11 research outputs found

    Quantification of the pile-up effect for improving inverse mechanical analysis by means of nanoindentation

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    This paper deals with the identification of elastic-plastic material properties by means of nanoindentation. A dimensional analysis leads to the identification of a specific parameter based on the estimation of the pile-up effect. This parameter may be used in an inverse analysis. Theoretical aspects and experimental issues are discussed

    Parametric identification of elastic-plastic constitutive laws using spherical indentation

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    In this paper we present a methodology to characterize elastic-plastic constitutive law of metallic materials using spherical indentation tests and parametric identification coupled with finite elements model simulation. This procedure was applied to identify aluminium, copper and titanium mechanical properties and the identified models show difference that do not exceed 10% with experimental uniaxial tensile tests results. A sensitivity study according to a 2^k Design of Experience (DoE) was achieved to determine which data that can be extracted from pile-up is the most relevant to use in order to enhance the identification procedure. It appears that the maximum pile-up height seems to be the best suited for this purpose

    Validation of mechanical damage monitoring on aluminium freestanding thin films using electrical measurements

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    This paper describes a new technique allowing the monitoring of damage in metallic freestanding thin films during micro-tensile test by using electrical characterization. After a presentation of the set-up, results obtained on aluminium thin coatings by using two calculation methods for damage variable are presented and commented

    A comparative study of microscratch and microtensile adhesion tests for nickel coatings on various substrates

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    The present paper first focuses on discussing application ranges for the scratch test and the microtensile test. For that purpose, both have been implemented on the same nickel coating plated on several substrates, in particular a PCB, which are expected to have different adhesion behaviors. Afterward, correlations are highlighted between these two types of adhesion tests

    Methodology to Analyze Failure Mechanisms of Ohmic Contacts on MEMS Switches

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    International audienceThis paper demonstrates the efficiency of a new methodology using a commercial nanoindenter coupling with electrical measurement on test vehicles specially designed to investigate the micro contact reliability. This study examines the response of gold contacts with 5 μm² square bumps under various levels of current flowing through contact asperities. Contact temperature rising is observed leading to shifts of the mechanical properties of contact material, modifications of the contact topology and a diminution of the time dependence creep effect. The data provides a better understanding of micro-scale contact physics especially failure mechanisms due to the heating of the contact on MEMS switches

    Electromechanical study of polyurethane films with carbon black nanoparticles for MEMS actuators

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    International audiencePure polyurethane and nanocomposite carbon black (CB) polyurethane solutions were deposited by spin-coating on a silicon substrate using gold as the adhesion layer and electrode. Different test structures were achieved for electrical and mechanical characterizations. The incorporation of CB nanoparticles in the polyurethane matrix has a significant influence on the dielectric permittivity of the material with an increase of about one third of its value. The Young's modulus of PU and nanocomposite PU films was determined by different characterization methods. Nanoindentation experiments have pointed out a Young's modulus gradient through the film thickness. By performing mechanical tests (tensile, bulge, point deflection) on freestanding films, an average Young's modulus value of about 30 MPa was found as well as a residual stress value of about 0.4 MPa. However, no influence of the presence of the nanoparticles was found. Finally, several MEMS actuators were realized and characterized. At their fundamental resonance frequency, the actuation of the nanocomposite membranes is more efficient than that of pure polyurethane. However, the time constant of the material seems to provide a major barrier for the development of high-frequency PU-based micro-actuators

    Thermal tests of birefringent plates in molecular adhesion for spatial ultra-violet polarimetry

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    International audienceHigh-resolution spectropolarimetry is a technique used to study many astronomical objects including stellar magnetic fields. It has mainly been used on ground for optical and, more recently, infrared (IR) observations. Space mission projects including ultra-violet (UV) high-resolution spectropolarimetry, such as Pollux onboard LUVOIR proposed to NASA, are being studied in Europe under CNES leadership. Bringing a spectropolarimeter into space means that the instrument should be prepared for space environment including temperatures. The UV polarimeter we are considering is composed by a rotating modulator and an analyzer. Both components are made of magnesium fluoride (MgF<SUB>2</SUB>). The modulator is a rotating block of waveplates in molecular adhesion, each plate having its own fast axis. The analyzer is a Wollaston prism, also made with molecular adhesion. MgF<SUB>2 </SUB>being birefringent, the plates and prism are anisotropic and will dilate and retract due to thermal changes differently along their fast and slow axes. Each plate having its own fast axis, the thermal changes will create stress at the interfaces, i.e. at the molecular adhesion between the plates. This study focuses on the most critical part: the plates of the modulator. To demonstrate the resistance of the modulator and increase its technological readiness level (TRL), an optical bench including interferometry has been set at the Paris Observatory. It allows us to observe in real time the state of the molecular adhesion between plates as they are submitted to thermal changes in a vacuum chamber. Additional samples have been tested in a thermal vacuum chamber at CNES. This article describes the modulator using molecular adhesion, the test experiments, and the conclusion of this thermal study. Although molecular adhesion broke in 2 samples during thermal cycling, most samples survived which provides encouraging results for this technique
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