Radiation Effects in CMOS Isolation Oxides: Differences and Similarities With Thermal Oxides

Radiation effects in thick isolation oxides of modern CMOS technologies are investigated using dedicated test structures designed using two commercial foundries. Shallow Trench Isolation and Pre-Metal Dielectric are studied using electrical measurements performed after X-ray irradiations and isochronal annealing cycles. This paper shows that trapping properties of such isolation oxides can strongly differ from those of traditional thermal oxides usually used to process the gate oxide of Metal Oxide Semiconductor Field Effect Transistors. Buildup and annealing of both radiation-induced oxide-trap charge and radiation-induced interface traps are discussed as a function of the oxide type, foundry and bias condition during irradiation. Radiation-induced interface traps in such isolation oxides are shown to anneal below 100°C contrary to what is usually observed in thermal oxides. Implications for design hardening and radiation tests of CMOS Integrated Circuits are discussed

Identification of radiation induced dark current sources in pinned photodiode CMOS image sensors

This paper presents an investigation of Total Ionizing Dose induced dark current sources in Pinned PhotoDiodes (PPD) CMOS Image Sensors based on pixel design variations. The influence of several layout parameters is studied. Only one parameter is changed at a time enabling the direct evaluation of its contribution to the observed device degradation. By this approach, the origin of radiation induced dark current in PPD is localized on the pixel layout. The PPD peripheral STI does not seem to play a role in the degradation. The PPD area and an additional contribution independent on the pixel dimensions appear to be the main sources of the TID induced dark current increase

Enhanced Radiation-Induced Narrow Channel Effects in Commercial 0.18 μm Bulk Technology

Total ionizing dose effects are investigated in input/output transistors that are fabricated by using a commercial 0.18 μm bulk process. An enhanced radiation-induced narrow channel effect is demonstrated in N-type metal-oxide semiconductor (NMOS) and P-type metal-oxide semiconductor (PMOS) transistors, leading to a significant threshold voltage shift which may compromise circuit operations. Calculations using a code dedicated to radiation-induced charge trapping in oxides show that the radiation-induced positive charge trapping in trench oxides leads to the modifications of the electrical characteristics experimentally evidenced. Radiation hardening issues are finally discussed as a function of the device geometry and design

Simulation of Single Particle Displacement Damage in Silicon – Part I: Global Approach and Primary Interaction Simulation

A comprehensive approach is developed for the simulation of Single Particle Displacement Damage in silicon, from the incident particle interaction in silicon, to the resulting electrical effect observed experimentally. The different steps of the global approach are described. The paper then focuses on the first step corresponding to Monte Carlo simulation of the primary interaction. The characteristics of the Primary Knock-On Atom (PKA) generated by neutron- or proton-silicon interactions for different energies are explored, analyzing in particular the PKA range in energies and species. This leads to the selection of 1 and 10 keV silicon atoms as good candidates to best represent the displacement cascades generated by all PKA. These PKA characteristics will be used as input in the following Molecular Dynamics simulation step, developed in a separate paper to simulate the displacement cascade generation and evolution. Monte Carlo simulations are also performed in a geometry representative of an image sensor, analyzing the distribution of non-ionizing deposited energy. The obtained distributions appear very similar for incident neutrons from 3 to 18 MeV and incident protons of 200 MeV, in agreement with similarities observed in experimentally measured dark current distributions in image sensors. The effect of geometric parameters on these distributions is finally explored

Radiation Effects in Pinned Photodiode CMOS Image Sensors: Pixel Performance Degradation Due to Total Ionizing Dose

Several Pinned Photodiode (PPD) CMOS Image Sensors (CIS) are designed, manufactured, characterized and exposed biased to ionizing radiation up to 10 kGy(SiO2 ). In addition to the usually reported dark current increase and quantum efficiency drop at short wavelengths, several original radiation effects are shown: an increase of the pinning voltage, a decrease of the buried photodiode full well capacity, a large change in charge transfer efficiency, the creation of a large number of Total Ionizing Dose (TID) induced Dark Current Random Telegraph Signal (DC-RTS) centers active in the photodiode (even when the Transfer Gate (TG) is accumulated) and the complete depletion of the Pre-Metal Dielectric (PMD) interface at the highest TID leading to a large dark current and the loss of control of the TG on the dark current. The proposed mechanisms at the origin of these degradations are discussed. It is also demonstrated that biasing (i.e., operating) the PPD CIS during irradiation does not enhance the degradations compared to sensors grounded during irradiation

Modeling Approach for the Prediction of Transient and Permanent Degradations of Image Sensors in Complex Radiation Environments

A modeling approach is proposed to predict the transient and permanent degradation of image sensors in complex radiation environments. The example of the OMEGA facility is used throughout the paper. A first Geant4 simulation allows the modeling of the radiation environment (particles, energies, timing) at various locations in the facility. The image sensor degradation is then calculated for this particular environment. The permanent degradation, i.e. dark current increase, is first calculated using an analytical model from the literature. Additional experimental validations of this model are also presented. The transient degradation, i.e. distribution of perturbed pixels, is finally simulated with Geant4 and validated in comparison with experimental data

Design of Radiation-Hardened Rare-Earth Doped Amplifiers Through a Coupled Experiment/Simulation Approach

We present an approach coupling a limited experimental number of tests with numerical simulations regarding the design of radiation-hardened (RH) rare earth (RE)-doped fiber amplifiers. Radiation tests are done on RE-doped fiber samples in order to measure and assess the values of the principal input parameters requested by the simulation tool based on particle swarm optimization (PSO) approach. The proposed simulation procedure is validated by comparing the calculation results with the measured degradations of two amplifiers made with standard and RH RE-doped optical fibers, respectively. After validation, the numerical code is used to theoretically investigate the influence of some amplifier design parameters on its sensitivity to radiations. Simulations show that the RE-doped fiber length used in the amplifier needs to be adjusted to optimize the amplifier performance over the whole space mission profile rather than to obtain the maximal amplification efficiency before its integration in the harsh environment. By combining this coupled approach with the newly-developed RH RE-doped fibers, fiber-based amplifiers nearly insensitive to space environment may be designed in the future

Radiation Induced Variable Retention Time in Dynamic Random Access Memories

The effect of gamma-ray and neutron radiations on the Variable Retention Time (VRT) phenomenon occurring in Dynamic Random Access Memory (DRAM) is studied. It is shown that both ionizing radiation and non-ionizing radiation induce VRT behaviors in DRAM cells. It demonstrates that both Si/SiO2 interface states and silicon bulk defects can be a source of VRT. It is also highlighted that radiation induced VRT in DRAMs is very similar to radiation induced Dark Current Random Telegraph Signal (DC-RTS) in image sensors. Both phenomena probably share the same origin but high magnitude electric fields seem to play an important role in VRT only. Defect structural fluctuations (without change of charge state) seem to be the root cause of the observed VRT whereas processes involving trapping and emission of charge carriers are unlikely to be a source of VRT. VRT also appears to be the most probable cause of intermittent stuck bits in irradiated DRAMs

Temperature dependence and dynamic behaviour of full well capacity in pinned photodiode CMOS image sensors

This study presents an analytical model of the Full Well Capacity(FWC) in Pinned Photodiode (PPD) CMOS image sensors. By introducing the temperature dependence of the PPD pinning voltage, the existing model is extended (with respect to previous works) to take into account the effect of temperature on the FWC. It is shown, with the support of experimental data, that whereas in dark conditions the FWC increases with temperature, a decrease is observed if FWC measurements are performed under illumination. This study also shows that after a light pulse, the charge stored in the PPD drops as the PPD tends toward equilibrium. On the base of these observations, an analytical model of the dynamic behaviour of the FWC in non-continuous illumination conditions is proposed. The model is able to reproduce experimental data over six orders of magnitude of time. Both the static and dynamic models can be useful tools to correctly interpret FWC changes following design variations and to accurately define the operating conditions during device characterizations

Dark Current Spectroscopy in neutron, proton and ion irradiated CMOS Image Sensors

The dark current spectroscopy is tested on twenty CMOS image sensors irradiated with protons, neutrons and various ions at different energies. The aim of this work is to differentiate the effect of coulomb and nuclear interactions on the radiation-induced dark current distribution and to identify the main radiation-induced defects responsible for the dark current increase for each type of interaction. For low-energy protons and low-energy light ions (which produce well-separated low energy coulomb interactions), we find that most of the pixels belong to a quantized dark current spectrum at low dark current. In these pixels, the dark current increase seems mainly dominated by specific point defects such as the divacancy and the vacancy-phosphorus complex. Thus, these simple defects seem to form when the displacement damage is rather low and sparse. On the contrary, for nuclear interactions (with neutrons or high-energy protons) producing high coulomb NIEL silicon PKAs or for low energy heavy ions (also having high coulomb NIEL), the DCS spectrum is not visible and all the pixels belong to an exponential hot pixel tail which extends to very high dark current. In these pixels, the dark current increase is mainly dominated by defects with close-to-midgap energy levels. These defects seem more complex than point defects because they can have many different generation rates (explaining the smooth hot pixel tail) and because they tend to form when the displacement damage is high and dense