146 research outputs found

    Hafnium Silicate dielectrics fabricated by RF magnetron sputtering.

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    International audienceStructural and composition properties of hafnium silicate layers fabricated by RF magnetron sputtering were studied by means of spectroscopic ellipsometry, X-ray diffraction, transmission electron microscopy and attenuated total reflection infrared spectroscopy with respect to the deposition parameters and postdeposition annealing treatment. The variation of the deposition conditions allows the temperature of amorphous-crystalline phase transformation of pure hafnium oxide layers to be controlled. It is shown that the silicon incorporation in oxide matrix prevents the formation of interfacial silicon oxide layer and plays a major role in the stability of the structure of hafnium based layers remaining an amorphous state upon annealing at 900-950 °C

    Influence of Rare Earth Doping on Microstructure and Luminescence Behaviour of Sodium Sulphate

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    Na2SO4, Na2SO4: Li, and Na2SO4: Li, Eu, Dy phosphors were prepared by using slow evaporation technique followed by subsequent calcination at 400°C for 4 h. Doping with Li+ ion stabilized the thenardite phase of host matrix, while codoping with RE3+ stabilized the phase transformation from stable thenardite to metastable mirabilite crystal structure. The microstructure and morphology were studied by using scanning electron microscopy and transmission electron microscopy. The thermoluminescence studies revealed that isovalent doping of Li+ served as a quencher and addition of codopant introduces the additional trap sites in the host matrix. The room temperature emission spectra of Li-doped, RE3+-codoped, and undoped Na2SO4 were studied under ultraviolet radiation. For pure Na2SO4 the two peaks which appeared are at 364 and 702 nm, respectively. The emission intensities of RE3+-codoped samples increase with increase in dopant concentration

    On the nature of the stretched exponential photoluminescence decay for silicon nanocrystals

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    The influence of hydrogen rate on optical properties of silicon nanocrystals deposited by sputtering method was studied by means of time-resolved photoluminescence spectroscopy as well as transmission and reflection measurements. It was found that photoluminescence decay is strongly non-single exponential and can be described by the stretched exponential function. It was also shown that effective decay rate probability density function may be recovered by means of Stehfest algorithm. Moreover, it was proposed that the observed broadening of obtained decay rate distributions reflects the disorder in the samples

    SiOx/SiNy multilayers for photovoltaic and photonic applications

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    Microstructural, electrical, and optical properties of undoped and Nd3+-doped SiOx/SiNy multilayers fabricated by reactive radio frequency magnetron co-sputtering have been investigated with regard to thermal treatment. This letter demonstrates the advantages of using SiNy as the alternating sublayer instead of SiO2. A high density of silicon nanoclusters of the order 1019 nc/cm3 is achieved in the SiOx sublayers. Enhanced conductivity, emission, and absorption are attained at low thermal budget, which are promising for photovoltaic applications. Furthermore, the enhancement of Nd3+ emission in these multilayers in comparison with the SiOx/SiO2 counterparts offers promising future photonic applications

    Electrical behavior of MIS devices based on Si nanoclusters embedded in SiOxNy and SiO2 films

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    We examined and compared the electrical properties of silica (SiO2) and silicon oxynitride (SiOxNy) layers embedding silicon nanoclusters (Sinc) integrated in metal-insulator-semiconductor (MIS) devices. The technique used for the deposition of such layers is the reactive magnetron sputtering of a pure SiO2 target under a mixture of hydrogen/argon plasma in which nitrogen is incorporated in the case of SiOxNy layer. Al/SiOxNy-Sinc/p-Si and Al/SiO2-Sinc/p-Si devices were fabricated and electrically characterized. Results showed a high rectification ratio (>104) for the SiOxNy-based device and a resistive behavior when nitrogen was not incorporating (SiO2-based device). For rectifier devices, the ideality factor depends on the SiOxNy layer thickness. The conduction mechanisms of both MIS diode structures were studied by analyzing thermal and bias dependences of the carriers transport in relation with the nitrogen content

    Hf-based high-k materials for Si nanocrystal floating gate memories

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    Pure and Si-rich HfO2 layers fabricated by radio frequency sputtering were utilized as alternative tunnel oxide layers for high-k/Si-nanocrystals-SiO2/SiO2 memory structures. The effect of Si incorporation on the properties of Hf-based tunnel layer was investigated. The Si-rich SiO2 active layers were used as charge storage layers, and their properties were studied versus deposition conditions and annealing treatment. The capacitance-voltage measurements were performed to study the charge trapping characteristics of these structures. It was shown that with specific deposition conditions and annealing treatment, a large memory window of about 6.8 V is achievable at a sweeping voltage of ± 6 V, indicating the utility of these stack structures for low-operating-voltage nonvolatile memory devices

    Atomic characterization of Si nanoclusters embedded in SiO2 by atom probe tomography

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    Silicon nanoclusters are of prime interest for new generation of optoelectronic and microelectronics components. Physical properties (light emission, carrier storage...) of systems using such nanoclusters are strongly dependent on nanostructural characteristics. These characteristics (size, composition, distribution, and interface nature) are until now obtained using conventional high-resolution analytic methods, such as high-resolution transmission electron microscopy, EFTEM, or EELS. In this article, a complementary technique, the atom probe tomography, was used for studying a multilayer (ML) system containing silicon clusters. Such a technique and its analysis give information on the structure at the atomic level and allow obtaining complementary information with respect to other techniques. A description of the different steps for such analysis: sample preparation, atom probe analysis, and data treatment are detailed. An atomic scale description of the Si nanoclusters/SiO2 ML will be fully described. This system is composed of 3.8-nm-thick SiO layers and 4-nm-thick SiO2 layers annealed 1 h at 900°C

    Structural and optoelectronical characterization of Si-SiO_2/SiO_2 multilayers with applications in all Si tandem solar cells

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    SiO_2 multilayers with embedded Si nanocrystals (Si-ncs) were investigated as an approach for developing highly efficient all Si tandem solar cells. The nanostructured samples, fabricated by means of a reactive magnetron sputtering, were structurally and optoelectronically characterized using different techniques. High resolution transmission electron microscopy (TEM) and energy filtered images in TEM show a high density of Si-nc with uniform sizes below 4 nm, while electrical characterization indicates high resistance values (10^2 kΩ) of these samples. In order to develop a better understanding of the optoelectronical behavior, photocurrent I-V curves were measured, obtaining variations under "dark" or "illumination" conditions. Recombination lifetimes in the order of tenths of nanoseconds were estimated by applying the transverse pump/probe technique

    Atomic scale investigation of silicon nanowires and nanoclusters

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    In this study, we have performed nanoscale characterization of Si-clusters and Si-nanowires with a laser-assisted tomographic atom probe. Intrinsic and p-type silicon nanowires (SiNWs) are elaborated by chemical vapor deposition method using gold as catalyst, silane as silicon precursor, and diborane as dopant reactant. The concentration and distribution of impurity (gold) and dopant (boron) in SiNW are investigated and discussed. Silicon nanoclusters are produced by thermal annealing of silicon-rich silicon oxide and silica multilayers. In this process, atom probe tomography (APT) provides accurate information on the silicon nanoparticles and the chemistry of the nanolayers
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