Heteroepitaxial growth of T-Nb2O5 on SrTiO3

There is a growing interest in exploiting the functional properties of niobium oxides in general and of the T-Nb2O5 polymorph in particular. Fundamental investigations of the properties of niobium oxides are, however, hindered by the availability of materials with sufficient structural perfection. It is expected that high-quality T-Nb2O5 can be made using heteroepitaxial growth. Here, we investigated the epitaxial growth of T-Nb2O5 on a prototype perovskite oxide, SrTiO3. Even though there exists a reasonable lattice mismatch in one crystallographic direction, these materials have a significant difference in crystal structure: SrTiO3 is cubic, whereas T-Nb2O5 is orthorhombic. It is found that this difference in symmetry results in the formation of domains that have the T-Nb2O5 c-axis aligned with the SrTiO3 s in-plane directions. Hence, the number of domain orientations is four and two for the growth on (100)s- and (110)s-oriented substrates, respectively. Interestingly, the out-of-plane growth direction remains the same for both substrate orientations, suggesting a weak interfacial coupling between the two materials. Despite challenges associated with the heteroepitaxial growth of T-Nb2O5, the T-Nb2O5 films presented in this paper are a significant improvement in terms of structural quality compared to their polycrystalline counterparts

Ti-Sr antisite : An abundant point defect in SrTiO3

We present a systematic study of the positron lifetime as a function of measurement temperature in strontium titanate ( SrTiO 3) single crystals grown in different conditions and by different synthesis methods. We combine our experimental results with state-of-the-art theoretical calculations of positron annihilation parameters. We find that the essentially omnipresent 180-190ps lifetime component is most likely the Ti Sr antisite defect, possibly coupled with one or more oxygen vacancies, supporting the importance of the Ti Sr antisite related defects in SrTiO 3.Peer reviewe

Polarity Control in Group-III Nitrides beyond Pragmatism

Controlling the polarity of polar semiconductors on nonpolar substrates offers a wealth of device concepts in the form of heteropolar junctions. A key to realize such structures is an appropriate buffer-layer design that, in the past, has been developed by empiricism. GaN or ZnO on sapphire are prominent examples for that. Understanding the basic processes that mediate polarity, however, is still an unsolved problem. In this work, we study the structure of buffer layers for group-III nitrides on sapphire by transmission electron microscopy as an example. We show that it is the conversion of the sapphire surface into a rhombohedral aluminum-oxynitride layer that converts the initial N-polar surface to Al polarity. With the various AlxOyNz phases of the pseudobinary Al2O3-AlN system and their tolerance against intrinsic defects, typical for oxides, a smooth transition between the octahedrally coordinated Al in the sapphire and the tetrahedrally coordinated Al in AlN becomes feasible. Based on these results, we discuss the consequences for achieving either polarity and shed light on widely applied concepts in the field of group-III nitrides like nitridation and low-temperature buffer layers

Evidence of a second-order Peierls-driven metal-insulator transition in crystalline NbO2

The metal-insulator transition of NbO2 is thought to be important for the functioning of recent niobium oxide-based memristor devices, and is often described as a Mott transition in these contexts. However, the actual transition mechanism remains unclear, as current devices actually employ electroformed NbOx that may be inherently different to crystalline NbO2. We report on our synchrotron x-ray spectroscopy and density-functional-theory study of crystalline, epitaxial NbO2 thin films grown by pulsed laser deposition and molecular beam epitaxy across the metal-insulator transition at ~810⁰C. The observed spectral changes reveal a second-order Peierls transition driven by a weakening of Nb dimerization without significant electron correlations, further supported by our density-functional-theory modeling. Our findings indicate that employing crystalline NbO2 as an active layer in memristor devices may facilitate analog control of the resistivity, whereby Joule-heating can modulate Nb-Nb dimer distance and consequently control the opening of a pseudogap

Transmission electron microscopy investigation of growth and strain relaxation mechanisms in GaN (0001) films grown on silicon (111) substrates

In dieser Arbeit untersuchen wir die grundlegenden Wachstums- und Relaxationsprozesse, die es erlauben den Verzerrungszustand von GaN (0001) beim Wachstum auf Silizium (111) Substraten einzustellen und die resultierende Dichte an Durchstoßversetzungen zu reduzieren. Zu deren Analyse werden GaN (0001) Schichten, die mittels metallorganischer Gasphasenepitaxy abgeschieden worden sind, hauptsächlich mit transmissionselekronenmikroskopischen Methoden untersucht. Die wesentlichen Erkenntnisse der Arbeit sind: (i) Der Aufbau einer kompressiven Verzerrung von GaN (0001) Filmen mittels AlGaN Zwischenschichten beruht auf einer Asymmetrie der plastischen Relaxation an den beiden Grenzflächen der AlGaN Zwischenschicht. Fehlpassungsversetzungen bilden sich zwar an beiden Grenzflächen aus, jedoch ist der mittlere Abstand zwischen Versetzungslinien an der unteren Grenzfläche kleiner, als an der oberen. (ii) Plastische Relaxation von verzerrten (0001) Wurtzit Schichten erfolgt im Wesentlichen durch Bildung von a-Typ Fehlpassungsversetzungen im 1/3 |{0001} Gleitsystem. Diese bilden sich aber nur dann, wenn die verzerrten Schichten eine 3-D Morphologie aufweisen. Eine quantitative Modellierung dieses Prozesses zeigt, dass die kritische Schichtdicke für das Einsetzen der plastischen Relaxation wesentlich vom Wachstumsmodus bestimmt wird. (iii) Eine Silizium Delta-Dotierung der GaN (0001) Oberfläche führt zum Wachstum einer kohärenten Sub-Monolage SiGaN3, die eine periodisch Anordnung von Silizium- und Galliumatomen, sowie Galliumvakanzen aufweist. Da das Wachstum von GaN direkt auf der SiGaN3-Monolage unterdrückt ist, tritt ein Übergang zu 3-D Inselwachstum auf, das zunächst ausschließlich in Löchern der SiGaN3-Monolage anfängt. Eine hohe Konzentration von Silizium auf der GaN (0001) Oberfläche wirkt also als Anti-Surfactant beim epitaktischen Wachstum von GaN. Rechnungen mittels der Dichtefunktionaltheorie liefern Erklärungen für das beobachtete Wachstumsverhalten.In this work we study the basic growth and relaxation processes that are used for strain and dislocation engineering in the growth of GaN (0001) films on silicon (111) substrates. To analyse these processes, samples, grown by metalorganic vapour phase epitaxy were investigate by means of transmission electron microscopy. Our investigations have revealed the following main results: (i) Strain engineering and build-up of compressive strain in GaN (0001) films by means of AlGaN interlayer is based on an asymmetry in plastic relaxation between the two interfaces of the AlGaN interlayer. Although misfit dislocation networks form at both interfaces of the interlayer, the average spacing of dislocation lines at the lower interface is smaller than that at the upper one. (ii) Plastic relaxation of strained (0001) wurtzite films is caused mainly by formation of a-type misfit dislocations in the 1/3 |{0001} slip-system. These a-type misfit dislocations form once the strained films undergo a transition to a 3-D surface morphology, e.g. by island growth or cracking. Quantitative modelling of this process reveals that the critical thickness for nucleation of a-type misfit dislocations depends next to the lattice mismatch mainly on the growth mode of the film. (iii) Silicon delta-doping of the GaN (0001) surface leads to the growth of a coherent sub-monolayer of SiGaN3 that shows a periodic arrangement of silicon and gallium atoms and gallium vacancies. Since growth of thick GaN layers directly on top of the SiGaN3-monolayer is inhibited a transition towards 3-D island growth occurs, whereby GaN islands exclusively nucleate at openings in the SiGaN3-monolayer. A high concentration of silicon on the GaN (0001) surface thus acts as an anti-surfactant in the epitaxial growth of GaN. Our density functional theory calculations provide an explanation for both the self-limited growth of the SiGaN3-monolayer, as well as for the blocking of GaN growth on top of the SiGaN3-monolayer

Verbundprojekt: Effiziente, kostengünstige InGaN-Lichtquellen auf Silizium-Substraten für die Allgemeinbeleuchtung, Teilvorhaben: Elektronenmikroskopische Charakterisierung und Modellierung von Versetzungsprozessen von InGaN-Lichtquellen auf Si-Substraten : Schlussbericht ; Laufzeit des Vorhabens: 01.02.2009 - 31.01.2012

[no abstract available

Heteroepitaxial Growth of T-Nb₂O₅ on SrTiO₃

There is a growing interest in exploiting the functional properties of niobium oxides in general and of the T-Nb2O5 polymorph in particular. Fundamental investigations of the properties of niobium oxides are, however, hindered by the availability of materials with sufficient structural perfection. It is expected that high-quality T-Nb2O5 can be made using heteroepitaxial growth. Here, we investigated the epitaxial growth of T-Nb2O5 on a prototype perovskite oxide, SrTiO3. Even though there exists a reasonable lattice mismatch in one crystallographic direction, these materials have a significant difference in crystal structure: SrTiO3 is cubic, whereas T-Nb2O5 is orthorhombic. It is found that this difference in symmetry results in the formation of domains that have the T-Nb2O5 c-axis aligned with the SrTiO3 <001>s in-plane directions. Hence, the number of domain orientations is four and two for the growth on (100)s- and (110)s-oriented substrates, respectively. Interestingly, the out-of-plane growth direction remains the same for both substrate orientations, suggesting a weak interfacial coupling between the two materials. Despite challenges associated with the heteroepitaxial growth of T-Nb2O5, the T-Nb2O5 films presented in this paper are a significant improvement in terms of structural quality compared to their polycrystalline counterparts