณ ์† ์†ก์‹  ์‹œ์Šคํ…œ ์„ค๊ณ„

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    ํ•™์œ„๋…ผ๋ฌธ(๋ฐ•์‚ฌ) -- ์„œ์šธ๋Œ€ํ•™๊ต๋Œ€ํ•™์› : ๊ณต๊ณผ๋Œ€ํ•™ ์ „๊ธฐยท์ •๋ณด๊ณตํ•™๋ถ€, 2022.2. ์ •๋•๊ท .The high-speed interconnect at the datacenter is being more crucial as 400 Gb Ethernet standards are developed. At the high data rate, channel loss re-quires bandwidth extension techniques for transmitters, even for short-reach channels. On the other hand, as the importance of east-to-west connection is rising, the data center architectures are switching to spine-leaf from traditional ones. In this trend, the number of short-reach optical interconnect is expected to be dominant. The vertical-cavity surface-emitting laser (VCSEL) is a com-monly used optical modulator for short-reach interconnect. However, since VCSEL has low bandwidth and nonlinearity, the optical transmitter also needs bandwidth-increasing techniques. Additionally, the power consumption of data centers reaches a point of concern to affect climate change. Therefore, this the-sis focuses on high-speed, power-efficient transmitters for data center applica-tions. Before the presenting circuit design, bandwidth extension techniques such as fractionally-spaced feed-forward equalizer (FFE), on-chip transmission line, inductive peaking, and T-coil are mathematically analyzed for their effec-tiveness. For the first chip, a power and area-efficient pulse-amplitude modulation 4 (PAM-4) transmitter using 3-tap FFE based on a slow-wave transmission line is presented. A passive delay line is adopted for generating an equalizer tap to overcome the high clocking power consumption. The transmission line achieves a high slow-wave factor of 15 with double floating metal shields around the differential coplanar waveguide. The transmitter includes 4:1 multi-plexers (MUXs) and a quadrature clock generator for high-speed data genera-tion in a quarter-rate system. The 4:1 MUX utilizes a 2-UI pulse generator, and the input configuration is determined by qualitative analysis. The chip is fabri-cated in 65 nm CMOS technology and occupies an area of 0.151 mm2. The proposed transmitter system exhibits an energy efficiency of 3.03 pJ/b at the data rate of 48 Gb/s with PAM-4 signaling. The second chip presents a power-efficient PAM-4 VCSEL transmitter using 3-tap FFE and negative-k T-coil. The phase interpolators (PIs) generate frac-tionally-spaced FFE tap and correct quadrature phase error. The PAM-4 com-bining 8:1 MUX is proposed rather than combining at output driver with double 4:1 MUXs to reduce serializing power consumption. T-coils at the internal and output node increase the bandwidth and remove inter-symbol interference (ISI). The negative-k T-coil at the output network increases the bandwidth 1.61 times than without T-coil. The VCSEL driver is placed on the high VSS domain for anode driving and power reduction. The chip is fabricated in 40 nm CMOS technology. The proposed VCSEL transmitter operates up to 48 Gb/s NRZ and 64 Gb/s PAM-4 with the power efficiency of 3.03 pJ/b and 2.09 pJ/b, respec-tively.400Gb ์ด๋”๋„ท ํ‘œ์ค€์ด ๊ฐœ๋ฐœ๋จ์— ๋”ฐ๋ผ ๋ฐ์ดํ„ฐ ์„ผํ„ฐ์˜ ๊ณ ์† ์ƒํ˜ธ ์—ฐ๊ฒฐ์ด ๋”์šฑ ์ค‘์š”ํ•ด์ง€๊ณ  ์žˆ๋‹ค. ๋†’์€ ๋ฐ์ดํ„ฐ ์†๋„์—์„œ์˜ ์ฑ„๋„ ์†์‹ค์— ์˜ํ•ด ๋‹จ๊ฑฐ๋ฆฌ ์ฑ„๋„์˜ ๊ฒฝ์šฐ์—๋„ ์†ก์‹ ๊ธฐ์— ๋Œ€ํ•œ ๋Œ€์—ญํญ ํ™•์žฅ ๊ธฐ์ˆ ์ด ํ•„์š”ํ•˜๋‹ค. ํ•œํŽธ, ๋ฐ์ดํ„ฐ ์„ผํ„ฐ ๋‚ด ๋™-์„œ ์—ฐ๊ฒฐ์˜ ์ค‘์š”์„ฑ์ด ๋†’์•„์ง€๋ฉด์„œ ๋ฐ์ดํ„ฐ ์„ผํ„ฐ ์•„ํ‚คํ…์ฒ˜๊ฐ€ ๊ธฐ์กด์˜ ์•„ํ‚คํ…์ฒ˜์—์„œ ์ŠคํŒŒ์ธ-๋ฆฌํ”„๋กœ ์ „ํ™˜๋˜๊ณ  ์žˆ๋‹ค. ์ด๋Ÿฌํ•œ ์ถ”์„ธ์—์„œ ๋‹จ๊ฑฐ๋ฆฌ ๊ด‘ํ•™ ์ธํ„ฐ์ปค๋„ฅํŠธ์˜ ์ˆ˜๊ฐ€ ์ ์ฐจ ์šฐ์„ธํ•ด์งˆ ๊ฒƒ์œผ๋กœ ์˜ˆ์ƒ๋œ๋‹ค. ์ˆ˜์ง ์บ๋น„ํ‹ฐ ํ‘œ๋ฉด ๋ฐฉ์ถœ ๋ ˆ์ด์ €(VCSEL)๋Š” ์ผ๋ฐ˜์ ์œผ๋กœ ๋‹จ๊ฑฐ๋ฆฌ ์ƒํ˜ธ ์—ฐ๊ฒฐ์„ ์œ„ํ•ด ์‚ฌ์šฉ๋˜๋Š” ๊ด‘ํ•™ ๋ชจ๋“ˆ๋ ˆ์ดํ„ฐ์ด๋‹ค. VCSEL์€ ๋‚ฎ์€ ๋Œ€์—ญํญ๊ณผ ๋น„์„ ํ˜•์„ฑ์„ ๊ฐ€์ง€๊ณ  ์žˆ๊ธฐ ๋•Œ๋ฌธ์—, ๊ด‘ ์†ก์‹ ๊ธฐ๋„ ๋Œ€์—ญํญ ์ฆ๊ฐ€ ๊ธฐ์ˆ ์„ ํ•„์š”๋กœ ํ•œ๋‹ค. ๋˜ํ•œ, ๋ฐ์ดํ„ฐ ์„ผํ„ฐ์˜ ์ „๋ ฅ ์†Œ๋น„๋Š” ๊ธฐํ›„ ๋ณ€ํ™”์— ์˜ํ–ฅ์„ ๋ฏธ์น  ์ˆ˜ ์žˆ๋Š” ์šฐ๋ ค ์ง€์ ์— ๋„๋‹ฌํ–ˆ๋‹ค. ๋”ฐ๋ผ์„œ, ๋ณธ ๋…ผ๋ฌธ์€ ๋ฐ์ดํ„ฐ ์„ผํ„ฐ ์‘์šฉ์„ ์œ„ํ•œ ๊ณ ์† ์ „๋ ฅ ํšจ์œจ์ ์ธ ์†ก์‹ ๊ธฐ์— ์ดˆ์ ์„ ๋งž์ถ”๊ณ  ์žˆ๋‹ค. ํšŒ๋กœ ์„ค๊ณ„๋ฅผ ์ œ์‹œํ•˜๊ธฐ ์ „์—, ๋ถ€๋ถ„ ๊ฐ„๊ฒฉ ํ”ผ๋“œ-ํฌ์›Œ๋“œ ์ดํ€„๋ผ์ด์ € (FFE), ์˜จ์นฉ ์ „์†ก์„ ๋กœ, ์ธ๋•ํ„ฐ, T-์ฝ”์ผ๊ณผ ๊ฐ™์€ ๋Œ€์—ญํญ ํ™•์žฅ ๊ธฐ์ˆ ์„ ์ˆ˜ํ•™์ ์œผ๋กœ ๋ถ„์„ํ•œ๋‹ค. ์ฒซ ๋ฒˆ์งธ ์นฉ์€ ์ €์†ํŒŒ ์ „์†ก์„ ๋กœ๋ฅผ ๊ธฐ๋ฐ˜์œผ๋กœ ํ•œ 3-ํƒญ FFE๋ฅผ ์‚ฌ์šฉํ•˜๋Š” ์ „๋ ฅ ๋ฐ ๋ฉด์  ํšจ์œจ์ ์ธ ํŽ„์Šค-์ง„ํญ-๋ณ€์กฐ 4(PAM-4) ์†ก์‹ ๊ธฐ๋ฅผ ์ œ์‹œํ•œ๋‹ค. ๋†’์€ ํด๋Ÿญ ์ „๋ ฅ ์†Œ๋น„๋ฅผ ๊ทน๋ณตํ•˜๊ธฐ ์œ„ํ•ด ์ดํ€„๋ผ์ด์ € ํƒญ ์ƒ์„ฑ์„ ์œ„ํ•ด ์ˆ˜๋™์†Œ์ž ์ง€์—ฐ ๋ผ์ธ์„ ์ฑ„ํƒํ–ˆ๋‹ค. ์ „์†ก ๋ผ์ธ์€ ์ฐจ๋™ ๋™์ผํ‰๋ฉด๋„ํŒŒ๊ด€ ์ฃผ์œ„์— ์ด์ค‘ ํ”Œ๋กœํŒ… ๊ธˆ์† ์ฐจํ๋ฅผ ์‚ฌ์šฉํ•˜์—ฌ 15์˜ ๋†’์€ ์ „๋‹ฌ์†๋„ ๊ฐ์‡ ๋ฅผ ๋‹ฌ์„ฑํ•œ๋‹ค. ์†ก์‹ ๊ธฐ์—๋Š” 4:1 ๋ฉ€ํ‹ฐํ”Œ๋ ‰์„œ(MUX)์™€ 4-์œ„์ƒ ํด๋Ÿญ ์ƒ์„ฑ๊ธฐ๊ฐ€ ํฌํ•จ๋˜์–ด ์žˆ๋‹ค. 4:1 MUX๋Š” 2-UI ํŽ„์Šค ๋ฐœ์ƒ๊ธฐ๋ฅผ ์‚ฌ์šฉํ•˜๋ฉฐ, ์ •์„ฑ ๋ถ„์„์— ์˜ํ•ด ์ž…๋ ฅ ๊ตฌ์„ฑ์ด ๊ฒฐ์ •๋œ๋‹ค. ์ด ์นฉ์€ 65 nm CMOS ๊ธฐ์ˆ ๋กœ ์ œ์ž‘๋˜์—ˆ์œผ๋ฉฐ 0.151 mm2์˜ ๋ฉด์ ์„ ์ฐจ์ง€ํ•œ๋‹ค. ์ œ์•ˆ๋œ ์†ก์‹ ๊ธฐ ์‹œ์Šคํ…œ์€ PAM-4 ์‹ ํ˜ธ์™€ ํ•จ๊ป˜ 48 Gb/s์˜ ๋ฐ์ดํ„ฐ ์†๋„์—์„œ 3.03 pJ/b์˜ ์—๋„ˆ์ง€ ํšจ์œจ์„ ๋ณด์—ฌ์ค€๋‹ค. ๋‘ ๋ฒˆ์งธ ์นฉ์—์„œ๋Š” 3-ํƒญ FFE ๋ฐ ์—ญํšŒ์ „ T-์ฝ”์ผ์„ ์‚ฌ์šฉํ•˜๋Š” ์ „๋ ฅ ํšจ์œจ์ ์ธ PAM-4 VCSEL ์†ก์‹ ๊ธฐ๋ฅผ ์ œ์‹œํ•œ๋‹ค. ์œ„์ƒ ๋ณด๊ฐ„๊ธฐ(PI)๋Š” ๋ถ€๋ถ„ ๊ฐ„๊ฒฉ FFE ํƒญ์„ ์ƒ์„ฑํ•˜๊ณ  4-์œ„์ƒ ํด๋Ÿญ ์˜ค๋ฅ˜๋ฅผ ์ˆ˜์ •ํ•˜๋Š” ๋ฐ ์‚ฌ์šฉ๋œ๋‹ค. ์ง๋ ฌํ™” ์ „๋ ฅ ์†Œ๋น„๋ฅผ ์ค„์ด๊ธฐ ์œ„ํ•ด ์ถœ๋ ฅ ๋“œ๋ผ์ด๋ฒ„์—์„œ MSB์™€ LSB๋ฅผ ๋‘ ๊ฐœ์˜ 4:1 MUX๋ฅผ ํ†ตํ•ด ๊ฒฐํ•ฉํ•˜๋Š” ๋Œ€์‹  8:1 MUX๋ฅผ ํ†ตํ•ด PAM-4๋กœ ๊ฒฐํ•ฉํ•˜๋Š” ํšŒ๋กœ๊ฐ€ ์ œ์•ˆ๋œ๋‹ค. ๋‚ด๋ถ€ ๋ฐ ์ถœ๋ ฅ ๋…ธ๋“œ์—์„œ T-์ฝ”์ผ์€ ๋Œ€์—ญํญ์„ ์ฆ๊ฐ€์‹œํ‚ค๊ณ  ๊ธฐํ˜ธ ๊ฐ„ ๊ฐ„์„ญ(ISI)์„ ์ œ๊ฑฐํ•œ๋‹ค. ์ถœ๋ ฅ ๋„คํŠธ์›Œํฌ์—์„œ ์—ญํšŒ์ „ T-์ฝ”์ผ์€ T-์ฝ”์ผ์ด ์—†๋Š” ๊ฒฝ์šฐ๋ณด๋‹ค ๋Œ€์—ญํญ์„ 1.61๋ฐฐ ์ฆ๊ฐ€์‹œํ‚จ๋‹ค. VCSEL ๋“œ๋ผ์ด๋ฒ„๋Š” ์–‘๊ทน ๊ตฌ๋™ ๋ฐ ์ „๋ ฅ ๊ฐ์†Œ๋ฅผ ์œ„ํ•ด ๋†’์€ VSS ๋„๋ฉ”์ธ์— ๋ฐฐ์น˜๋œ๋‹ค. ์ด ์นฉ์€ 40 nm CMOS ๊ธฐ์ˆ ๋กœ ์ œ์ž‘๋˜์—ˆ๋‹ค. ์ œ์•ˆ๋œ VCSEL ์†ก์‹ ๊ธฐ๋Š” ๊ฐ๊ฐ 3.03pJ/b์™€ 2.09pJ/b์˜ ์ „๋ ฅ ํšจ์œจ๋กœ ์ตœ๋Œ€ 48Gb/s NRZ์™€ 64Gb/s PAM-4๊นŒ์ง€ ์ž‘๋™ํ•œ๋‹ค.ABSTRACT I CONTENTS III LIST OF FIGURES V LIST OF TABLES IX CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS ORGANIZATION 5 CHAPTER 2 BACKGROUND OF HIGH-SPEED INTERFACE 6 2.1 OVERVIEW 6 2.2 BASIS OF DATA CENTER ARCHITECTURE 9 2.3 SHORT-REACH INTERFACE STANDARDS 12 2.4 ANALYSES OF BANDWIDTH EXTENSION TECHNIQUES 16 2.4.1 FRACTIONALLY-SPACED FFE 16 2.4.2 TRANSMISSION LINE 21 2.4.3 INDUCTOR 24 2.4.4 T-COIL 33 CHAPTER 3 DESIGN OF 48 GB/S PAM-4 ELECTRICAL TRANSMITTER IN 65 NM CMOS 43 3.1 OVERVIEW 43 3.2 FFE BASED ON DOUBLE-SHIELDED COPLANAR WAVEGUIDE 46 3.2.1 BASIC CONCEPT 46 3.2.2 PROPOSED DOUBLE-SHIELDED COPLANAR WAVEGUIDE 47 3.3 DESIGN CONSIDERATION ON 4:1 MUX 50 3.4 PROPOSED PAM-4 ELECTRICAL TRANSMITTER 53 3.5 MEASUREMENT 57 CHAPTER 4 DESIGN OF 64 GB/S PAM-4 OPTICAL TRANSMITTER IN 40 NM CMOS 64 4.1 OVERVIEW 64 4.2 DESIGN CONSIDERATION OF OPTICAL TRANSMITTER 66 4.3 PROPOSED PAM-4 VCSEL TRANSMITTER 69 4.4 MEASUREMENT 82 CHAPTER 5 CONCLUSIONS 88 BIBLIOGRAPHY 90 ์ดˆ ๋ก 101๋ฐ•
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