Through Silicon Vias in MEMS packaging, a review

Trough Silicon Via (TSV) is a key enabling technology to achieve the integration of various dies by exploiting the third dimension. This allow the integration of heterogeneous chips in a single package (2.5D integration) or to achieve higher integration densities of transistors (3D integration). These vertical interconnections are widely used for both IC and MEMS devices. This paper reviews TSV technology focusing on their implementation in MEMS sensors with a broad overview on the various fabrication approaches and their constraints in terms of process compatibility. A case study of an inertial MEMS sensor will then be presented.publishedVersio

Wafer bonding process for zero level vacuum packaging of MEMS

It is well known that the packaging of electronic devices is of paramount importance, none more so than in MEMS were fragile mechanical elements are realized. Among the different approaches, wafer to wafer bonding guarantees the advantages of the wafer scaling and provides protection of the devices during the final phase of fabrication. Direct bonding, also known as fusion bonding, is seldom implemented in MEMS fabrication due to the high surface quality required, the high temperature involved and the compulsory wet activation process. In this paper a direct bonding process for MEMS inertial sensor without the need of any wet activation step is presented.acceptedVersio

Wafer bonding process for zero level vacuum packaging of MEMS

It is well known that the packaging of electronic devices is of paramount importance, none more so than in MEMS were fragile mechanical elements are realized. Among the different approaches, wafer to wafer bonding guarantees the advantages of the wafer scaling and provides protection of the devices during the final phase of fabrication. Direct bonding, also known as fusion bonding, is seldom implemented in MEMS fabrication due to the high surface quality required, the high temperature involved and the compulsory wet activation process. In this paper a direct bonding process for MEMS inertial sensor without the need of any wet activation step is presented.acceptedVersio

Bending machine for testing reliability of flexible electronics

A novel bending machine has been designed and tested. It enables flexible electronics to be subjected to repeated bending with constant radius and tension. In-situ electrical characterization can give accurate analysis of lifetime distributions if sufficiently many samples are ran to failure, allowing reliability prediction models to be developed. Four sets of test samples with different combinations of substrate, routing, interconnect technology and components were examined. A poor level of reliability was observed when using anisotropic conductive paste to form interconnects, whereas a significantly higher level of reliability was observed when using a bismuth-tin solder paste. The assembly of larger components resulted in shortened time to failure, whereas increasing the bending radius prolonged the observed lifetimes.acceptedVersio

Fabrication of a Silicide Thermoelectric Module Employing Fractional Factorial Design Principles

publishedVersionPaid Open AccessUNIT agreemen

Shifting the limits in wheat research and breeding using a fully annotated reference genome

Introduction: Wheat (Triticum aestivum L.) is the most widely cultivated crop on Earth, contributing about a fifth of the total calories consumed by humans. Consequently, wheat yields and production affect the global economy, and failed harvests can lead to social unrest. Breeders continuously strive to develop improved varieties by fine-tuning genetically complex yield and end-use quality parameters while maintaining stable yields and adapting the crop to regionally specific biotic and abiotic stresses. Rationale: Breeding efforts are limited by insufficient knowledge and understanding of wheat biology and the molecular basis of central agronomic traits. To meet the demands of human population growth, there is an urgent need for wheat research and breeding to accelerate genetic gain as well as to increase and protect wheat yield and quality traits. In other plant and animal species, access to a fully annotated and ordered genome sequence, including regulatory sequences and genome-diversity information, has promoted the development of systematic and more time-efficient approaches for the selection and understanding of important traits. Wheat has lagged behind, primarily owing to the challenges of assembling a genome that is more than five times as large as the human genome, polyploid, and complex, containing more than 85% repetitive DNA. To provide a foundation for improvement through molecular breeding, in 2005, the International Wheat Genome Sequencing Consortium set out to deliver a high-quality annotated reference genome sequence of bread wheat. Results: An annotated reference sequence representing the hexaploid bread wheat genome in the form of 21 chromosome-like sequence assemblies has now been delivered, giving access to 107,891 high-confidence genes, including their genomic context of regulatory sequences. This assembly enabled the discovery of tissue- and developmental stage–related gene coexpression networks using a transcriptome atlas representing all stages of wheat development. The dynamics of change in complex gene families involved in environmental adaptation and end-use quality were revealed at subgenome resolution and contextualized to known agronomic single-gene or quantitative trait loci. Aspects of the future value of the annotated assembly for molecular breeding and research were exemplarily illustrated by resolving the genetic basis of a quantitative trait locus conferring resistance to abiotic stress and insect damage as well as by serving as the basis for genome editing of the flowering-time trait. Conclusion: This annotated reference sequence of wheat is a resource that can now drive disruptive innovation in wheat improvement, as this community resource establishes the foundation for accelerating wheat research and application through improved understanding of wheat biology and genomics-assisted breeding. Importantly, the bioinformatics capacity developed for model-organism genomes will facilitate a better understanding of the wheat genome as a result of the high-quality chromosome-based genome assembly. By necessity, breeders work with the genome at the whole chromosome level, as each new cross involves the modification of genome-wide gene networks that control the expression of complex traits such as yield. With the annotated and ordered reference genome sequence in place, researchers and breeders can now easily access sequence-level information to precisely define the necessary changes in the genomes for breeding programs. This will be realized through the implementation of new DNA marker platforms and targeted breeding technologies, including genome editing

Factors Associated with Revision Surgery after Internal Fixation of Hip Fractures

Background: Femoral neck fractures are associated with high rates of revision surgery after management with internal fixation. Using data from the Fixation using Alternative Implants for the Treatment of Hip fractures (FAITH) trial evaluating methods of internal fixation in patients with femoral neck fractures, we investigated associations between baseline and surgical factors and the need for revision surgery to promote healing, relieve pain, treat infection or improve function over 24 months postsurgery. Additionally, we investigated factors associated with (1) hardware removal and (2) implant exchange from cancellous screws (CS) or sliding hip screw (SHS) to total hip arthroplasty, hemiarthroplasty, or another internal fixation device. Methods: We identified 15 potential factors a priori that may be associated with revision surgery, 7 with hardware removal, and 14 with implant exchange. We used multivariable Cox proportional hazards analyses in our investigation. Results: Factors associated with increased risk of revision surgery included: female sex, [hazard ratio (HR) 1.79, 95% confidence interval (CI) 1.25-2.50; P = 0.001], higher body mass index (fo

Through Silicon Vias in MEMS packaging, a review

Trough Silicon Via (TSV) is a key enabling technology to achieve the integration of various dies by exploiting the third dimension. This allows the integration of heterogeneous chips in a single package (2.5D integration) or to achieve higher integration densities of transistors (3D integration). These vertical interconnections are widely used for both IC and MEMS devices. This paper reviews TSV technology focusing on their implementation in MEMS sensors with a broad overview of the various fabrication approaches and their constraints in terms of process compatibility. A case study of an inertial MEMS sensor will then be presented

Through Silicon Vias in MEMS packaging, a review

Trough Silicon Via (TSV) is a key enabling technology to achieve the integration of various dies by exploiting the third dimension. This allow the integration of heterogeneous chips in a single package (2.5D integration) or to achieve higher integration densities of transistors (3D integration). These vertical interconnections are widely used for both IC and MEMS devices. This paper reviews TSV technology focusing on their implementation in MEMS sensors with a broad overview on the various fabrication approaches and their constraints in terms of process compatibility. A case study of an inertial MEMS sensor will then be presented